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1. 发明授权

US5095053A Microencapsulation method, microelectronic devices made therefrom, and heat curable compositions 失效
标题翻译：微胶囊化方法，由其制成的微电子器件和可热固化组合物
公开(公告)号：US5095053A
公开(公告)日：1992-03-10
申请号：US640678
申请日：1991-01-14
申请人： Erik W. Walles , James V. Crivello , John H. Lupinski
发明人： Erik W. Walles , James V. Crivello , John H. Lupinski
IPC分类号： C08G59/68 , H01B3/40
CPC分类号： H01B3/40 , C08G59/68 , Y10T428/31522
摘要： A method for encapsulating microelectronic devices is provided using a heat curable epoxy composition having a monomeric or polymeric diaryliodonium hexafluoroantimonate salt. Curable compositions are also provided as well as encapsulated microelectronic devices.
摘要翻译：使用具有单体或聚合二芳基碘鎓六氟锑酸盐的热固化环氧组合物提供了一种封装微电子器件的方法。还提供了可固化的组合物以及封装的微电子器件。

2. 发明授权

US5015675A Encapsulation method, microelectronic devices made therefrom, and heat curable compositions based on epoxy resins, diaryliodonium hexafluroantimonate salts and free radical generators 失效
标题翻译：封装方法，由其制成的微电子器件和基于环氧树脂的热固化组合物，二芳基碘鎓六氟锑酸盐和自由基发生剂
公开(公告)号：US5015675A
公开(公告)日：1991-05-14
申请号：US386670
申请日：1989-07-31
申请人： Erik W. Walles , John H. Lupinski , James V. Crivello
发明人： Erik W. Walles , John H. Lupinski , James V. Crivello
IPC分类号： H01L21/56 , C08F4/06 , C08G59/68 , C08K3/36 , H01B3/40 , H01L23/29 , H01L23/31
CPC分类号： H01B3/40 , C08G59/68 , C08K3/36
摘要： A heat curable composition is provided which is useful for encapsulating microelectronic devices using a heat curable epoxy composition having a diaryliodonium hexafluoroantimonate salt as a catalyst in combination with an effective amount of a free radical generating aromatic compound as a cocatalyst.

3. 发明授权

US5064882A Encapsulation method, microelectronic devices made therefrom, and heat curable compositions based on epoxy resins, diarliodonium-hexafluoroantimonate salts and free radical generators 失效
标题翻译：封装方法，由其制成的微电子器件和基于环氧树脂的热固化组合物，二碘鎓六氟锑酸盐和自由基发生剂
公开(公告)号：US5064882A
公开(公告)日：1991-11-12
申请号：US645778
申请日：1991-01-25
申请人： Erik W. Walles , John H. Lupinski , James V. Crivello
发明人： Erik W. Walles , John H. Lupinski , James V. Crivello
IPC分类号： C08G59/68 , C08K3/36 , H01B3/40
CPC分类号： H01B3/40 , C08G59/68 , C08K3/36
摘要： A heat curable composition is provided which is useful for encapsulating microelectronic devices using a heat curable epoxy composition having a diaryliodonium hexafluoroantimonate salt as a catalyst in combination with an effective amount of a free radical generating aromatic compound as a cocatalyst.
摘要翻译：提供了一种热固化性组合物，其可用于使用具有二芳基碘鎓六氟锑酸盐作为催化剂的热固化性环氧组合物与有效量的产生自由基的芳族化合物作为助催化剂组合来封装微电子器件。

4. 发明授权

US4842800A Method of encapsulating electronic devices 失效
标题翻译：封装电子设备的方法
公开(公告)号：US4842800A
公开(公告)日：1989-06-27
申请号：US103153
申请日：1987-10-01
申请人： Erik W. Walles , James V. Crivello , John H. Lupinski
发明人： Erik W. Walles , James V. Crivello , John H. Lupinski
IPC分类号： C08G59/00 , C08G59/68 , C08K3/36 , C08L63/00 , C09K3/10 , H01L21/56 , H01L23/29 , H01L23/31
CPC分类号： H01L23/295 , C08G59/68 , C08K3/36 , H01L21/56 , H01L2924/0002
摘要： A method for encapsulating microelectronic devices is provided using a heat curable epoxy composition having a monomeric or polymeric diaryliodonium hexafluoroantimonate salt. Curable compositions are also provided as well as encapsulated microelectronic devices.

5. 发明授权

US4975319A Printed circuit board from fibers impregnated with epoxy resin mixture, halogenated bisphenol and polyphenylene ether 失效
标题翻译：来自浸渍有环氧树脂混合物，卤化双酚和聚苯醚的纤维的印刷电路板
公开(公告)号：US4975319A
公开(公告)日：1990-12-04
申请号：US332070
申请日：1989-04-03
申请人： Erik W. Walles , John H. Lupinski , Mark Markovitz , Robert E. Colborn , James R. Presley , Michael J. Davis , Michael G. Minnick , Steven J. Kubisen, Jr. , John E. Hallgren , Donald A. Bolon , Victoria J. Eddy , Patricia C. Irwin
发明人： Erik W. Walles , John H. Lupinski , Mark Markovitz , Robert E. Colborn , James R. Presley , Michael J. Davis , Michael G. Minnick , Steven J. Kubisen, Jr. , John E. Hallgren , Donald A. Bolon , Victoria J. Eddy , Patricia C. Irwin
IPC分类号： C08G59/06 , C08G59/38 , C08L63/00 , C08L71/12 , H05K1/03
CPC分类号： H05K1/0373 , C08G59/063 , C08G59/38 , C08L63/00 , C08L71/123 , H05K2201/012 , H05K2203/121 , Y10S428/901 , Y10S428/92 , Y10T428/31518 , Y10T428/31522 , Y10T428/31678 , Y10T442/2566 , Y10T442/2713
摘要： Curable compositions containing a reaction product of at least one bisphenol polyglycidyl ether, at least one epoxidized novolak and at least one brominated bisphenol, in combination with a polyphenylene ether and further components including specific catalysts and hardeners, may be used in the preparation of laminates useful as printed circuit boards and having excellent physical and electrical properties.
摘要翻译：含有至少一种双酚多缩水甘油醚，至少一种环氧化酚醛清漆和至少一种溴化双酚的聚对苯二甲酸乙二醇酯和包括特定催化剂和硬化剂在内的其它组分的反应产物的可固化组合物可用于制备有用的层压材料作为印刷电路板，具有优异的物理和电学性能。

6. 发明授权

US4853423A Curable polyphenylene ether-polyepoxide compositions useful in printed circuit board production 失效
标题翻译：用于印刷电路板生产的可固化聚苯醚 - 聚环氧化物组合物
公开(公告)号：US4853423A
公开(公告)日：1989-08-01
申请号：US219106
申请日：1988-07-14
申请人： Erik W. Walles , John H. Lupinski , Mark Markovitz , Robert E. Colborn , James R. Presley , Michael J. Davis , Michael G. Minnick , Steven J. Kubisen, Jr. , John E. Hallgren , Donald A. Bolon , Victoria J. Eddy , Patricia C. Irwin
发明人： Erik W. Walles , John H. Lupinski , Mark Markovitz , Robert E. Colborn , James R. Presley , Michael J. Davis , Michael G. Minnick , Steven J. Kubisen, Jr. , John E. Hallgren , Donald A. Bolon , Victoria J. Eddy , Patricia C. Irwin
IPC分类号： C08K3/22 , C08G59/00 , C08G59/06 , C08G59/14 , C08G59/38 , C08G59/50 , C08G59/56 , C08G59/62 , C08G59/68 , C08L61/10 , C08L63/00 , C08L71/12 , H05K1/03
CPC分类号： H05K1/0373 , C08G59/063 , C08G59/38 , C08L63/00 , C08L71/123 , H05K2201/012 , H05K2203/121
摘要： Curable compositions containing a reaction product of at least one bisphenol polyglycidyl ether, at least one epoxidized novolak and at least one brominated bisphenol, in combination with a polyphenylene ether and further components including specific catalysts and hardeners, may be used in the preparation of laminates useful as printed circuit boards and having excellent physical and electrical properties.

7. 发明授权

US5096771A Fibers impregnated with epoxy resin mixture, brominated bisphenol and polyphenylene ether 失效
标题翻译：用环氧树脂混合物，溴化双酚和聚苯醚浸渍的纤维
公开(公告)号：US5096771A
公开(公告)日：1992-03-17
申请号：US565082
申请日：1990-08-10
申请人： Erik W. Walles , John H. Lupinski , Mark Markovitz , Robert E. Colborn , James R. Presley , Michael J. Davis , Michael G. Minnick , Steven J. Kubisen, Jr. , John E. Hallgren , Donald A. Bolon , Victoria J. Eddy , Patricia C. Irwin
发明人： Erik W. Walles , John H. Lupinski , Mark Markovitz , Robert E. Colborn , James R. Presley , Michael J. Davis , Michael G. Minnick , Steven J. Kubisen, Jr. , John E. Hallgren , Donald A. Bolon , Victoria J. Eddy , Patricia C. Irwin
IPC分类号： C08G59/06 , C08G59/38 , C08L63/00 , C08L71/12 , H05K1/03
CPC分类号： H05K1/0373 , C08G59/063 , C08G59/38 , C08L63/00 , C08L71/123 , H05K2201/012 , H05K2203/121 , Y10S428/921 , Y10T442/268 , Y10T442/2713 , Y10T442/2992
摘要： Curable compositions containing a reaction product of at least one bisphenol polyglycidyl ether, at least one epoxidized novolak and at least one brominated bisphenol, in combination with a polyphenylene ether and further components including specific catalysts and hardeners, may be used in the preparation of laminates useful as printed circuit boards and having excellent physical and electrical properties.
摘要翻译：含有至少一种双酚多缩水甘油醚，至少一种环氧化酚醛清漆和至少一种溴化双酚的聚对苯二甲酸乙二醇酯和包括特定催化剂和硬化剂在内的其它组分的反应产物的可固化组合物可用于制备有用的层压材料作为印刷电路板，具有优异的物理和电学性能。

8. 发明授权

US5122578A Polyphenylene ether-polyarylene sulfide compositions 失效
标题翻译：聚苯乙烯 - 聚亚烷基硫化物组合物
公开(公告)号：US5122578A
公开(公告)日：1992-06-16
申请号：US511121
申请日：1990-04-19
申请人： Choong Y. Han , Sterling B. Brown , Erik W. Walles , Tohru Takekoshi , Andrew J. Caruso
发明人： Choong Y. Han , Sterling B. Brown , Erik W. Walles , Tohru Takekoshi , Andrew J. Caruso
IPC分类号： C08G65/48 , C08G81/00 , C08L51/04 , C08L53/00 , C08L53/02 , C08L63/00 , C08L67/00 , C08L71/00 , C08L71/12 , C08L75/00
CPC分类号： C08G81/00 , C08G65/485 , C08L71/126 , C08L63/00 , C08L67/00 , C08L71/00 , C08L75/00
摘要： Compatible compositions comprising polyarylene sulfide-polyphenylene ether copolymers are prepared by the reaction of a polyphenylene ether containing epoxy groups, typically an epoxytriazine-capped polyphenylene ether, with a polyarylene sulfide containing epoxide-reactive functional groups, preferably amine groups. It is sometimes advantageous to anneal said compositions or molded articles prepared therefrom.

9. 发明授权

US4405757A Macromolecular complexes of amidocarbonylic water-soluble polymers and square planar platinous and equivalent organometallics 失效
标题翻译：氨基羰基水溶性聚合物和正方形平面铂和等效有机金属的大分子络合物
公开(公告)号：US4405757A
公开(公告)日：1983-09-20
申请号：US75722
申请日：1979-09-14
申请人： Bobby A. Howell , Erik W. Walles
发明人： Bobby A. Howell , Erik W. Walles
IPC分类号： C08F8/42
CPC分类号： C08F8/42
摘要： Unique, valuable and multifariously utile macromolecular complexes are comprised of: (i) non-ionic, amidocarbonylic, water-soluble polymers (and, for some embodimental purposes, the monomeric precursor(s) thereof), including such known materials as (poly)N-vinylpyrrolidone (i.e., "PVP") and/or (poly)N-vinyl-5-methyl-2-oxazolidinone (i.e., "PVO-M") and the hereinafter disclosed like(s) and/or equivalent(s) thereof which, for convenience, may be herein generically identified as "WSP"; and (ii) square planar configured platinous and, for instant applicancy, equivalently metalled organometallic compounds characterized in containing in ligandal inclusion an aromatic moiety from which depends and to which is connected at least a single distinctly polar substituent group (or "handle", as it were), such as an hydroxide (i.e., "--OH"), carboxylic acid (i.e., "--COOH") or sulfonic acid - (i.e., "--SO.sub.3 H") unit and/or equivalents thereof as herein disclosed which, for convenience, may for generic identification be herein called an "SPOM". The WSP:SPOM complex(es) are associated by non-ionic or other bonding attachment in the nature of hydrogen bonding and/or closely related electrostatic interaction between or through and to the polar substituent in the SPOM and the amidocarbonylic unit in the WSP.
摘要翻译：独特的，有价值的和多种多样的大分子复合物包括：（i）非离子型，酰氨基羰基，水溶性聚合物（以及在某些实施方案中，其单体前体），包括诸如（聚） N-乙烯基吡咯烷酮（即“PVP”）和/或（聚）N-乙烯基-5-甲基-2-恶唑烷酮（即“PVO-M”）和下文所公开的类似物和/或等同物），为了方便起见，本文中可以将其一般性地标识为“WSP”; 并且（ii）正方形平面配置的铂，并且为了即时应用，等效金属化的有机金属化合物，其特征在于含有配体包合物，芳族部分从其中依赖并连接至少一个明显极性的取代基（或“处理”，如它是）如本文所公开的，例如氢氧化物（即，“-OH”），羧酸（即“-COOH”）或磺酸 - （即“-SO 3 H”）单元和/ 为了方便起见，通用标识在本文中称为“SPOM”。 WSP：SPOM复合物通过非离子或其他键合附着在氢键的性质和/或与SPOM中的极性取代基和WSP中的酰胺基羰基单元之间或之间的紧密相关的静电相互作用相关联。

10. 发明授权

US4551502A Macromolecular complexes of amidocarbonylic water-soluble polymers and square platinous and equivalent organometallics 失效
标题翻译：氨基羰基水溶性聚合物和方形铂金等效有机金属的大分子络合物
公开(公告)号：US4551502A
公开(公告)日：1985-11-05
申请号：US533516
申请日：1983-09-19
申请人： Bobby A. Howell , Erik W. Walles
发明人： Bobby A. Howell , Erik W. Walles
IPC分类号： C08F8/42
CPC分类号： C08F8/42
摘要： Novel complexes are prepared from water-soluble compounds having at least one amidocarbonylic unit and a square planar organometallic compound.
摘要翻译：由具有至少一个酰氨基羰基单元和正方形平面有机金属化合物的水溶性化合物制备新型络合物。

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