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1. 发明授权

US5095053A Microencapsulation method, microelectronic devices made therefrom, and heat curable compositions 失效
标题翻译：微胶囊化方法，由其制成的微电子器件和可热固化组合物
公开(公告)号：US5095053A
公开(公告)日：1992-03-10
申请号：US640678
申请日：1991-01-14
申请人： Erik W. Walles , James V. Crivello , John H. Lupinski
发明人： Erik W. Walles , James V. Crivello , John H. Lupinski
IPC分类号： C08G59/68 , H01B3/40
CPC分类号： H01B3/40 , C08G59/68 , Y10T428/31522
摘要： A method for encapsulating microelectronic devices is provided using a heat curable epoxy composition having a monomeric or polymeric diaryliodonium hexafluoroantimonate salt. Curable compositions are also provided as well as encapsulated microelectronic devices.
摘要翻译：使用具有单体或聚合二芳基碘鎓六氟锑酸盐的热固化环氧组合物提供了一种封装微电子器件的方法。还提供了可固化的组合物以及封装的微电子器件。

2. 发明授权

US5015675A Encapsulation method, microelectronic devices made therefrom, and heat curable compositions based on epoxy resins, diaryliodonium hexafluroantimonate salts and free radical generators 失效
标题翻译：封装方法，由其制成的微电子器件和基于环氧树脂的热固化组合物，二芳基碘鎓六氟锑酸盐和自由基发生剂
公开(公告)号：US5015675A
公开(公告)日：1991-05-14
申请号：US386670
申请日：1989-07-31
申请人： Erik W. Walles , John H. Lupinski , James V. Crivello
发明人： Erik W. Walles , John H. Lupinski , James V. Crivello
IPC分类号： H01L21/56 , C08F4/06 , C08G59/68 , C08K3/36 , H01B3/40 , H01L23/29 , H01L23/31
CPC分类号： H01B3/40 , C08G59/68 , C08K3/36
摘要： A heat curable composition is provided which is useful for encapsulating microelectronic devices using a heat curable epoxy composition having a diaryliodonium hexafluoroantimonate salt as a catalyst in combination with an effective amount of a free radical generating aromatic compound as a cocatalyst.

3. 发明授权

US5064882A Encapsulation method, microelectronic devices made therefrom, and heat curable compositions based on epoxy resins, diarliodonium-hexafluoroantimonate salts and free radical generators 失效
标题翻译：封装方法，由其制成的微电子器件和基于环氧树脂的热固化组合物，二碘鎓六氟锑酸盐和自由基发生剂
公开(公告)号：US5064882A
公开(公告)日：1991-11-12
申请号：US645778
申请日：1991-01-25
申请人： Erik W. Walles , John H. Lupinski , James V. Crivello
发明人： Erik W. Walles , John H. Lupinski , James V. Crivello
IPC分类号： C08G59/68 , C08K3/36 , H01B3/40
CPC分类号： H01B3/40 , C08G59/68 , C08K3/36
摘要： A heat curable composition is provided which is useful for encapsulating microelectronic devices using a heat curable epoxy composition having a diaryliodonium hexafluoroantimonate salt as a catalyst in combination with an effective amount of a free radical generating aromatic compound as a cocatalyst.
摘要翻译：提供了一种热固化性组合物，其可用于使用具有二芳基碘鎓六氟锑酸盐作为催化剂的热固化性环氧组合物与有效量的产生自由基的芳族化合物作为助催化剂组合来封装微电子器件。

4. 发明授权

US4842800A Method of encapsulating electronic devices 失效
标题翻译：封装电子设备的方法
公开(公告)号：US4842800A
公开(公告)日：1989-06-27
申请号：US103153
申请日：1987-10-01
申请人： Erik W. Walles , James V. Crivello , John H. Lupinski
发明人： Erik W. Walles , James V. Crivello , John H. Lupinski
IPC分类号： C08G59/00 , C08G59/68 , C08K3/36 , C08L63/00 , C09K3/10 , H01L21/56 , H01L23/29 , H01L23/31
CPC分类号： H01L23/295 , C08G59/68 , C08K3/36 , H01L21/56 , H01L2924/0002
摘要： A method for encapsulating microelectronic devices is provided using a heat curable epoxy composition having a monomeric or polymeric diaryliodonium hexafluoroantimonate salt. Curable compositions are also provided as well as encapsulated microelectronic devices.

5. 发明授权

US4975319A Printed circuit board from fibers impregnated with epoxy resin mixture, halogenated bisphenol and polyphenylene ether 失效
标题翻译：来自浸渍有环氧树脂混合物，卤化双酚和聚苯醚的纤维的印刷电路板
公开(公告)号：US4975319A
公开(公告)日：1990-12-04
申请号：US332070
申请日：1989-04-03
申请人： Erik W. Walles , John H. Lupinski , Mark Markovitz , Robert E. Colborn , James R. Presley , Michael J. Davis , Michael G. Minnick , Steven J. Kubisen, Jr. , John E. Hallgren , Donald A. Bolon , Victoria J. Eddy , Patricia C. Irwin
发明人： Erik W. Walles , John H. Lupinski , Mark Markovitz , Robert E. Colborn , James R. Presley , Michael J. Davis , Michael G. Minnick , Steven J. Kubisen, Jr. , John E. Hallgren , Donald A. Bolon , Victoria J. Eddy , Patricia C. Irwin
IPC分类号： C08G59/06 , C08G59/38 , C08L63/00 , C08L71/12 , H05K1/03
CPC分类号： H05K1/0373 , C08G59/063 , C08G59/38 , C08L63/00 , C08L71/123 , H05K2201/012 , H05K2203/121 , Y10S428/901 , Y10S428/92 , Y10T428/31518 , Y10T428/31522 , Y10T428/31678 , Y10T442/2566 , Y10T442/2713
摘要： Curable compositions containing a reaction product of at least one bisphenol polyglycidyl ether, at least one epoxidized novolak and at least one brominated bisphenol, in combination with a polyphenylene ether and further components including specific catalysts and hardeners, may be used in the preparation of laminates useful as printed circuit boards and having excellent physical and electrical properties.
摘要翻译：含有至少一种双酚多缩水甘油醚，至少一种环氧化酚醛清漆和至少一种溴化双酚的聚对苯二甲酸乙二醇酯和包括特定催化剂和硬化剂在内的其它组分的反应产物的可固化组合物可用于制备有用的层压材料作为印刷电路板，具有优异的物理和电学性能。

6. 发明授权

US4853423A Curable polyphenylene ether-polyepoxide compositions useful in printed circuit board production 失效
标题翻译：用于印刷电路板生产的可固化聚苯醚 - 聚环氧化物组合物
公开(公告)号：US4853423A
公开(公告)日：1989-08-01
申请号：US219106
申请日：1988-07-14
申请人： Erik W. Walles , John H. Lupinski , Mark Markovitz , Robert E. Colborn , James R. Presley , Michael J. Davis , Michael G. Minnick , Steven J. Kubisen, Jr. , John E. Hallgren , Donald A. Bolon , Victoria J. Eddy , Patricia C. Irwin
发明人： Erik W. Walles , John H. Lupinski , Mark Markovitz , Robert E. Colborn , James R. Presley , Michael J. Davis , Michael G. Minnick , Steven J. Kubisen, Jr. , John E. Hallgren , Donald A. Bolon , Victoria J. Eddy , Patricia C. Irwin
IPC分类号： C08K3/22 , C08G59/00 , C08G59/06 , C08G59/14 , C08G59/38 , C08G59/50 , C08G59/56 , C08G59/62 , C08G59/68 , C08L61/10 , C08L63/00 , C08L71/12 , H05K1/03
CPC分类号： H05K1/0373 , C08G59/063 , C08G59/38 , C08L63/00 , C08L71/123 , H05K2201/012 , H05K2203/121
摘要： Curable compositions containing a reaction product of at least one bisphenol polyglycidyl ether, at least one epoxidized novolak and at least one brominated bisphenol, in combination with a polyphenylene ether and further components including specific catalysts and hardeners, may be used in the preparation of laminates useful as printed circuit boards and having excellent physical and electrical properties.

7. 发明授权

US5096771A Fibers impregnated with epoxy resin mixture, brominated bisphenol and polyphenylene ether 失效
标题翻译：用环氧树脂混合物，溴化双酚和聚苯醚浸渍的纤维
公开(公告)号：US5096771A
公开(公告)日：1992-03-17
申请号：US565082
申请日：1990-08-10
申请人： Erik W. Walles , John H. Lupinski , Mark Markovitz , Robert E. Colborn , James R. Presley , Michael J. Davis , Michael G. Minnick , Steven J. Kubisen, Jr. , John E. Hallgren , Donald A. Bolon , Victoria J. Eddy , Patricia C. Irwin
发明人： Erik W. Walles , John H. Lupinski , Mark Markovitz , Robert E. Colborn , James R. Presley , Michael J. Davis , Michael G. Minnick , Steven J. Kubisen, Jr. , John E. Hallgren , Donald A. Bolon , Victoria J. Eddy , Patricia C. Irwin
IPC分类号： C08G59/06 , C08G59/38 , C08L63/00 , C08L71/12 , H05K1/03
CPC分类号： H05K1/0373 , C08G59/063 , C08G59/38 , C08L63/00 , C08L71/123 , H05K2201/012 , H05K2203/121 , Y10S428/921 , Y10T442/268 , Y10T442/2713 , Y10T442/2992
摘要： Curable compositions containing a reaction product of at least one bisphenol polyglycidyl ether, at least one epoxidized novolak and at least one brominated bisphenol, in combination with a polyphenylene ether and further components including specific catalysts and hardeners, may be used in the preparation of laminates useful as printed circuit boards and having excellent physical and electrical properties.
摘要翻译：含有至少一种双酚多缩水甘油醚，至少一种环氧化酚醛清漆和至少一种溴化双酚的聚对苯二甲酸乙二醇酯和包括特定催化剂和硬化剂在内的其它组分的反应产物的可固化组合物可用于制备有用的层压材料作为印刷电路板，具有优异的物理和电学性能。

8. 发明授权

US5534602A High temperature polyether imide compositions and method for making 失效
标题翻译：高温聚醚酰亚胺组合物及其制备方法
公开(公告)号：US5534602A
公开(公告)日：1996-07-09
申请号：US47531
申请日：1993-04-19
申请人： John H. Lupinski , Herbert S. Cole, Jr.
发明人： John H. Lupinski , Herbert S. Cole, Jr.
IPC分类号： C08G73/10 , C08L79/08 , H01B3/30 , C08L77/00
CPC分类号： H01B3/306 , C08G73/1064 , C08L79/08
摘要： Polyetherimide compositions are provided having condensed bis (4-aminophenyl) sulfone units, diaminophenylindane units or a mixture thereof. These polyetherimides compositions have been found useful for making high temperature chip adhesives, laminating adhesives and film adhesives for high density interconnects in electronic circuitry.
摘要翻译：提供具有缩合的双（4-氨基苯基）砜单元，二氨基苯基二茚基单元或其混合物的聚醚酰亚胺组合物。已经发现这些聚醚酰亚胺组合物可用于制造用于电子电路中的高密度互连的高温芯片粘合剂，层压粘合剂和薄膜粘合剂。

9. 发明授权

US5204395A Flame retardant polyphenylene ether compositions 失效
标题翻译：阻燃聚苯醚组合物
公开(公告)号：US5204395A
公开(公告)日：1993-04-20
申请号：US805159
申请日：1991-12-11
申请人： John H. Lupinski
发明人： John H. Lupinski
IPC分类号： C08K3/00 , C08K3/22 , C08K9/08 , C08L71/12
CPC分类号： C08K9/08 , C08L71/123
摘要： Flame retardant polyphenylene ether compositions are provided which utilize a silicone fluid treated filler, such as a clay or fumed titanium oxide treated with a polydiorganosiloxane fluid.

10. 发明授权

US4271783A Apparatus for fluidized bed-electrostatic coating of indefinite length substrate 失效
标题翻译：不确定长度衬底的流化床 - 静电涂层装置
公开(公告)号：US4271783A
公开(公告)日：1981-06-09
申请号：US93993
申请日：1979-11-14
申请人： John H. Lupinski , Bernard Gorowitz
发明人： John H. Lupinski , Bernard Gorowitz
IPC分类号： B05C19/02 , H01B13/00 , B05B5/02
CPC分类号： B05C19/025 , H01B13/0033
摘要： An elongate electrical conductor is continuously coated with electrostatically charged powder by passing the conductor upwardly through a tube into the upper portion of a container having a charged fluidized bed of the powder in a lower portion thereof. The tube extends upwardly through the bed and the tube height is adjusted relative to the upper surface of the bed to control the thickness of the powder coating. An array of electrodes having associated switches permits application of uniform coatings to conductors having a variety of shapes. Two or more conductors may be uniformly coated from the same fluidized bed in a container having a baffle which divides the upper portion into two or more compartments and spaced apart tubes extend upwardly into the different compartments.
摘要翻译：通过使导体向上通过管进入具有粉末的带电流化床的容器的上部的细长电导体连续涂覆静电电荷粉末。管向上延伸通过床，并且管高度相对于床的上表面调节以控制粉末涂层的厚度。具有相关开关的电极阵列允许将均匀的涂层施加到具有各种形状的导体上。两个或多个导体可以在具有挡板的容器中从相同的流化床均匀地涂覆，该隔板将上部分成两个或更多个隔室，并且间隔开的管向上延伸到不同的隔室中。

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