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    • 2. 发明授权
    • System and method for situating a disk drive
    • 用于定位磁盘驱动器的系统和方法
    • US06625014B1
    • 2003-09-23
    • US10141461
    • 2002-05-07
    • Sean W. TuckerKristina Lynn MannArlen L. Roesner
    • Sean W. TuckerKristina Lynn MannArlen L. Roesner
    • G06F116
    • G06F1/184G06F1/187
    • A system and method for situating a disk drive is provided. One embodiment comprises a system for situating a disk drive within a chassis. The system comprises a disk drive unit comprising a drive bracket coupled to the disk drive, as well as a lever member movably coupled to the drive bracket. The system further comprises a drive guide coupled to the chassis. There earlier-mentioned lever member is operable to engage the drive guide when the disk drive unit is being situated within the chassis. Furthermore, the system enables the situating of the disk drive unit within the chassis along a plane other than a plane along which a connector of the disk drive mates with a connector disposed within the chassis.
    • 提供了一种用于定位磁盘驱动器的系统和方法。 一个实施例包括用于将盘驱动器置于底盘内的系统。 该系统包括盘驱动单元,该盘驱动单元包括联接到盘驱动器的驱动支架以及可移动地联接到驱动支架的杠杆元件。 该系统还包括联接到底盘的驱动引导件。 当盘驱动单元位于底盘内时,较早提到的杠杆构件可操作以接合驱动引导件。 此外,该系统能够使盘驱动器单元沿着除了盘驱动器的连接器与设置在底盘内的连接器配合的平面之外的平面位于底架内。
    • 4. 发明授权
    • Mechanism for removal of surface mount connectors using heat conduction
through pins
    • 通过引脚通过导热去除表面贴装连接器的机构
    • US06039241A
    • 2000-03-21
    • US62050
    • 1998-04-17
    • Sean W. TuckerMichael R. CowanMark P. Martin
    • Sean W. TuckerMichael R. CowanMark P. Martin
    • B23K1/018H05K3/34B23K3/04B23K5/22
    • H05K3/3494B23K1/018H05K2201/09781H05K2201/10189
    • The inventive mechanism conducts heat through the leads of the connector to the solder connection points, and simultaneously reflows all of the solder on all of the pads. The inventive mechanism comprises a machined aluminum piece that mimics the mating geometry for the connector and couples to the connector as if it were a chip device. The inventive mechanism couples to the connector via heat conducting fins. Heat is transferred to the aluminum piece, and down through the fins and into the internal portion of the connector. The fins contact the internal portion of the connector leads. Thus, heat is transferred from the internal portion of the leads to the exterior portion of the leads, and down to the soldered connection point with the PCB board. Since the fins contact all of the internal leads of the connector, each of the soldered connections is reflowed at approximately the same time, and thus, the connector is then removed from the board.
    • 本发明的机构通过连接器的引线将热量传导到焊接连接点,同时在所有焊盘上回流所有的焊料。 本发明的机构包括加工的铝件,其模拟连接器的配合几何形状并且连接到连接器,就像它是芯片装置一样。 本发明的机构通过导热翅片连接到连接器。 热量传递到铝片,并通过翅片向下并进入连接器的内部。 翅片接触连接器引线的内部。 因此,热量从引线的内部部分转移到引线的外部部分,并且下降到与PCB板焊接的连接点。 由于翅片接触连接器的所有内部引线,所以每个焊接的连接件在大致相同的时间被回流,因此,连接器然后从板上移除。
    • 6. 发明授权
    • Apparatus and method for rackmounting a chassis
    • 用于机架安装机架的装置和方法
    • US06644481B2
    • 2003-11-11
    • US10073478
    • 2002-02-11
    • Ronald P. DeanSean W. Tucker
    • Ronald P. DeanSean W. Tucker
    • A47F700
    • H05K7/1489
    • A system and method for mounting a device into a rack comprises a mounting shelf that is attached to the rack, a first bracket that is attached to a first side of the device, and a second bracket that is attached to a second side of the device, wherein the second side is located opposite to the first side, wherein the first bracket and the second bracket are substantially similar, and wherein the device, with the first bracket and the second bracket attached thereto, is slideably positioned into the mounting shelf and attached to the mounting shelf via the first bracket and the second bracket.
    • 一种用于将设备安装到机架中的系统和方法包括附接到机架的安装架,附接到设备的第一侧的第一托架和附接到设备的第二侧的第二托架 ,其中所述第二侧与所述第一侧相对,其中所述第一支架和所述第二支架基本相似,并且其中所述第一支架和所述第二支架附接到其上的所述装置可滑动地定位在所述安装架中并附接 经由第一支架和第二支架安装到安装架上。
    • 7. 发明授权
    • Actively cooled daughterboard system
    • 主动冷却子板系统
    • US06304442B1
    • 2001-10-16
    • US09607039
    • 2000-06-29
    • Sean W. TuckerArlen L RoesnerDarren B SmithDonald TrotterAndrew D Delano
    • Sean W. TuckerArlen L RoesnerDarren B SmithDonald TrotterAndrew D Delano
    • H05K720
    • H05K7/1431H01L23/467H01L2924/0002H01L2924/00
    • An actively cooled daughterboard system. One more daughterboards are mounted in parallel rows on a motherboard. Each daughterboard is oriented substantially perpendicular to the motherboard, but may optionally be mounted at an oblique angle relative to the motherboard. Each daughterboard has a low-profile thermally-efficient heatsink mounted thereon. A fan shroud partially covers the daughterboards, but has openings in its sides for directing air flow through plural fins on the heatsinks and through a fan mounted to the top of the fan shroud. The inventive daughterboard system enables multiple high heat dissipating daughterboards to be placed closer together than the daughterboard systems of the prior art while still keeping the daughterboards adequately cooled. Moreover, because only a single fan is used to cool all of the daughterboards under the shroud, noise and expense are reduced relative to prior art systems that employed one or more fans per daughterboard.
    • 主动冷却子板系统。 另外还有一个子板在主板上平行排列。 每个子板基本上垂直于母板定向,但是可以可选地以相对于母板的倾斜角度安装。 每个子板具有安装在其上的低剖面热效率散热器。 风扇罩部分地覆盖子板,但是在其侧面具有开口,用于引导空气流过散热器上的多个散热片并通过安装在风扇罩顶部的风扇。 本发明的子板系统使得多个高散热子板比现有技术的子板系统更靠近放置,同时仍保持子板充分冷却。 此外,由于仅使用单个风扇来冷却护罩下的所有子板,相对于采用每个子板的一个或多个风扇的现有技术系统,噪声和费用降低。