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1. 发明授权

US07518236B2 Power circuit package and fabrication method 有权
标题翻译：电源电路封装及制作方法
公开(公告)号：US07518236B2
公开(公告)日：2009-04-14
申请号：US11259992
申请日：2005-10-26
申请人： Eladio Clemente Delgado , Richard Alfred Beaupre
发明人： Eladio Clemente Delgado , Richard Alfred Beaupre
IPC分类号： H01L23/34
CPC分类号： H01L23/057 , H01L23/24 , H01L23/49811 , H01L23/49822 , H01L24/24 , H01L25/072 , H01L25/162 , H01L2224/24137 , H01L2224/32225 , H01L2224/73267 , H01L2224/92144 , H01L2924/01079 , H01L2924/12044 , H01L2924/1305 , H01L2924/15747 , H01L2924/15787 , H01L2924/3011 , H05K1/141 , H05K1/145 , H05K1/147 , H01L2924/00
摘要： A power circuit package includes a base including a substrate, a plurality of interconnect circuit layers over the substrate with each including a substrate insulating layer patterned with substrate electrical interconnects, and via connections extending from a top surface of the substrate to at least one of the substrate electrical interconnects; and a power semiconductor module including power semiconductor devices each including device pads on a top surface of the respective power semiconductor device and backside contacts on a bottom surface of the respective power semiconductor device, the power semiconductor devices being coupled to a membrane structure, the membrane structure including a membrane insulating layer and membrane electrical interconnects over the membrane insulating layer and selectively extending to the device pads, wherein the backside contacts are coupled to selected substrate electrical interconnects or via connections.
摘要翻译：功率电路封装包括基底，其包括基底，在基底上的多个互连电路层，每个包括用衬底电互连图案化的衬底绝缘层，以及经由从衬底的顶表面延伸到至少一个基板电气互连; 以及功率半导体模块，其包括功率半导体器件，每个功率半导体器件在各个功率半导体器件的顶表面上包括器件焊盘，并且在各个功率半导体器件的底表面上具有背面触点，所述功率半导体器件耦合到膜结构，所述膜包括膜绝缘层和膜电绝缘层上的薄膜电互连并且选择性地延伸到器件焊盘的结构，其中背面触点耦合到所选择的衬底电互连或经由连接。

2. 发明授权

US08622754B2 Flexible power connector 有权
标题翻译：柔性电源连接器
公开(公告)号：US08622754B2
公开(公告)日：2014-01-07
申请号：US13194953
申请日：2011-07-31
申请人： Eladio Clemente Delgado , Richard Alfred Beaupre , Brian Lynn Rowden
发明人： Eladio Clemente Delgado , Richard Alfred Beaupre , Brian Lynn Rowden
IPC分类号： H01R12/00
CPC分类号： H01R43/20 , H01R13/5812 , H01R35/02
摘要： A flexible power connector is presented. An embodiment of a flexible power connector includes a stacked structure having one or more insulating strips alternatingly arranged with a plurality of conducting strips, wherein the one or more insulating strips are interposed between the plurality of conducting strips to insulate each conducting strip from the other conducting strip in the stacked structure, and wherein the plurality of conducting strips is disposed parallel and proximate to each other to reduce electrical losses in the stacked structure
摘要翻译：介绍了一种灵活的电源连接器。柔性电源连接器的实施例包括具有交替地布置有多个导电条的一个或多个绝缘条的堆叠结构，其中所述一个或多个绝缘条插入在所述多个导电条之间，以将每个导电条与另一导电并且其中所述多个导电条彼此平行并且彼此靠近设置，以减少所述堆叠结构中的电损耗

3. 发明授权

US08487416B2 Coaxial power module 有权
标题翻译：同轴电源模块
公开(公告)号：US08487416B2
公开(公告)日：2013-07-16
申请号：US13247216
申请日：2011-09-28
申请人： Eladio Clemente Delgado , Arun Virupaksha Gowda , Antonio Caiafa , Brian Lynn Rowden , Ljubisa Dragoljub Stevanovic , Richard Alfred Beaupre
发明人： Eladio Clemente Delgado , Arun Virupaksha Gowda , Antonio Caiafa , Brian Lynn Rowden , Ljubisa Dragoljub Stevanovic , Richard Alfred Beaupre
IPC分类号： H01L23/552 , H01L23/34 , H01L23/04 , H01L23/12 , H05K7/20 , H05K9/00
CPC分类号： H01L23/552 , H01L25/117 , H01L2924/0002 , H01L2924/00
摘要： A power module includes at least one semiconductor die holding structure. Each die holding structure has a substantially cylindrical outer profile and a central axis. Each die holding structure is disposed within a common cylindrical EMI shield. A plurality of semiconductor devices are mounted to each die holding structure to form a substantially symmetric die mounting pattern respect to the central axis of the die holding structure.
摘要翻译：电源模块包括至少一个半导体管芯保持结构。每个模具保持结构具有基本上圆柱形的外部轮廓和中心轴线。每个管芯保持结构设置在共同的圆柱形EMI屏蔽内。多个半导体器件被安装到每个管芯保持结构，以相对于管芯保持结构的中心轴线形成大致对称的管芯安装图案。

4. 发明授权

US08466007B2 Power semiconductor module and fabrication method 有权
标题翻译：功率半导体模块及其制造方法
公开(公告)号：US08466007B2
公开(公告)日：2013-06-18
申请号：US13236748
申请日：2011-09-20
申请人： Eladio Clemente Delgado , Richard Alfred Beaupre , Stephen Daley Arthur , Ernest Wayne Balch , Kevin Matthew Durocher , Paul Alan McConnelee , Raymond Albert Fillion
发明人： Eladio Clemente Delgado , Richard Alfred Beaupre , Stephen Daley Arthur , Ernest Wayne Balch , Kevin Matthew Durocher , Paul Alan McConnelee , Raymond Albert Fillion
IPC分类号： H01L21/50
CPC分类号： H01L25/50 , H01L23/5389 , H01L24/24 , H01L24/29 , H01L24/82 , H01L24/83 , H01L25/072 , H01L25/16 , H01L2224/04105 , H01L2224/2413 , H01L2224/24137 , H01L2224/2518 , H01L2224/2919 , H01L2224/73267 , H01L2224/82039 , H01L2224/82047 , H01L2224/83192 , H01L2224/83801 , H01L2224/8385 , H01L2224/92144 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12044 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/15153 , H01L2924/1517 , H01L2924/15192 , H01L2924/1532 , H01L2924/18162 , H01L2924/00 , H01L2924/01014
摘要： A power semiconductor module includes: an interconnect layer including an electrical conductor patterned on a dielectric layer, the electrical conductor including a power coupling portion having a thickness sufficient to carry power currents and a control coupling portion having a thickness thinner than that of the power coupling portion; and a semiconductor power device physically coupled to the interconnect layer and electrically coupled to the power coupling portion of the electrical conductor.
摘要翻译：功率半导体模块包括：互连层，其包括在电介质层上图案化的电导体，所述电导体包括具有足以承载电力电流的厚度的功率耦合部分和具有比功率耦合的厚度更薄的厚度的控制耦合部分一部分; 以及物理耦合到所述互连层并且电耦合到所述电导体的功率耦合部分的半导体功率器件。

5. 发明授权

US08675379B2 Power converting apparatus having improved electro-thermal characteristics 有权
标题翻译：具有改善的电热特性的电力转换装置
公开(公告)号：US08675379B2
公开(公告)日：2014-03-18
申请号：US13204834
申请日：2011-08-08
申请人： Joseph Lucian Smolenski , Michael Schutten , Eladio Clemente Delgado , Richard Alfred Beaupre
发明人： Joseph Lucian Smolenski , Michael Schutten , Eladio Clemente Delgado , Richard Alfred Beaupre
IPC分类号： H05K7/20 , H02M7/5387
CPC分类号： H01L25/16 , H01L2924/0002 , H02M7/003 , H05K7/1432 , H01L2924/00
摘要： A power-converting apparatus, such as a power module, may include a base plate (16), a first direct current (DC) bus and a second DC bus (22, 24). A power semiconductor component (18, 20) may be electrically coupled to one of the buses, and may be disposed on a substrate (12, 14) physically coupled to the base plate. The power semiconductor component may be made from a high-temperature, wide bandgap material, and the substrate may be exposed to a heat flux based on an operational temperature of the power semiconductor component. At least a first capacitor (50) may be coupled across the first and second DC buses, and at least second and third capacitors (52) may be respectively coupled across respective ones of the first and second buses and an alternating current (AC) return path. Capacitors (50, 52) may each be located inside the power module to establish circuit connections sufficiently proximate to the first power semiconductor component to reduce a formation of parasitic inductances, and further may each be located physically apart from the substrate and thus not exposed to the heat flux.
摘要翻译：诸如功率模块的电力转换装置可以包括基板（16），第一直流（DC）总线和第二DC总线（22,24）。功率半导体部件（18,20）可以电耦合到总线中的一个，并且可以设置在物理耦合到基板的基板（12,14）上。功率半导体部件可以由高温，宽带隙材料制成，并且基板可以基于功率半导体部件的工作温度暴露于热通量。至少第一电容器（50）可以跨越第一和第二DC总线耦合，并且至少第二和第三电容器（52）可以分别耦合在第一和第二总线中的相应的第一和第二总线上，并且交流（AC）返回路径。电容器（50,52）可以各自位于功率模块内部，以建立足够靠近第一功率半导体部件的电路连接，以减少寄生电感的形成，并且还可以分别位于与衬底物理分开的位置，从而不暴露于热通量。

6. 发明申请

US20130075878A1 COAXIAL POWER MODULE 有权
标题翻译：同轴电源模块
公开(公告)号：US20130075878A1
公开(公告)日：2013-03-28
申请号：US13247216
申请日：2011-09-28
申请人： Eladio Clemente Delgado , Arun Virupaksha Gowda , Antonio Caiafa , Brian Lynn Rowden , Ljubisa Dragoljub Stevanovic , Richard Alfred Beaupre
发明人： Eladio Clemente Delgado , Arun Virupaksha Gowda , Antonio Caiafa , Brian Lynn Rowden , Ljubisa Dragoljub Stevanovic , Richard Alfred Beaupre
IPC分类号： H01L23/552
CPC分类号： H01L23/552 , H01L25/117 , H01L2924/0002 , H01L2924/00
摘要： A power module includes at least one semiconductor die holding structure. Each die holding structure has a substantially cylindrical outer profile and a central axis. Each die holding structure is disposed within a common cylindrical EMI shield. A plurality of semiconductor devices are mounted to each die holding structure to form a substantially symmetric die mounting pattern respect to the central axis of the die holding structure.
摘要翻译：电源模块包括至少一个半导体管芯保持结构。每个模具保持结构具有基本上圆柱形的外部轮廓和中心轴线。每个管芯保持结构设置在共同的圆柱形EMI屏蔽内。多个半导体器件被安装到每个管芯保持结构，以相对于管芯保持结构的中心轴线形成大致对称的管芯安装图案。

7. 发明申请

US20110300725A1 Busbar Electrical Power Connector 有权
标题翻译：母线电源连接器
公开(公告)号：US20110300725A1
公开(公告)日：2011-12-08
申请号：US12792967
申请日：2010-06-03
申请人： Eladio Clemente Delgado , Ljubisa Stevanovic , Richard Alfred Beaupre
发明人： Eladio Clemente Delgado , Ljubisa Stevanovic , Richard Alfred Beaupre
IPC分类号： H01R25/00
CPC分类号： H01R24/58 , H01R9/2675 , H01R13/113 , H01R13/187 , H01R2103/00
摘要： A dual pole busbar power connector including opposing elements configured to form a slot configured to receive a dual-pole blade therebetween. The slot extends from busbars to opposing element distal ends. The opposing elements each includes: a first contact extending into the slot from the opposing element; and a second contact extending into the slot from the opposing element and disposed farther from a slot busbar end than the first contact. When the dual-pole blade is inserted in the slot the first contact contacts a respective blade element at a location in the slot more proximate the slot busbar end than a slot distal end.
摘要翻译：一种双极母线电源连接器，包括相对的元件，所述相对元件被配置成形成用于在其间接收双极刀片的槽。槽从母线延伸到相对的元件远端。相对的元件各自包括：从相对元件延伸到槽中的第一接触件; 以及从所述相对元件延伸到所述槽中并且设置成比所述第一接触件更远离所述槽母线端的第二接触。当双极刀片插入槽中时，第一接触件在槽口位置处的相应刀片元件比槽口远端更接近槽母线端。

8. 发明授权

US08049338B2 Power semiconductor module and fabrication method 有权
标题翻译：功率半导体模块及其制造方法
公开(公告)号：US08049338B2
公开(公告)日：2011-11-01
申请号：US11279011
申请日：2006-04-07
申请人： Eladio Clemente Delgado , Richard Alfred Beaupre , Stephen Daley Arthur , Ernest Wayne Balch , Kevin Matthew Durocher , Paul Alan McConnelee , Raymond Albert Fillion
发明人： Eladio Clemente Delgado , Richard Alfred Beaupre , Stephen Daley Arthur , Ernest Wayne Balch , Kevin Matthew Durocher , Paul Alan McConnelee , Raymond Albert Fillion
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： H01L25/50 , H01L23/5389 , H01L24/24 , H01L24/29 , H01L24/82 , H01L24/83 , H01L25/072 , H01L25/16 , H01L2224/04105 , H01L2224/2413 , H01L2224/24137 , H01L2224/2518 , H01L2224/2919 , H01L2224/73267 , H01L2224/82039 , H01L2224/82047 , H01L2224/83192 , H01L2224/83801 , H01L2224/8385 , H01L2224/92144 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12044 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/15153 , H01L2924/1517 , H01L2924/15192 , H01L2924/1532 , H01L2924/18162 , H01L2924/00 , H01L2924/01014
摘要： A power semiconductor module includes: an interconnect layer including an electrical conductor patterned on a dielectric layer, the electrical conductor including a power coupling portion having a thickness sufficient to carry power currents and a control coupling portion having a thickness thinner than that of the power coupling portion; and a semiconductor power device physically coupled to the interconnect layer and electrically coupled to the power coupling portion of the electrical conductor.
摘要翻译：功率半导体模块包括：互连层，其包括在电介质层上图案化的电导体，所述电导体包括具有足以承载电力电流的厚度的功率耦合部分和具有比功率耦合的厚度更薄的厚度的控制耦合部分一部分; 以及物理耦合到所述互连层并且电耦合到所述电导体的功率耦合部分的半导体功率器件。

9. 发明申请

US20110101515A1 POWER MODULE ASSEMBLY WITH REDUCED INDUCTANCE 有权
标题翻译：功率模块组件具有降低的电感
公开(公告)号：US20110101515A1
公开(公告)日：2011-05-05
申请号：US12609400
申请日：2009-10-30
申请人： Richard Alfred Beaupre , Eladio Clemente Delgado , Ljubisa Dragoljub Stevanovic
发明人： Richard Alfred Beaupre , Eladio Clemente Delgado , Ljubisa Dragoljub Stevanovic
IPC分类号： H01L23/538
CPC分类号： H01L24/49 , H01L24/48 , H01L25/072 , H01L2224/48091 , H01L2224/48137 , H01L2224/48472 , H01L2224/4911 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/12032 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15747 , H01L2924/19107 , H01L2924/30107 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A device is provided that includes a first conductive substrate and a second conductive substrate. A first power semiconductor component having a first thickness can be electrically coupled to the first conductive substrate. A second power semiconductor component having a second thickness can be electrically coupled to the second conductive substrate. A positive terminal can also be electrically coupled to the first conductive substrate, while a negative terminal can be electrically coupled to the second power semiconductor component, and an output terminal may be electrically coupled to the first power semiconductor component and the second conductive substrate. The terminals, the power semiconductor components, and the conductive substrates may thereby be incorporated into a common circuit loop, and may together be configured such that a width of the circuit loop in at least one direction is defined by at least one of the first thickness or the second thickness.
摘要翻译：提供了一种包括第一导电衬底和第二导电衬底的器件。具有第一厚度的第一功率半导体部件可以电耦合到第一导电基板。具有第二厚度的第二功率半导体部件可以电耦合到第二导电基板。正端子也可以电耦合到第一导电衬底，而负端子可以电耦合到第二功率半导体部件，并且输出端子可以电耦合到第一功率半导体部件和第二导电衬底。因此，端子，功率半导体部件和导电基板可以并入到公共电路回路中，并且可以一起构造成使得至少一个方向上的电路回路的宽度由第一厚度或第二厚度。

10. 发明申请

US20130029531A1 FLEXIBLE POWER CONNECTOR 有权
标题翻译：柔性电源连接器
公开(公告)号：US20130029531A1
公开(公告)日：2013-01-31
申请号：US13194953
申请日：2011-07-31
申请人： Eladio Clemente Delgado , Richard Alfred Beaupre , Brian Lynn Rowden
发明人： Eladio Clemente Delgado , Richard Alfred Beaupre , Brian Lynn Rowden
IPC分类号： H01R24/28 , H01R43/20
CPC分类号： H01R43/20 , H01R13/5812 , H01R35/02
摘要： A flexible power connector is presented. An embodiment of a flexible power connector includes a stacked structure having one or more insulating strips alternatingly arranged with a plurality of conducting strips, wherein the one or more insulating strips are interposed between the plurality of conducting strips to insulate each conducting strip from the other conducting strip in the stacked structure, and wherein the plurality of conducting strips is disposed parallel and proximate to each other to reduce electrical losses in the stacked structure
摘要翻译：介绍了一种灵活的电源连接器。柔性电源连接器的实施例包括具有交替地布置有多个导电条的一个或多个绝缘条的堆叠结构，其中所述一个或多个绝缘条插入在所述多个导电条之间，以将每个导电条与另一导电并且其中所述多个导电条彼此平行并且彼此靠近设置，以减少所述堆叠结构中的电损耗

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