专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20070015884A1 Epoxy resin additives and epoxy resin compositions 审中-公开
标题翻译：环氧树脂添加剂和环氧树脂组合物
公开(公告)号：US20070015884A1
公开(公告)日：2007-01-18
申请号：US11483587
申请日：2006-07-11
申请人： Akira Yamamoto , Shoji Ichinohe , Eiichi Tabei
发明人： Akira Yamamoto , Shoji Ichinohe , Eiichi Tabei
IPC分类号： C08L63/00 , C08L83/00 , C08G77/04 , B32B27/38
CPC分类号： C08L63/00 , C07F7/0838 , C08G59/306 , C08K5/54 , C08L83/00
摘要： Epoxy-modified low molecular weight silicones are added to epoxy resins for reducing surface tension and improving fluidity.
摘要翻译：将环氧改性的低分子量硅氧烷加入到环氧树脂中以降低表面张力并提高流动性。

2. 发明授权

US07294682B2 Curable silicone resin composition 有权
标题翻译：可固化硅树脂组合物
公开(公告)号：US07294682B2
公开(公告)日：2007-11-13
申请号：US10942837
申请日：2004-09-17
申请人： Tomoyuki Goto , Eiichi Tabei , Akira Yamamoto
发明人： Tomoyuki Goto , Eiichi Tabei , Akira Yamamoto
IPC分类号： G08G77/20
CPC分类号： G03F7/0757 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/70 , C08K5/54 , C08K5/5403 , C08K2201/014 , C08L83/04 , C08L83/00
摘要： A curable silicone resin composition is provided. It includes (A) an aromatic ring-containing hydrocarbon compound containing at least 2 silicon-bonded hydrogen atoms, in which the silicon atoms are bonded to the hydrocarbon skeleton; (B) an organopolysiloxane with a branched or three dimensional network structure, and with a viscosity at 25° C. of at least 1,000 mPa·s, having an average composition formula (1): R1xSiO{(4−x)/2} (1) wherein, R1 independently represent a substituted or unsubstituted monovalent hydrocarbon group, a substituted or unsubstituted hydrocarbyloxy group, or a hydroxyl group, provided from 0.1 to 80 mol % of all the R1 groups are alkenyl groups, and x represents a positive number that satisfies 1≦x
摘要翻译：提供可固化的有机硅树脂组合物。它包括（A）含有至少2个与硅键合的氢原子的含芳环的烃化合物，其中硅原子键合到烃骨架上; （B）具有支链或三维网状结构的有机聚硅氧烷，并且在25℃下的粘度为至少1,000mPa.s，具有平均组成式（1）：<？in-line-formula description =“ （1-x）/ 2）（1）式（1）其中，式中，R 1独立地表示取代或未取代的单价烃基，取代或未取代的烃氧基，或提供0.1〜80摩尔％的全部R 1基团的羟基是烯基，x表示满足1≤x≤2的正数; 和（C）氢化硅烷化反应催化剂。该组合物产生透明的固化产物并显示出优异的硬度和弯曲强度。

3. 发明申请

US20050038221A1 Curable silicone resin composition 有权
标题翻译：可固化硅树脂组合物
公开(公告)号：US20050038221A1
公开(公告)日：2005-02-17
申请号：US10917280
申请日：2004-08-13
申请人： Eiichi Tabei , Akira Yamamoto
发明人： Eiichi Tabei , Akira Yamamoto
IPC分类号： C08G77/50 , C08K3/10 , C08L83/05 , C08L83/07
CPC分类号： C08G77/50 , C08G77/42 , C08L83/10 , C08L83/00
摘要： Provided is a curable silicone resin composition including (A) a siloxane/polycyclic hydrocarbon-based compound containing at least 2 silicon-bonded hydrogen atoms, which is an addition reaction product of (a) a siloxane-based compound with at least 3 silicon-bonded hydrogen atoms, and (b) a polycyclic hydrocarbon with at least 2 addition reactive carbon-carbon double bonds, (B) a siloxane-based compound containing at least 2 silicon-bonded alkenyl groups, and (C) a hydrosilylation reaction catalyst. This composition is useful as a material for optical devices or parts, insulation material for electronic devices or parts, or coating material.
摘要翻译：提供一种可固化的有机硅树脂组合物，其包含（A）含有至少2个与硅键合的氢原子的硅氧烷/多环烃基化合物，其是（a）硅氧烷基化合物与至少3个硅键合氢原子的加成反应产物，和（b）具有至少2个加成反应性碳 - 碳双键的多环烃，（B）含有至少2个与硅键合的烯基的硅氧烷基化合物，和（C）氢化硅烷化反应催化剂。该组合物可用作光学器件或部件的材料，电子器件或部件的绝缘材料或涂层材料。

4. 发明授权

US07291691B2 Curable silicone resin composition 有权
标题翻译：可固化硅树脂组合物
公开(公告)号：US07291691B2
公开(公告)日：2007-11-06
申请号：US10917280
申请日：2004-08-13
申请人： Eiichi Tabei , Akira Yamamoto
发明人： Eiichi Tabei , Akira Yamamoto
IPC分类号： C08G77/12
CPC分类号： C08G77/50 , C08G77/42 , C08L83/10 , C08L83/00
摘要： Provided is a curable silicone resin composition including (A) a siloxane/polycyclic hydrocarbon-based compound containing at least 2 silicon-bonded hydrogen atoms, which is an addition reaction product of (a) a siloxane-based compound with at least 3 silicon-bonded hydrogen atoms, and (b) a polycyclic hydrocarbon with at least 2 addition reactive carbon-carbon double bonds, (B) a siloxane-based compound containing at least 2 silicon-bonded alkenyl groups, and (C) a hydrosilylation reaction catalyst. This composition is useful as a material for optical devices or parts, insulation material for electronic devices or parts, or coating material.
摘要翻译：提供一种可固化的有机硅树脂组合物，其包含（A）含有至少2个与硅键合的氢原子的硅氧烷/多环烃基化合物，其是（a）硅氧烷基化合物与至少3个硅键合氢原子的加成反应产物，和（b）具有至少2个加成反应性碳 - 碳双键的多环烃，（B）含有至少2个与硅键合的烯基的硅氧烷基化合物，和（C）氢化硅烷化反应催化剂。该组合物可用作光学器件或部件的材料，电子器件或部件的绝缘材料或涂层材料。

5. 发明申请

US20050061437A1 Curable silicone resin composition 有权
标题翻译：可固化硅树脂组合物
公开(公告)号：US20050061437A1
公开(公告)日：2005-03-24
申请号：US10942837
申请日：2004-09-17
申请人： Tomoyuki Goto , Eiichi Tabei , Akira Yamamoto
发明人： Tomoyuki Goto , Eiichi Tabei , Akira Yamamoto
IPC分类号： C08L83/07 , C08K5/5419 , C08L83/04 , C08L83/05 , G03F7/075 , C09J1/00
CPC分类号： G03F7/0757 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/70 , C08K5/54 , C08K5/5403 , C08K2201/014 , C08L83/04 , C08L83/00
摘要： A curable silicone resin composition is provided. It includes (A) an aromatic ring-containing hydrocarbon compound containing at least 2 silicon-bonded hydrogen atoms, in which the silicon atoms are bonded to the hydrocarbon skeleton; (B) an organopolysiloxane with a branched or three dimensional network structure, and with a viscosity at 25° C. of at least 1,000 mPa·s, having an average composition formula (1): R1xSiO{(4−x)2} (1) wherein, R1 independently represent a substituted or unsubstituted monovalent hydrocarbon group, a substituted or unsubstituted hydrocarbyloxy group, or a hydroxyl group, provided from 0.1 to 80 mol % of all the R1 groups are alkenyl groups, and x represents a positive number that satisfies 1≦x
摘要翻译：提供可固化的有机硅树脂组合物。它包括（A）含有至少2个与硅键合的氢原子的含芳环的烃化合物，其中硅原子键合到烃骨架上; （B）具有支链或三维网状结构的有机聚硅氧烷，并且在25℃下的粘度为至少1,000mPa.s，具有平均组成式（1）：R 1 x SiO（{ ）2}（1）其中，R 1独立地表示取代或未取代的一价烃基，取代或未取代的烃氧基或羟基，所述R 1基团的全部为0.1〜80摩尔％烯基，x表示满足1 <= x <2的正数; 和（C）氢化硅烷化反应催化剂。该组合物产生透明的固化产物并显示出优异的硬度和弯曲强度。

6. 发明授权

US07452571B2 Method of sealing semiconductor element mounted on gold-plated printed circuit board 有权
标题翻译：密封安装在镀金印刷电路板上的半导体元件的方法
公开(公告)号：US07452571B2
公开(公告)日：2008-11-18
申请号：US11557249
申请日：2006-11-07
申请人： Eiichi Tabei , Hideyoshi Yanagisawa
发明人： Eiichi Tabei , Hideyoshi Yanagisawa
IPC分类号： B05D3/10 , C08G77/12 , C08G77/20 , C08G77/04 , C08G77/00
CPC分类号： C08L83/06 , H01L23/296 , H01L23/3142 , H01L33/56 , H01L2924/0002 , H01L2924/00
摘要： Methods of sealing a semiconductor element are provided. The methods includes the steps of coating a semiconductor element mounted on a gold-plated printed circuit board with a curable silicone resin, and then curing the curable silicone resin. In a method, the gold-plated printed circuit board is subjected to preliminary treatment with a treatment agent including an acid anhydride group-containing alkoxysilane and/or a partial hydrolysis-condensation product thereof In another method, the curable silicone resin includes the treatment agent. The methods yield favorable adhesion upon sealing.
摘要翻译：提供密封半导体元件的方法。所述方法包括以下步骤：用可固化的硅树脂涂覆安装在镀金印刷电路板上的半导体元件，然后固化可固化的硅树脂。在一种方法中，使用包含含酸酐基团的烷氧基硅烷和/或部分水解缩合产物的处理剂对镀金印刷电路板进行预处理。另一种方法中，可固化有机硅树脂包括处理剂。该方法在密封时产生良好的附着力。

7. 发明授权

US07019100B2 Curable silicone resin composition 有权
标题翻译：可固化硅树脂组合物
公开(公告)号：US07019100B2
公开(公告)日：2006-03-28
申请号：US10829282
申请日：2004-04-22
申请人： Eiichi Tabei , Mitsuhiro Takarada
发明人： Eiichi Tabei , Mitsuhiro Takarada
IPC分类号： C08G77/50
CPC分类号： C08G77/52
摘要： A curable silicone resin composition is provided which is useful as a material for optical devices or parts, insulation material for electronic devices or parts, or coating material, and which produces a cured product having high hardness and strength and further having good optical transmission in the short wavelength region. The composition includes (A) an aromatic hydrocarbon compound having at least two hydrogen atoms bonded to silicon atoms with the silicon atoms being bonded to the hydrocarbon skeleton of the aromatic hydrocarbon compound, (B) a cyclic siloxane compound having at least two silicon atom-bonded alkenyl groups, and (C) a hydrosilylation reaction catalyst, or (D) an aromatic hydrocarbon compound having at least two alkenyl groups bonded to silicon atoms with the silicon atoms being bonded to the hydrocarbon skeleton of the aromatic hydrocarbon compound, (E) a cyclic siloxane compound having at least two silicon atom-bonded hydrogen atoms, and (C) a hydrosilylation reaction catalyst.
摘要翻译：提供可用作光学器件或部件的材料，电子器件或部件的绝缘材料或涂层材料的可固化的有机硅树脂组合物，并且其产生具有高硬度和强度的固化产物，并且在短波长区域。该组合物包括（A）具有至少两个与硅原子键合的氢原子的芳族烃化合物，其中硅原子与芳族烃化合物的烃骨架结合，（B）具有至少两个硅原子的环状硅氧烷化合物，（C）氢化硅烷化反应催化剂，或（D）具有至少两个与硅原子键合的烯基与芳族烃化合物的烃骨架键合的芳族烃化合物，（E）具有至少两个与硅原子键合的氢原子的环状硅氧烷化合物，和（C）氢化硅烷化反应催化剂。

8. 发明授权

US6140449A Crosslinkable silicon polymer compositions 失效
标题翻译：可交联硅聚合物组合物
公开(公告)号：US6140449A
公开(公告)日：2000-10-31
申请号：US236589
申请日：1999-01-26
申请人： Shigeru Mori , Eiichi Tabei
发明人： Shigeru Mori , Eiichi Tabei
IPC分类号： C08K5/10 , C08G77/60 , C08K5/14 , C08K5/23 , C08L83/16 , C09D183/16 , C08G77/08
CPC分类号： C08G77/60 , C09D183/16
摘要： A crosslinkable silicon polymer composition is provided comprising (A) a silicon polymer containing Si--Si bonds and Si--H groups and having a Mn of 500-500,000, (B) a polyfunctional aromatic carboxylic acid allyl ester, and (C) an organic peroxide or azo compound. The composition cures into a crosslinked polysilane film which is solvent insoluble, tough, and abrasion resistant.
摘要翻译：提供一种可交联的硅聚合物组合物，其包含（A）包含Si-Si键和Si-H基并具有500-500,000的Mn的硅聚合物，（B）多官能芳族羧酸烯丙基酯和（C）有机过氧化物或偶氮化合物。该组合物固化成溶剂不溶性，韧性和耐磨性的交联聚硅烷膜。

9. 发明授权

US5407987A Polycyclic aromatic group - pendant polysilanes and conductive polymers derived therefrom 失效
标题翻译：多环芳基 - 侧基聚硅烷和由其衍生的导电聚合物
公开(公告)号：US5407987A
公开(公告)日：1995-04-18
申请号：US202627
申请日：1994-02-28
申请人： Motoo Fukushima , Eiichi Tabei , Shigeru Mori
发明人： Motoo Fukushima , Eiichi Tabei , Shigeru Mori
IPC分类号： C08G77/60 , H01B1/12 , C08K5/06
CPC分类号： C08G77/60 , H01B1/12
摘要： Polycyclic aromatic group-pendant polysilanes of the following general formula are described.[(R.sup.1 R.sup.2 Si).sub.k (R.sup.3 R.sup.4 Si).sub.m ].sub.nwherein R.sup.1, R.sup.2, R.sup.3, and R.sup.4 are, respectively, a hydrogen atom or a monovalent hydrocarbon group provided that at least one of R.sup.3 and R.sup.4 is a monovalent hydrocarbon group having a polycyclic aromatic group or a biphenyl group. When the polysilane is doped with an oxidative dopant, the polymer is rendered electrically conductive and has thus wide utility in various fields of photoconductive and electrically conductive materials without involving degradation of the polysilane.
摘要翻译：描述了以下通式的多环芳基 - 侧基聚硅烷。 [（R 1 R 2 Si）k（R 3 R 4 Si）m] n其中R 1，R 2，R 3和R 4分别为氢原子或一价烃基，条件是R 3和R 4中的至少一个为具有多环芳香族的一价烃基组或联苯基。当聚硅烷掺杂有氧化掺杂剂时，聚合物变得具有导电性，因此在光导和导电材料的各个领域中具有广泛的用途，而不涉及聚硅烷的降解。

10. 发明申请

US20080281056A1 CURABLE ORGANOSILICON COMPOSITION AND CURED PRODUCT THEREOF 有权
标题翻译：可固化有机硅组合物及其固化产品
公开(公告)号：US20080281056A1
公开(公告)日：2008-11-13
申请号：US12115821
申请日：2008-05-06
申请人： Eiichi Tabei
发明人： Eiichi Tabei
IPC分类号： C08G77/38
CPC分类号： C08K5/5425 , C08G77/52 , C08K5/0025 , C08K5/5419 , C08K5/549 , C08L83/04 , C08L83/00
摘要： Provided is a curable organosilicon composition comprising (A) a polycyclic hydrocarbon group-containing organosilicon compound, which comprises two hydrogen atoms bonded to silicon atoms within each molecule, and is an addition reaction product of (a) an organosilicon compound having two hydrogen atoms bonded to silicon atoms within each molecule, and (b) a polycyclic hydrocarbon compound having two hydrosilylation reactive carbon-carbon double bonds within each molecule, (B) a siloxane-based compound having two or more alkenyl groups bonded to silicon atoms within each molecule, and (C) a hydrosilylation reaction catalyst. The curable organosilicon composition yields a cured product that has a high degree of hardness and excellent transparency, crack resistance and heat resistance, and is useful as a curable silicone material, an encapsulating material for optical devices such as optical elements, an encapsulating material for other electronic devices such as semiconductor elements, and an electrically insulating coating material.
摘要翻译：本发明提供一种可固化的有机硅组合物，其包含（A）含有多环烃基的有机硅化合物，其包含在每个分子内与硅原子键合的两个氢原子，并且是（a）具有两个氢原子键合的有机硅化合物的加合反应产物（b）在每个分子内具有两个氢化硅烷化反应性碳 - 碳双键的多环烃化合物，（B）在每个分子内具有两个或多个与硅原子键合的烯基的硅氧烷基化合物，和（C）氢化硅烷化反应催化剂。可固化的有机硅组合物产生具有高硬度和优异的透明度，耐裂纹性和耐热性的固化产物，并且可用作可固化的硅酮材料，用于诸如光学元件的光学装置的封装材料，用于其它的封装材料电子器件如半导体元件和电绝缘涂层材料。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式