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    • 3. 发明申请
    • Camera module, holder for use in a camera module, camera system and method of manufacturing a camera module
    • 相机模块,用于相机模块的支架,照相机系统和相机模块的制造方法
    • US20050242410A1
    • 2005-11-03
    • US10521256
    • 2003-07-11
    • Erik GrootAnton Van Arendonk
    • Erik GrootAnton Van Arendonk
    • H04N5/232H04N5/225H04N5/335H04N101/00H01L31/0203
    • H04N5/2254H04N5/2253
    • The invention relates to a camera module 100. The camera module 100 comprises a holder 102, which provides a light-conducting channel 122. Within the light-conducting channel 122 a lens 120 having an optical axis 106 is present. A solid-state image sensor 113 is present near an end 128 of the light-conducting channel 122. The image sensor 113 is provided with an image section 114, which is oriented perpendicularly to the optical axis 106. Near the end 128 of the light-conducting channel, forming part of the holder 102, aligning means 131 are present for aligning the image section 114 with the optical axis 106. In one embodiment of the camera module 100, the inner wall 130 of the holder 102 is substantially rectangular, seen in cross-sectional view in a direction perpendicular to the optical axis 106. Bulges 131 present near the corners of the rectangle form the aligning means. The bulges 131 are provided with L-shaped recesses 129 in which the lateral surfaces 127 of the solid-state image sensor 113 are placed substantially without play. This method of aligning the image section 114 with the optical axis 106 simplifies the manufacture of the camera module 100.
    • 本发明涉及相机模块100。 相机模块100包括保持器102,其提供导光通道122。 在导光通道122内存在具有光轴106的透镜120。 固态图像传感器113存在于导光通道122的端部128附近。 图像传感器113设置有垂直于光轴106定向的图像部分114。 在导光通道的端部128附近形成保持器102的一部分,存在对准装置131用于使图像部分114与光轴106对准。 在相机模块100的一个实施例中,保持器102的内壁130基本上是矩形的,从垂直于光轴106的方向的横截面图中可以看出。 出现在矩形角附近的凸起131形成对准装置。 凸起131设置有L形凹部129,其中固态图像传感器113的侧表面127基本上没有播放。 将图像部分114与光轴106对准的这种方法简化了相机模块100的制造。
    • 4. 发明申请
    • Camera module, camera system and method of manufacturing a camera module
    • 摄像机模块,相机系统和相机模块的制造方法
    • US20060164539A1
    • 2006-07-27
    • US10521250
    • 2003-07-11
    • Anton Van ArendonkNicolaas Van Veen
    • Anton Van ArendonkNicolaas Van Veen
    • H04N5/225
    • H04N5/2254G02B7/02G02B13/001
    • The invention relates to a camera module comprising a holder having a first end arranged for receiving light and a second end arranged for placing an image pickup module for picking up images. The camera module further comprises a lens or a system of lenses, having an optical axis arranged for forming an image on the image pickup module. Near the second end, the holder comprises means for aligning the image pickup module in a plane perpendicular to be optical axis. The aligning means are for instance formed by a recess in the inner wall of the holder near the second end. The image pickup module is placed within the recess substantially without play. This method of aligning the image pickup module simplifies the manufacture of the camera module.
    • 本发明涉及一种相机模块,其包括具有布置成用于接收光的第一端的保持器和布置成放置用于拾取图像的图像拾取模块的第二端。 相机模块还包括透镜或透镜系统,其具有布置成用于在图像拾取模块上形成图像的光轴。 在第二端附近,保持器包括用于在垂直于光轴的平面中对准图像拾取模块的装置。 对准装置例如由靠近第二端的保持器的内壁中的凹部形成。 图像拾取模块基本上没有播放放置在凹部内。 这种对准图像拾取模块的方法简化了相机模块的制造。
    • 5. 发明申请
    • Optoelectronic semiconductor device and method of manufacturing such a device
    • 光电半导体器件及其制造方法
    • US20050258350A1
    • 2005-11-24
    • US10526867
    • 2003-08-11
    • Anton Van Arendonk
    • Anton Van Arendonk
    • H01L27/14H01J3/14H01J5/02H01L27/146H01L29/22H01L33/00H04N5/225H04N5/335
    • H04N5/2257H01L31/0203H01L31/02325H01L2224/05554H01L2224/49175H01L2224/73265H01L2924/181H01L2224/48091H01L2924/00014H01L2924/00012
    • The invention relates to a semiconductor device (10) comprising a semiconductor element (1), particularly a solid-state image sensor (1), comprising a semiconductor body (11) of which one surface comprises an optically active part (1A) and an optically inactive part (1B) within which electrical connection regions (2) of the optoelectronic semiconductor element (1) are present, while a body (3) is present above the optically active area (1A) of the surface of the semiconductor body (11) comprising an optical component (3B). According to the invention the body (3) comprises an optically transparent foil (3) which is present on the optically active part (1A) of the surface of the semiconductor body (11) and which is attached thereto with an optically transparent adhesive layer (4) and in which the optical component (3B) is formed. The device (10) is very stable, compact and easy to manufacture, that is to say in batches. For example a component (3B) such as a lens (3B) may easily be formed by pressing a suitably formed die (13) into the foil (3). A method according to the invention for manufacturing the device according to the invention is cost-effective and easy.
    • 本发明涉及包括半导体元件(1),特别是固态图像传感器(1)的半导体器件(10),其包括半导体本体(11),其中一个表面包括光学活性部分(1A)和 存在光电半导体元件(1)的电连接区域(2)的光学非活性部分(1B),而半导体表面的光学有源区域(1A)上方存在主体(3) 主体(11)包括光学部件(3B)。 根据本发明,本体(3)包括光学透明箔(3),其存在于半导体本体(11)的表面的光学活性部分(1A)上,并且附着有光学透明粘合剂层 (4),并且其中形成光学部件(3B)。 装置(10)非常稳定,紧凑且容易制造,即批量地说。 例如,通过将适当形成的模具(13)压入箔(3)中,可以容易地形成诸如透镜(3B)的部件(3B)。 根据本发明的用于制造根据本发明的装置的方法是成本有效且容易的。
    • 6. 发明申请
    • Image sensor device
    • 图像传感器装置
    • US20050224691A1
    • 2005-10-13
    • US10514287
    • 2003-04-22
    • Anton Van ArendonkNicolaas Van Veen
    • Anton Van ArendonkNicolaas Van Veen
    • H04N5/225G01J1/00
    • H04N5/2256H04N5/2253
    • The present invention relates to a sensor device for sensing an image of an object, wherein a detection means (14) for detecting radiation received from the object is supported by a light-emitting semiconductor means (12) for emitting radiation towards said object during a predetermined operation period of the detection means (14). The detection means (14) can be operated even at low light intensity conditions and at a low power consumption. The detection means (14) may be a two-side illuminated detection means, wherein one side is supported by the light-emitting semiconductor means (12) and the other side is a back-etched side with increased sensitivity. A cheap and very small multi-purpose camera or sensor module can thereby be provided.
    • 本发明涉及用于感测物体的图像的传感器装置,其中用于检测从物体接收的辐射的检测装置(14)由发光半导体装置(12)支持,用于在 检测装置(14)的预定操作周期。 检测装置(14)即使在低光强条件下也能够以低功耗工作。 检测装置(14)可以是双侧照明检测装置,其中一侧由发光半导体装置(12)支撑,另一侧是具有增加的灵敏度的背面蚀刻侧。 由此可以提供便宜且非常小的多用途照相机或传感器模块。