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1. 发明申请

US20060164539A1 Camera module, camera system and method of manufacturing a camera module 审中-公开
标题翻译：摄像机模块，相机系统和相机模块的制造方法
公开(公告)号：US20060164539A1
公开(公告)日：2006-07-27
申请号：US10521250
申请日：2003-07-11
申请人： Anton Van Arendonk , Nicolaas Van Veen
发明人： Anton Van Arendonk , Nicolaas Van Veen
IPC分类号： H04N5/225
CPC分类号： H04N5/2254 , G02B7/02 , G02B13/001
摘要： The invention relates to a camera module comprising a holder having a first end arranged for receiving light and a second end arranged for placing an image pickup module for picking up images. The camera module further comprises a lens or a system of lenses, having an optical axis arranged for forming an image on the image pickup module. Near the second end, the holder comprises means for aligning the image pickup module in a plane perpendicular to be optical axis. The aligning means are for instance formed by a recess in the inner wall of the holder near the second end. The image pickup module is placed within the recess substantially without play. This method of aligning the image pickup module simplifies the manufacture of the camera module.
摘要翻译：本发明涉及一种相机模块，其包括具有布置成用于接收光的第一端的保持器和布置成放置用于拾取图像的图像拾取模块的第二端。相机模块还包括透镜或透镜系统，其具有布置成用于在图像拾取模块上形成图像的光轴。在第二端附近，保持器包括用于在垂直于光轴的平面中对准图像拾取模块的装置。对准装置例如由靠近第二端的保持器的内壁中的凹部形成。图像拾取模块基本上没有播放放置在凹部内。这种对准图像拾取模块的方法简化了相机模块的制造。

2. 发明申请

US20050224691A1 Image sensor device 失效
标题翻译：图像传感器装置
公开(公告)号：US20050224691A1
公开(公告)日：2005-10-13
申请号：US10514287
申请日：2003-04-22
申请人： Anton Van Arendonk , Nicolaas Van Veen
发明人： Anton Van Arendonk , Nicolaas Van Veen
IPC分类号： H04N5/225 , G01J1/00
CPC分类号： H04N5/2256 , H04N5/2253
摘要： The present invention relates to a sensor device for sensing an image of an object, wherein a detection means (14) for detecting radiation received from the object is supported by a light-emitting semiconductor means (12) for emitting radiation towards said object during a predetermined operation period of the detection means (14). The detection means (14) can be operated even at low light intensity conditions and at a low power consumption. The detection means (14) may be a two-side illuminated detection means, wherein one side is supported by the light-emitting semiconductor means (12) and the other side is a back-etched side with increased sensitivity. A cheap and very small multi-purpose camera or sensor module can thereby be provided.
摘要翻译：本发明涉及用于感测物体的图像的传感器装置，其中用于检测从物体接收的辐射的检测装置（14）由发光半导体装置（12）支持，用于在检测装置（14）的预定操作周期。检测装置（14）即使在低光强条件下也能够以低功耗工作。检测装置（14）可以是双侧照明检测装置，其中一侧由发光半导体装置（12）支撑，另一侧是具有增加的灵敏度的背面蚀刻侧。由此可以提供便宜且非常小的多用途照相机或传感器模块。

3. 发明申请

US20050148112A1 Method of manufacturing an electronic device, and electronic device 失效
公开(公告)号：US20050148112A1
公开(公告)日：2005-07-07
申请号：US10510874
申请日：2003-04-08
申请人： Johannus Weekamp , Nicolaas Van Veen
发明人： Johannus Weekamp , Nicolaas Van Veen
IPC分类号： H01L23/12 , H01L21/56 , H01L21/68 , H01L23/31 , H01L23/538 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L21/568 , H01L23/3107 , H01L23/5389 , H01L2224/0401 , H01L2224/04042 , H01L2224/05571 , H01L2224/05573 , H01L2224/131 , H01L2224/16245 , H01L2224/32245 , H01L2224/48247 , H01L2224/73265 , H01L2224/81005 , H01L2224/83005 , H01L2224/85005 , H01L2924/00014 , H01L2924/01005 , H01L2924/01011 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/14 , H01L2924/15311 , H01L2924/30105 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： The invention relates to a method of manufacturing a semiconductor device (10), whereby an electric element (11) is attached on or above a carrier plate (4) which comprises a first layer (5) of a first material and a second layer (2) of a second material which differs from the first, which is electrically conducting, which has a smaller thickness than the first layer (5), and in which a cavity (6) is formed that extends at least to the first layer (5). The element (11) is electrically connected to parts (2) of the carrier plate (4) at first connection regions (1), and an encapsulation is deposited around the element (11) and in the cavity (6). Then so much of the first layer (5) of the carrier plate (4) is removed that the cavity (6) is reached, whereby second connection conductors (2) are formed from the remaining portion of the carrier plate (4). According to the invention, at least one further cavity (7) is formed in a portion of the carrier plate (4) surrounded by the cavity (6) before the encapsulation (3) is deposited, which further cavity (7) becomes at least substantially filled with a portion of the encapsulation (3) during the deposition thereof and, within the second connection regions (2), separates a portion (2A) thereof from the remaining portion (2B) thereof, the smallest dimension of the portion (2A) being chosen to be smaller than the smallest dimension of the remaining portion (2B) of each second connection region (2). The portion (2A) may thus be readily provided with solder (8A) having a smaller thickness than the solder (8B) in the remaining portion of the second connection region (2). This is an advantage, for example in the case of surface mounting of the device (10). Preferably, the first connection regions (1) are connected to the portion (2A) of the connection region (2).

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