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1. 发明授权

US5366852A Methods for treating photoresists 失效
标题翻译：光致抗蚀剂的处理方法
公开(公告)号：US5366852A
公开(公告)日：1994-11-22
申请号：US948022
申请日：1992-09-21
申请人： Edward K. Pavelchek , Peter W. Freeman , John F. Bohland , Susan K. Jones , Bruce W. Dudley
发明人： Edward K. Pavelchek , Peter W. Freeman , John F. Bohland , Susan K. Jones , Bruce W. Dudley
IPC分类号： G03F7/36 , G03F7/40 , G03F7/30
CPC分类号： G03F7/40 , G03F7/36
摘要： The present invention comprises methods for treating photoresists and forming photoresist relief images, including a method comprising providing a photoresist coating having a crosslinked surface layer, treating the photoresist coating with an organometallic material, and developing the photoresist coating to provide a relief image comprising an etch resistant effective amount of organometallic material.
摘要翻译：本发明包括用于处理光致抗蚀剂和形成光致抗蚀剂浮雕图像的方法，包括提供具有交联表面层的光致抗蚀剂涂层，用有机金属材料处理光致抗蚀剂涂层并显影光致抗蚀剂涂层以提供包括蚀刻有效量的有机金属材料。

2. 发明授权

US5479061A Pleated sheet microelectromechanical transducer 失效
标题翻译：褶皱片微机电换能器
公开(公告)号：US5479061A
公开(公告)日：1995-12-26
申请号：US999161
申请日：1992-12-31
申请人： Stephen M. Bobbio , Thomas D. DuBois , Bruce W. Dudley , Susan K. Jones , Mark D. Kellam , Farid M. Tranjan
发明人： Stephen M. Bobbio , Thomas D. DuBois , Bruce W. Dudley , Susan K. Jones , Mark D. Kellam , Farid M. Tranjan
IPC分类号： H02N1/00
CPC分类号： H02N1/006
摘要： An electrically and mechanically robust microelectromechanical transducer is formed of a pleated dielectric sheet having patterned electrical conductors on the opposing faces thereof. The pleats define a plurality of spaced apart walls, with each wall including an electrically conductive portion at one side thereof. Positive and negative voltages, applied to opposite faces of the pleated sheet, cause the walls to move towards one another by electrostatic attraction. The walls can also move away from one another by electrostatic repulsion upon application of appropriate voltages. The microelectromechanical transducer may be fabricated by fabricating a sheet with integral pleats or by forming a "self-pleating" flat sheet which forms pleats after conductor fabrication thereon.
摘要翻译：电和机械鲁棒的微电子机械换能器由在其相对面上具有图案化电导体的折叠电介质片形成。褶皱限定多个间隔开的壁，每个壁在其一侧包括导电部分。施加到打褶片的相对面的正电压和负电压导致壁通过静电吸引而相互移动。在施加适当的电压时，壁也可以通过静电排斥而相互远离。微机电换能器可以通过制造具有整体褶皱的片材或者通过形成在其上制造导体之后形成褶皱的“自打褶”平板来制造。

3. 发明授权

US06472739B1 Encapsulated microelectromechanical (MEMS) devices 有权
标题翻译：封装的微机电（MEMS）器件
公开(公告)号：US06472739B1
公开(公告)日：2002-10-29
申请号：US09441190
申请日：1999-11-15
申请人： Robert L. Wood , Bruce W. Dudley
发明人： Robert L. Wood , Bruce W. Dudley
IPC分类号： H01L2312
CPC分类号： B81C1/00333 , B81C2203/0136
摘要： A method of encapsulating microelectromechanical (MEMS) structures is provided wherein the MEMS structures are formed on a substrate and encapsulated prior to packaging thereof. A sacrificial material is first deposited over the substrate to cover at least a portion of the MEMS structure. An encapsulation material is then deposited over the sacrificial material such that the encapsulation material covers at least a portion of the sacrificial material over the MEMS structure. The sacrificial material is subsequently removed such that the encapsulation material forms a shell spaced apart from and covering the MEMS structure and permits the intended operation of the MEMS structure. Associated MEMS devices fabricated using a method of encapsulating MEMS structures according to embodiments of the present invention are also provided.
摘要翻译：提供了一种封装微机电（MEMS）结构的方法，其中MEMS结构形成在基底上并在其包装之前被封装。牺牲材料首先沉积在衬底上以覆盖MEMS结构的至少一部分。然后将封装材料沉积在牺牲材料上，使得封装材料覆盖MEMS结构上的牺牲材料的至少一部分。随后去除牺牲材料，使得封装材料形成与MEMS结构间隔开并覆盖MEMS结构并允许MEMS结构的预期操作。还提供了使用根据本发明的实施例的封装MEMS结构的方法制造的相关MEMS器件。

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