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    • 1. 发明授权
    • Thin film resonators fabricated on membranes created by front side releasing
    • 薄膜谐振器制造在由前端释放产生的膜上
    • US06355498B1
    • 2002-03-12
    • US09637069
    • 2000-08-11
    • Edward ChanHarold Alexis HugginsJungsang KimHyongsok Soh
    • Edward ChanHarold Alexis HugginsJungsang KimHyongsok Soh
    • H01L2100
    • H03H9/173B81B2201/0271B81C1/00142B81C2201/014H03H3/02H03H2003/021
    • A new bulk resonator may be fabricated by a process that is readily incorporated in the traditional fabrication techniques used in the fabrication of monolithic integrated circuits on a wafer. The resonator is decoupled from the wafer by a cavity etched under the resonator using selective etching through front openings (vias) in a resonator membrane. In a typical structure the resonator is formed over a silicon wafer by first forming a first electrode, coating a piezoelectric layer over both the electrode and the wafer surface and forming a second electrode opposite the first on the surface of the piezoelectric layer. After this structure is complete, a number of vias are etched in the piezoelectric layer exposing the surface under the piezoelectric layer to a selective etching process that selectively attacks the surface below the piezoelectric layer creating a cavity under the resonator.
    • 新的体谐振器可以通过容易地结合在晶片上制造单片集成电路中的传统制造技术中的工艺来制造。 谐振器通过使用谐振膜内的前开口(通孔)进行选择性蚀刻而在谐振器下方蚀刻的腔体与晶片分离。 在典型的结构中,谐振器通过首先形成第一电极而在硅晶片上形成,在电极和晶片表面上涂覆压电层,并形成与压电层表面上的第一电极相对的第二电极。 在该结构完成之后,在将压电层下方的表面暴露的压电层中蚀刻多个通孔至选择性蚀刻工艺,该选择性蚀刻工艺选择性地攻击压电层下方的表面,从而在谐振器下形成空腔。
    • 2. 发明授权
    • MEMS driver circuit arrangement
    • MEMS驱动电路布置
    • US06922499B2
    • 2005-07-26
    • US09911601
    • 2001-07-24
    • Robert Albert BoieJungsang KimHyongsok Soh
    • Robert Albert BoieJungsang KimHyongsok Soh
    • G02B26/08B81B7/00G02B6/35H01L23/02
    • B81B7/0077G02B6/3512G02B6/3556G02B6/357
    • A packaged MEMS device containing the micro mirrors has mounted on it at least two distinct integrated circuit chips, at least one of which contains the low-voltage digital-to-analog converts and at least one of which contains the high-voltage amplifiers. The integrated circuit chips may be mounted directly to the MEMS package, or they may be indirectly mounted thereto, e.g., by being directly mounted to a multi-chip module which is in turn mounted on the package. Thus, the MEMS package is employed in a dual role, 1) that of package for the MEMS device and 2) the role of a backplane in that it contains mounting places and the wires interconnecting the MEMS device and chips or modules containing the low-voltage digital-to-analog converters and the high-voltage amplifiers.
    • 包含微反射镜的封装的MEMS器件已经在其上安装了至少两个不同的集成电路芯片,其至少一个包含低电压数模转换器,并且其中至少一个包含高压放大器。 集成电路芯片可以直接安装到MEMS封装,或者它们可以被间接地安装到MEMS封装上,例如通过直接安装到依次安装在封装上的多芯片模块。 因此,MEMS封装以双重角色使用,1)用于MEMS器件的封装,以及2)背板的作用,因为其包含安装位置,并且将MEMS器件与包含低电容的芯片或模块相互连接的电线, 电压数模转换器和高压放大器。
    • 3. 发明申请
    • MEMS DRIVER CIRCUIT ARRANGEMENT
    • MEMS驱动电路布置
    • US20050111786A1
    • 2005-05-26
    • US09911601
    • 2001-07-24
    • Robert BoieJungsang KimHyongsok Soh
    • Robert BoieJungsang KimHyongsok Soh
    • G02B26/08B81B7/00G02B6/35G02B6/26
    • B81B7/0077G02B6/3512G02B6/3556G02B6/357
    • A packaged MEMS device containing the micro mirrors has mounted on it at least two distinct integrated circuit chips, at least one of which contains the low-voltage digital-to-analog converters and at least one of which contains the high-voltage amplifiers. The integrated circuit chips may be mounted directly to the MEMS package, or they may be indirectly mounted thereto, e.g., by being directly mounted to a multi-chip module which is in turn mounted on the package. Thus, the MEMS package is employed in a dual role, 1) that of package for the MEMS device and 2) the role of a backplane in that it contains mounting places and the wires interconnecting the MEMS device and chips or modules containing the low-voltage digital-to-analog converters and the high-voltage amplifiers.
    • 包含微反射镜的封装的MEMS装置安装在其上至少两个不同的集成电路芯片,其至少一个包含低压数模转换器,并且其中至少一个包含高压放大器。 集成电路芯片可以直接安装到MEMS封装,或者它们可以被间接地安装到MEMS封装上,例如通过直接安装到依次安装在封装上的多芯片模块。 因此,MEMS封装以双重角色使用,1)用于MEMS器件的封装,以及2)背板的作用,因为其包含安装位置,并且将MEMS器件与包含低电容的芯片或模块相互连接的电线, 电压数模转换器和高压放大器。
    • 5. 发明授权
    • High-speed multi-dimensional beam scanning system with angle amplification
    • 具有角度放大的高速多维光束扫描系统
    • US08081364B2
    • 2011-12-20
    • US12324152
    • 2008-11-26
    • Jungsang Kim
    • Jungsang Kim
    • G02B26/10
    • G02B26/101G02B26/0841
    • A beam-steering system having high positional resolution and fast switching speed is disclosed. Embodiments of the beam-steering system comprise a diffraction limited optical system that includes a reflective imager and two controllably rotatable MEMS elements. The optical system is characterized by a folded optical path, wherein light propagating on the path is incident on each MEMS element more than once. Each MEMS element imparts an optical effect, such as angular change, on the output beam. By virtue of the fact that the optical system is multi-bounce optical system, the optical effect at each MEMS element is multiplied by the number of times the light hits that MEMS element.
    • 公开了一种具有高位置分辨率和快速切换速度的光束转向系统。 光束转向系统的实施例包括衍射限制光学系统,其包括反射成像器和两个可控制旋转的MEMS元件。 光学系统的特征在于折叠的光路,其中在路径上传播的光不止一次入射到每个MEMS元件上。 每个MEMS元件在输出光束上施加光学效应,例如角度变化。 由于光学系统是多反射光学系统,每个MEMS元件的光学效应乘以光照射该MEMS元件的次数。
    • 7. 发明授权
    • Method and apparatus for cellular communication over data networks
    • 用于通过数据网络进行蜂窝通信的方法和装置
    • US08194597B2
    • 2012-06-05
    • US13089351
    • 2011-04-19
    • Peretz Moshes FederJungsang KimZhengxiang MaAnatoli OlkhovetsArnold B SiegelTheodore Sizer, IIMichael George Zierdt
    • Peretz Moshes FederJungsang KimZhengxiang MaAnatoli OlkhovetsArnold B SiegelTheodore Sizer, IIMichael George Zierdt
    • H04W4/00
    • H04W4/04H04W28/06H04W84/042H04W88/085
    • Cellular signals or other wireless signals/messages are introduced into a building or to an outside location by transmitting packets corresponding to those signals over a data network and low cost cables to designated locations within the data network. Once the designated packets containing the signals reach the destination, they are then broadcast over the air to a terminal capable of receiving the wireless message. In a first embodiment, an in-building gigabit Ethernet network, such as that currently existing presently in many buildings, is used to distribute radio signals indoors. Instead of transmitting the radio signals over the air from a repeater connected to a base station, coded baseband signals generated by the coding processor (e.g., a CDMA Modem Unit) in the base station are packetized and sent over the Ethernet network to radio processing equipment and antennas distributed throughout the building. The radio processing equipment strips the packet headers from the baseband signal packets so those signals can be broadcast via the antennas to one or more mobile terminals.
    • 蜂窝信号或其他无线信号/消息通过在数据网络上传送与这些信号相对应的数据包和低成本电缆到数据网络中的指定位置而被引入建筑物或外部位置。 一旦包含信号的指定分组到达目的地,则它们然后通过空中广播到能够接收无线消息的终端。 在第一实施例中,使用诸如目前在许多建筑物中当前存在的建筑物内的千兆以太网网络来在室内分配无线电信号。 代替从连接到基站的中继器通过空中传送无线电信号,由基站中的编码处理器(例如,CDMA调制解调器单元)生成的编码基带信号被分组并通过以太网发送到无线电处理设备 和分布在整个建筑物的天线。 无线电处理设备从基带信号分组剥离分组报头,从而可以经由天线将信号广播到一个或多个移动终端。
    • 8. 发明申请
    • Method and apparatus for cellular communication over data networks
    • 用于通过数据网络进行蜂窝通信的方法和装置
    • US20050157675A1
    • 2005-07-21
    • US10884203
    • 2004-06-30
    • Peretz FederJungsang KimZhengxiang MaAnatoli OlkhovetsArnold SiegelTheodore SizerMichael Zierdt
    • Peretz FederJungsang KimZhengxiang MaAnatoli OlkhovetsArnold SiegelTheodore SizerMichael Zierdt
    • H04L12/28H04L12/56H04W4/04H04W28/06H04W84/04H04W88/08H04Q7/20
    • H04W16/26H04W28/06H04W84/042H04W88/085
    • Cellular signals or other wireless signals/messages are introduced into a building or to an outside location by transmitting packets corresponding to those signals over a data network and low cost cables to designated locations within the data network. Once the designated packets containing the signals reach the destination, they are then broadcast over the air to a terminal capable of receiving the wireless message. In a first embodiment, an in-building gigabit Ethernet network, such as that currently existing presently in many buildings, is used to distribute radio signals indoors. Instead of transmitting the radio signals over the air from a repeater connected to a base station, coded baseband signals generated by the coding processor (e.g., a CDMA Modem Unit) in the base station are packetized and sent over the Ethernet network to radio processing equipment and antennas distributed throughout the building. The radio processing equipment strips the packet headers from the baseband signal packets so those signals can be broadcast via the antennas to one or more mobile terminals.
    • 蜂窝信号或其他无线信号/消息通过在数据网络上传送与这些信号相对应的数据包和低成本电缆到数据网络中的指定位置而被引入建筑物或外部位置。 一旦包含信号的指定分组到达目的地,则它们然后通过空中广播到能够接收无线消息的终端。 在第一实施例中,使用诸如目前在许多建筑物中当前存在的建筑物内的千兆以太网网络来在室内分配无线电信号。 代替从连接到基站的中继器通过空中传送无线电信号,由基站中的编码处理器(例如,CDMA调制解调器单元)生成的编码基带信号被分组并通过以太网发送到无线电处理设备 和分布在整个建筑物的天线。 无线电处理设备从基带信号分组剥离分组报头,从而可以经由天线将信号广播到一个或多个移动终端。
    • 9. 发明授权
    • Metamaterial microwave lens
    • 超材料微波镜
    • US08421706B2
    • 2013-04-16
    • US12394563
    • 2009-02-27
    • Jae Seung LeeSerdar H. YonakJungsang KimVinh N. NguyenDavid R. Smith
    • Jae Seung LeeSerdar H. YonakJungsang KimVinh N. NguyenDavid R. Smith
    • H01Q15/02H01P7/00
    • H01Q15/0086H01Q15/02H01Q19/062
    • A metamaterial microwave lens having an array of electronic inductive capacitive cells in which each cell has an electrically conductive pattern which corresponds to incident electromagnetic radiation as a resonator. At least one cell has a first and second electrical sections insulated from each other and each which section has at least two legs. A static capacitor is electrically connected between one leg of the first section of the cell and one leg of the second section of the cell. A MEMS device is electrically disposed between the other legs of the first and second sections of the cell. The MEMS device is movable between at least two positions in response to an electrical bias between the first and second sections of the cell to vary the index of refraction and resonant frequency of the cell.
    • 具有电子感性电容单元阵列的超材料微波透镜,其中每个单元具有对应于作为谐振器的入射电磁辐射的导电图案。 至少一个电池具有彼此绝缘的第一和第二电气部分,并且每个电池部分具有至少两个支腿。 静电电容器电连接在电池的第一部分的一个支腿和电池的第二部分的一个支腿之间。 MEMS器件电气地设置在电池单元的第一和第二部分的另一个支腿之间。 响应于电池的第一和第二部分之间的电偏压,MEMS器件可在至少两个位置之间移动,以改变电池的折射率和谐振频率。