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1. 发明申请

US20070215805A1 Imaging sensor 有权
标题翻译：成像传感器
公开(公告)号：US20070215805A1
公开(公告)日：2007-09-20
申请号：US11378169
申请日：2006-03-17
申请人： Robert Boie , Cristian Bolle
发明人： Robert Boie , Cristian Bolle
IPC分类号： G01J5/00
CPC分类号： G01J5/20 , G01J1/04 , G01J1/044 , G01J1/42 , G01J1/44
摘要： A sensor that is responsive to at least two distinct spectral bands, e.g., infrared radiation and ultraviolet or infrared and visible light makes use of the junction of a diode-based bolometer as a photocell in addition to its temperature dependence for detecting infrared radiation. More specifically the diode bolometer is arranged to work in the conventional manner, in that an electrical characteristic of the diode, e.g., the temperature dependence of its current-voltage (I-V) curve, is used as the basis for measuring temperature, and hence, infrared radiation. Additionally, the same diode may be operated as a photocell to detect radiation that is capable of interacting with the electrons in the junction of the diode. This may be achieved by detecting a change in the operating point of the diode based given its present biasing in response to noninfrared radiation incident upon the diode.
摘要翻译：响应于至少两个不同光谱带（例如红外辐射和紫外线或红外线和可见光）的传感器除了其用于检测红外辐射的温度依赖性之外，还使用基于二极管的测辐射热计作为光电池的结。更具体地说，二极管辐射热计被布置成以常规方式工作，因为二极管的电特性，例如其电流 - 电压（IV）曲线的温度依赖性被用作测量温度的基础，因此，红外辐射。此外，相同的二极管可以作为光电池来操作，以检测能够与二极管的结中的电子相互作用的辐射。这可以通过响应于入射到二极管上的非红外辐射来鉴定其当前偏置来检测二极管的工作点的变化来实现。

2. 发明申请

US20050111786A1 MEMS DRIVER CIRCUIT ARRANGEMENT 有权
标题翻译： MEMS驱动电路布置
公开(公告)号：US20050111786A1
公开(公告)日：2005-05-26
申请号：US09911601
申请日：2001-07-24
申请人： Robert Boie , Jungsang Kim , Hyongsok Soh
发明人： Robert Boie , Jungsang Kim , Hyongsok Soh
IPC分类号： G02B26/08 , B81B7/00 , G02B6/35 , G02B6/26
CPC分类号： B81B7/0077 , G02B6/3512 , G02B6/3556 , G02B6/357
摘要： A packaged MEMS device containing the micro mirrors has mounted on it at least two distinct integrated circuit chips, at least one of which contains the low-voltage digital-to-analog converters and at least one of which contains the high-voltage amplifiers. The integrated circuit chips may be mounted directly to the MEMS package, or they may be indirectly mounted thereto, e.g., by being directly mounted to a multi-chip module which is in turn mounted on the package. Thus, the MEMS package is employed in a dual role, 1) that of package for the MEMS device and 2) the role of a backplane in that it contains mounting places and the wires interconnecting the MEMS device and chips or modules containing the low-voltage digital-to-analog converters and the high-voltage amplifiers.
摘要翻译：包含微反射镜的封装的MEMS装置安装在其上至少两个不同的集成电路芯片，其至少一个包含低压数模转换器，并且其中至少一个包含高压放大器。集成电路芯片可以直接安装到MEMS封装，或者它们可以被间接地安装到MEMS封装上，例如通过直接安装到依次安装在封装上的多芯片模块。因此，MEMS封装以双重角色使用，1）用于MEMS器件的封装，以及2）背板的作用，因为其包含安装位置，并且将MEMS器件与包含低电容的芯片或模块相互连接的电线，电压数模转换器和高压放大器。

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