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1. 发明申请

US20100155935A1 Protective coating for semiconductor substrates 审中-公开
标题翻译：半导体衬底的保护涂层
公开(公告)号：US20100155935A1
公开(公告)日：2010-06-24
申请号：US12317447
申请日：2008-12-23
申请人： Ed Prack , Leonel Arana , Sandeep Razdan
发明人： Ed Prack , Leonel Arana , Sandeep Razdan
IPC分类号： H01L23/10 , H01L21/00
CPC分类号： C23C16/26 , C23C14/0605 , C23C14/46 , H01L23/29 , H01L2924/0002 , H01L2924/00
摘要： Methods for coating a protective material on a semiconductor substrate to protect a back surface thereof from defects are provided, by depositing a diamond-like coating (DLC) material thereon at a low temperature, e.g. between about 150° C. to about 350° C.
摘要翻译：在半导体衬底上涂覆保护材料以保护其背面免受缺陷的方法是通过在低温下沉积类金刚石涂层（DLC）材料来实现的。约150℃至约350℃

2. 发明申请

US20130140014A1 METHODS OF PROCESSING A THERMAL INTERFACE MATERIAL 有权
公开(公告)号：US20130140014A1
公开(公告)日：2013-06-06
申请号：US13754071
申请日：2013-01-30
申请人： Lakshmi Supriya , Jessica A. Weninger , Leonel Arana , Lateef Mustapha
发明人： Lakshmi Supriya , Jessica A. Weninger , Leonel Arana , Lateef Mustapha
IPC分类号： F28F7/00
CPC分类号： F28F7/00 , H01L23/3735 , H01L23/3737 , H01L23/433 , H01L24/30 , H01L24/33 , H01L2224/73253 , H01L2924/01006 , H01L2924/01012 , H01L2924/01033 , H01L2924/01056 , Y10T156/10 , Y10T428/31663
摘要： Methods are disclosed to process a thermal interface material to achieve easy pick and placement of the thermal interface material without lowering thermal performance of a completed semiconductor package. One method involves applying a non-adhesive layer on one or more surfaces of the thermal interface material, interfacing the thermal interface material with one or more components to interface the non-adhesive layer therebetween, and applying heat to alter the non-adhesive layer to increase thermal contact between the thermal interface material and the interfacing component(s).

3. 发明申请

US20070241448A1 ELECTRICALLY-ISOLATED INTERCONNECTS AND SEAL RINGS IN PACKAGES USING A SOLDER PREFORM 审中-公开
标题翻译：使用焊接前提的包装中的电气隔离互连和密封圈
公开(公告)号：US20070241448A1
公开(公告)日：2007-10-18
申请号：US11765969
申请日：2007-06-20
申请人： Leonel Arana , John Heck
发明人： Leonel Arana , John Heck
IPC分类号： H01L23/12
CPC分类号： B23K3/0623 , B23K2101/38 , H01L2224/17
摘要： Embodiments include electronic assemblies and methods for forming electronic assemblies. One embodiment includes a method of forming a MEMS device assembly, including forming an active MEMS region on a substrate. A plurality of bonding pads electrically coupled to the active MEMS region are formed. A seal ring wetting layer is also formed on the substrate, the seal ring wetting layer surrounding the active MEMS region. A single piece solder preform is positioned on the bonding pads and on the seal ring wetting layer, the single piece solder preform including a seal ring region and a bonding pad region. The seal ring region is connected to the bonding pad region by a plurality of solder bridges. The method also includes heating the single piece solder preform to a temperature above the reflow temperature, so that the bridges split and the solder from the preform accumulates on the seal ring wetting layer and the bonding pads. A lid is coupled to the solder. In certain embodiments the lid may include vias having conductive material therein for providing electrical contact to the MEMS device. Other embodiments are described and claimed.
摘要翻译：实施例包括用于形成电子组件的电子组件和方法。一个实施例包括形成MEMS器件组件的方法，包括在衬底上形成有源MEMS区域。形成电耦合到有源MEMS区域的多个接合焊盘。密封环润湿层也形成在衬底上，围绕有源MEMS区域的密封环润湿层。单块焊料预制件位于接合焊盘和密封环润湿层上，单件焊料预制件包括密封环区域和焊盘区域。密封圈区域通过多个焊接桥连接到焊盘区域。该方法还包括将单件焊料预制件加热到高于回流温度的温度，使得桥接器分裂，并且来自预制件的焊料积聚在密封环润湿层和接合焊盘上。盖子与焊料相连。在某些实施例中，盖可以包括其中具有导电材料的通孔，用于提供与MEMS器件的电接触。描述和要求保护其他实施例。

4. 发明授权

US08163598B2 Clipless integrated heat spreader process and materials 有权
标题翻译：无夹杂散热器整体加工和材料
公开(公告)号：US08163598B2
公开(公告)日：2012-04-24
申请号：US13006541
申请日：2011-01-14
申请人： George Kostiew , Raj Bahadur , James Mellody , George Vakanas , Leonel Arana
发明人： George Kostiew , Raj Bahadur , James Mellody , George Vakanas , Leonel Arana
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44
CPC分类号： H01L23/42 , H01L21/50 , H01L23/10 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/01079 , H01L2924/15311 , H01L2924/00
摘要： In one or more embodiments, a method comprising applying thermo compression to a package assembly including a lid, a die, and a package substrate to assemble the package assembly is disclosed. The method may include assembling the package assembly without coupling a biasing mechanism to the lid. Heat may be applied to a bond head coupled with a pick and place tool. Heat may be applied to a bond stage coupled to a carrier for holding the package assembly during processing. An adhesive applied to the lid or package substrate may be allowed to at least partially cure. The method may further include, in an oven, reflowing a thermal interface material (TIM) coupled to the lid and the die, curing the TIM, and/or curing the adhesive, without using clips.
摘要翻译：在一个或多个实施例中，公开了一种方法，其包括将热压力应用于包括盖子，模具和封装基板的封装组件以组装封装组件。该方法可以包括组装封装组件而不将偏压机构耦合到盖子。可以将热量施加到与拾取和放置工具耦合的结合头。可以将热量施加到在加工期间联接到用于保持包装组件的载体的接合台。施加到盖子或封装基底上的粘合剂可以被允许至少部分固化。该方法还可以包括在烘箱中回流耦合到盖子和模具的热界面材料（TIM），固化TIM和/或固化粘合剂，而不使用夹子。

5. 发明申请

US20090298235A1 CLIPLESS INTEGRATED HEAT SPREADER PROCESS AND MATERIALS 有权
标题翻译：无夹紧热交换器过程和材料
公开(公告)号：US20090298235A1
公开(公告)日：2009-12-03
申请号：US12130822
申请日：2008-05-30
申请人： George Kostiew , Raj Bahadur , James Mellody , George Vakanas , Leonel Arana
发明人： George Kostiew , Raj Bahadur , James Mellody , George Vakanas , Leonel Arana
IPC分类号： H01L21/00
CPC分类号： H01L23/42 , H01L21/50 , H01L23/10 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/01079 , H01L2924/15311 , H01L2924/00
摘要： In one or more embodiments, a method comprising applying thermo compression to a package assembly including a lid, a die, and a package substrate to assemble the package assembly is disclosed. The method may include assembling the package assembly without coupling a biasing mechanism to the lid. Heat may be applied to a bond head coupled with a pick and place tool. Heat may be applied to a bond stage coupled to a carrier for holding the package assembly during processing. An adhesive applied to the lid or package substrate may be allowed to at least partially cure. The method may further include, in an oven, reflowing a thermal interface material (TIM) coupled to the lid and the die, curing the TIM, and/or curing the adhesive, without using clips.
摘要翻译：在一个或多个实施例中，公开了一种方法，其包括将热压力应用于包括盖子，模具和封装基板的封装组件以组装封装组件。该方法可以包括组装封装组件而不将偏压机构耦合到盖子。可以将热量施加到与拾取和放置工具耦合的结合头。可以将热量施加到在加工期间联接到用于保持包装组件的载体的接合台。施加到盖子或封装基底上的粘合剂可以被允许至少部分固化。该方法还可以包括在烘箱中回流耦合到盖子和模具的热界面材料（TIM），固化TIM和/或固化粘合剂，而不使用夹子。

6. 发明申请

US20080081386A1 Through-die metal vias with a dispersed phase of graphitic structures of carbon for reduced thermal expansion and increased electrical conductance 有权
标题翻译：具有分散相的石墨结构碳的通孔金属通孔用于减少热膨胀和增加的电导
公开(公告)号：US20080081386A1
公开(公告)日：2008-04-03
申请号：US11541112
申请日：2006-09-29
申请人： Nachiket R. Raravikar , Daewoong Suh , Leonel Arana , James C. Matayabas
发明人： Nachiket R. Raravikar , Daewoong Suh , Leonel Arana , James C. Matayabas
IPC分类号： H01L21/66
CPC分类号： H01L21/76898 , H01L23/53276 , H01L2221/1094 , H01L2924/0002 , H01L2924/00
摘要： A method, apparatus and various material-architectures in an electrically conductive through die via formed of a composite material with a continuous phase of matrix metal and a dispersed phase of graphitic structures of carbon, wherein bulk material properties of the composite material differ from similar bulk material properties of the matrix metal.
摘要翻译：导电通孔模具中的方法，装置和各种材料结构，其由具有基体金属的连续相的复合材料和碳的石墨结构的分散相形成，其中复合材料的散装材料性质与类似体积不同基体金属的材料性质。

7. 发明申请

US20070004171A1 Method of supporting microelectronic wafer during backside processing using carrier having radiation absorbing film thereon 审中-公开
标题翻译：在背面处理中使用其上具有辐射吸收膜的载体支撑微电子晶片的方法
公开(公告)号：US20070004171A1
公开(公告)日：2007-01-04
申请号：US11173857
申请日：2005-06-30
申请人： Leonel Arana , Edward Prack , Sudhakar Kulkarni
发明人： Leonel Arana , Edward Prack , Sudhakar Kulkarni
IPC分类号： H01L21/30 , H01L21/00
CPC分类号： H01L21/67132 , H01L21/67092 , H01L21/67115 , H01L21/6835 , H01L2221/6834 , H01L2221/68363 , H01L2224/16 , H01L2924/01019
摘要： A method of supporting a microelectronic wafer during backside processing. The method comprises: selecting a rigid carrier including a radiation absorbing film thereon, an adhesive, and a radiation source to emit radiation at a predetermined wavelength range; forming a wafer-carrier stack by providing the adhesive between the wafer and the carrier and curing the adhesive to bond the wafer to the carrier; subjecting the wafer in the wafer-carrier stack to backside processing; and removing the carrier and the adhesive from the wafer-carrier stack comprising detackifying the adhesive by irradiating the wafer-carrier stack from a carrier side thereof with radiation from the radiation source. The carrier is adapted to transmit therethrough at least some of the radiation from the radiation source. and the radiation absorbing film is adapted to absorb substantially all radiation transmitted through the carrier and is further adapted to be heated to detackify the adhesive as a result of absorbing said substantially all radiation.
摘要翻译：背面处理中支撑微电子晶片的方法。该方法包括：选择其上包括辐射吸收膜的刚性载体，粘合剂和辐射源以发射预定波长范围的辐射; 通过在晶片和载体之间提供粘合剂并固化粘合剂以将晶片结合到载体上来形成晶片载体堆叠; 对晶片载体叠层中的晶片进行背面处理; 以及从所述晶片载体堆叠中移除所述载体和所述粘合剂，其包括通过用来自所述辐射源的辐射从其载体侧照射所述晶片载体叠层而使所述粘合剂脱胶。载体适于透射来自辐射源的至少一些辐射。并且辐射吸收膜适于吸收透射穿过载体的基本上所有辐射，并且还适于被加热以由于吸收所述基本上所有的辐射而使粘合剂脱胶。

8. 发明申请

US20070000976A1 Electrically-isolated interconnects and seal rings in packages using a solder preform 有权
公开(公告)号：US20070000976A1
公开(公告)日：2007-01-04
申请号：US11174409
申请日：2005-06-30
申请人： Leonel Arana , John Heck
发明人： Leonel Arana , John Heck
IPC分类号： B23K35/12 , B23K31/02
CPC分类号： B23K3/0623 , B23K2101/38 , H01L2224/17
摘要： Embodiments include electronic assemblies and methods for forming electronic assemblies. One embodiment includes a method of forming a MEMS device assembly, including forming an active MEMS region on a substrate. A plurality of bonding pads electrically coupled to the active MEMS region are formed. A seal ring wetting layer is also formed on the substrate, the seal ring wetting layer surrounding the active MEMS region. A single piece solder preform is positioned on the bonding pads and on the seal ring wetting layer, the single piece solder preform including a seal ring region and a bonding pad region. The seal ring region is connected to the bonding pad region by a plurality of solder bridges. The method also includes heating the single piece solder preform to a temperature above the reflow temperature, so that the bridges split and the solder from the preform accumulates on the seal ring wetting layer and the bonding pads. A lid is coupled to the solder. In certain embodiments the lid may include vias having conductive material therein for providing electrical contact to the MEMS device.

9. 发明申请

US20060252354A1 METHODS AND DEVICES FOR SUPPORTING SUBSTRATES USING FLUIDS 失效
标题翻译：用于支持使用流体的基板的方法和装置
公开(公告)号：US20060252354A1
公开(公告)日：2006-11-09
申请号：US11125605
申请日：2005-05-09
申请人： Leonel Arana , Terry Sterrett , Devendra Natekar
发明人： Leonel Arana , Terry Sterrett , Devendra Natekar
IPC分类号： B24B1/00
CPC分类号： B24B7/228 , B24B41/068 , Y10T29/49998
摘要： Electronic device support and processing methods are described. One embodiment includes a method of processing an electronic device including solder bumps extending therefrom. The method includes providing at least one fluid selected from the group consisting of electrorheological fluids and magnorheological fluids on a support structure. The solder bumps extending from the electronic device are positioned in the fluid. The fluid is activated by applying a field selected from the group consisting of an electric field and a magnetic field to the fluid. The activated fluid mechanically holds the electronic device in place. A surface of the electronic device is polished while the electronic device is held in place by the activated fluid. The fluid is deactivated by removing the applied field from the fluid, and the electronic device is separated from the deactivated fluid. Other embodiments are described and claimed.
摘要翻译：描述电子设备支持和处理方法。一个实施例包括处理包括从其延伸的焊锡凸块的电子器件的方法。该方法包括在支撑结构上提供至少一种选自电流变流体和流变流体的流体。从电子设备延伸的焊料凸块位于流体中。通过将从电场和磁场组成的组中选出的场施加到流体来激活流体。活化流体将电子设备机械地保持在适当位置。电子设备的表面被抛光，同时电子设备被活化的流体保持就位。通过从流体中除去所施加的场，使流体失活，并且电子装置与去活化流体分离。描述和要求保护其他实施例。

10. 发明授权

US08383459B2 Methods of processing a thermal interface material 有权
标题翻译：处理热界面材料的方法
公开(公告)号：US08383459B2
公开(公告)日：2013-02-26
申请号：US12145364
申请日：2008-06-24
申请人： Lakshmi Supriya , Jessica Weninger , Leonel Arana , Lateef Mustapha
发明人： Lakshmi Supriya , Jessica Weninger , Leonel Arana , Lateef Mustapha
IPC分类号： H01L21/00
CPC分类号： F28F7/00 , H01L23/3735 , H01L23/3737 , H01L23/433 , H01L24/30 , H01L24/33 , H01L2224/73253 , H01L2924/01006 , H01L2924/01012 , H01L2924/01033 , H01L2924/01056 , Y10T156/10 , Y10T428/31663
摘要： Methods are disclosed to process a thermal interface material to achieve easy pick and placement of the thermal interface material without lowering thermal performance of a completed semiconductor package. One method involves applying a non-adhesive layer on one or more surfaces of the thermal interface material, interfacing the thermal interface material with one or more components to interface the non-adhesive layer therebetween, and applying heat to alter the non-adhesive layer to increase thermal contact between the thermal interface material and the interfacing component(s).
摘要翻译：公开了处理热界面材料以实现热界面材料的容易拾取和放置而不降低完成的半导体封装的热性能的方法。一种方法包括在热界面材料的一个或多个表面上施加非粘合剂层，将热界面材料与一种或多种组分接合，使其间的非粘合剂层相互接触，并施加热量以将非粘合剂层改变为增加热界面材料和界面部件之间的热接触。

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