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1. 发明申请

US20180336301A1 SUBSTRATE PROCESSING APPARATUS AND STORAGE MEDIUM HAVING PROGRAM STORED THEREIN 审中-公开
公开(公告)号：US20180336301A1
公开(公告)日：2018-11-22
申请号：US15982814
申请日：2018-05-17
申请人： EBARA CORPORATION
发明人： Yu ISHII , Keisuke UCHIYAMA , Kunio OISHI , Hiroyuki TAKENAKA
IPC分类号： G06F17/50 , G06F17/18
摘要： A substrate processing apparatus for processing a substrate includes a setting device that sets a plurality of recipe items including operation conditions of the substrate processing apparatus and a recipe generating device that acquires a plurality of recipe models obtained by changing values of the plurality of recipe items and experimenting or simulating a processing result of the substrate and analyzes the plurality of recipe models to generate a recipe, the recipe generating device combining a part or all of the plurality of recipe models to generate the recipe such that a calculation value of a processing result of the substrate by the recipe satisfies a predetermined condition.

2. 发明申请

US20180038008A1 PLATING SYSTEM, A PLATING SYSTEM CONTROL METHOD, AND A STORAGE MEDIUM CONTAINING A PROGRAM FOR CAUSING A COMPUTER TO EXECUTE THE PLATING SYSTEM CONTROL METHOD 审中-公开
公开(公告)号：US20180038008A1
公开(公告)日：2018-02-08
申请号：US15669735
申请日：2017-08-04
申请人： EBARA CORPORATION
发明人： Takashi MITSUYA , Ryuya KOIZUMI , Toshio YOKOYAMA , Masashi SHIMOYAMA , Kunio OISHI
IPC分类号： C25D17/00 , H01L23/00 , H01L21/288 , C25D21/12 , H01L21/768
CPC分类号： C25D17/001 , C25D17/004 , C25D17/008 , C25D17/06 , C25D21/12 , H01L21/2885 , H01L21/6723 , H01L21/67253 , H01L21/76879 , H01L21/76885 , H01L21/76898 , H01L22/26 , H01L24/11 , H01L2224/11462 , H01L2224/117
摘要： A plating system comprising a plating tank for applying plate processing to a substrate, a sensor configured to measure actual plating film thickness of the substrate, and a controller configured to control plating current supplied to the plating tank and plating time for the plate processing of the substrate within the plating tank. The controller is capable of setting target plating film thickness, plating current, and plating time as a plate processing recipe. At least one of the plating current and the plating time is automatically corrected so that the actual plating film thickness and the target plating film thickness become equal to each other, and the result is reflected in the plate processing for the subsequent substrate.

3. 发明申请

US20180203434A1 SCHEDULER, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE CONVEYANCE METHOD 审中-公开
公开(公告)号：US20180203434A1
公开(公告)日：2018-07-19
申请号：US15868753
申请日：2018-01-11
申请人： EBARA CORPORATION
发明人： Koji NONOBE , Takashi MITSUYA , Ryuya KOIZUMI , Kunio OISHI
IPC分类号： G05B19/4155 , H01L21/677 , G05B19/418 , H01L21/67
CPC分类号： G05B19/4155 , G05B19/41865 , G05B2219/32252 , G05B2219/45031 , H01L21/6723 , H01L21/67253 , H01L21/67276 , H01L21/67745 , H01L21/67766 , H01L21/67778 , Y02P90/18 , Y02P90/20 , Y02P90/26 , Y02P90/28
摘要： A calculation amount and calculation time for a substrate conveyance schedule are reduced. A scheduler is provided which is incorporated in a control section of a substrate processing apparatus including a plurality of substrate processing sections that process a substrate, a conveyance section that conveys the substrate, and the control section that controls the conveyance section and the substrate processing sections, and calculates a substrate conveyance schedule. The scheduler includes: a modeling section that models processing conditions, processing time and constraints of the substrate processing apparatus into nodes and edges using a graph network theory, prepares a graph network, and calculates a longest route length to each node; and a calculation section that calculates the substrate conveyance schedule based on the longest route length.

4. 发明申请

US20160130702A1 METHOD OF OPERATING AN ELECTROLESS PLATING APPARATUS 审中-公开
标题翻译：电沉积装置的操作方法
公开(公告)号：US20160130702A1
公开(公告)日：2016-05-12
申请号：US14931946
申请日：2015-11-04
申请人： EBARA CORPORATION
发明人： Yoichi NAKAGAWA , Yoshitaka MUKAIYAMA , Akira SUSAKI , Kunio OISHI
IPC分类号： C23C18/32 , C23C18/16
CPC分类号： C23C18/32 , C23C18/1628 , C23C18/163 , C23C18/1632 , C23C18/1675
摘要： A method of operating an electroless plating apparatus is disclosed. The operating method includes: storing in the electroless plating apparatus an order of priority of the plurality of processes which has been predetermined based on a stability of a processed substrate with respect to pure water; supplying pure water into the holder storage bath when any of the plurality of processing baths malfunctions; determining whether or not a relieving process can be performed, the relieving process being a process of performing a higher-priority process on a substrate; if the relieving process can be performed, performing the relieving process and then immersing the substrate holder holding the substrate in the pure water in the holder storage bath; and if the relieving process cannot be performed, immersing the substrate holder, holding the substrate, in the pure water held in the holder storage bath without performing the relieving process.
摘要翻译：公开了一种操作无电电镀装置的方法。操作方法包括：基于处理过的基板相对于纯水的稳定性，在化学镀设备中存储已经预先确定的多个处理的优先顺序; 当多个处理槽中的任一个发生故障时，将纯水供应到保持器储存槽中; 确定是否可以执行缓解过程，所述缓解过程是在衬底上执行更高优先级的处理的过程; 如果可以执行缓解过程，则执行释放过程，然后将保持基板的基板保持器浸入保持器储存槽中的纯水中; 并且如果不能进行缓和处理，则将保持基板的基板保持件浸入保持在保持器储存槽中的纯水中，而不进行缓和处理。

5. 发明申请

US20200255968A1 SUBSTRATE-HOLDER INSPECTION APPARATUS, PLATING APPARATUS INCLUDING THE SAME, AND APPEARANCE INSPECTION APPARATUS 审中-公开
公开(公告)号：US20200255968A1
公开(公告)日：2020-08-13
申请号：US16315096
申请日：2017-06-07
申请人： EBARA CORPORATION
发明人： Yoshitaka MUKAIYAMA , Toshio YOKOYAMA , Kunio OISHI , Masaaki KIMURA , Jumpei FUJIKATA
IPC分类号： C25D17/06 , C25D17/00 , C25D21/12 , G01N21/88
摘要： An inspection apparatus, a plating apparatus, and an appearance inspection apparatus that are capable of automatically inspecting a substrate holder are provided. An inspection apparatus that includes an electric contact configured to contact a substrate to allow current flow to the substrate and a sealing member configured to seal a surface of the substrate and that inspects a substrate holder holding the substrate is provided. The inspection apparatus includes a stocker installation part in which a stocker configured to house the substrate holder is installed, a cleaning device configured to cleanse the substrate holder, a substrate attaching/detaching device configured to open and close the substrate holder, an appearance inspection apparatus configured to acquire image data or shape data of appearance of at least one of the sealing member and the electric contact, and a conveyer configured to convey the substrate holder among the stocker, the cleaning device, and the appearance inspection apparatus.

6. 发明申请

US20190271970A1 SCHEDULER, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE CONVEYANCE METHOD 审中-公开
公开(公告)号：US20190271970A1
公开(公告)日：2019-09-05
申请号：US16258137
申请日：2019-01-25
申请人： EBARA CORPORATION
发明人： Koji NONOBE , Takashi MITSUYA , Ryuya KOIZUMI , Kunio OISHI
IPC分类号： G05B19/418 , G05B19/4155
摘要： A calculation amount and calculation time for a substrate conveyance schedule are reduced. A scheduler is provided which is incorporated in a control section of a substrate processing apparatus including a plurality of substrate processing sections that process a substrate, a conveyance section that conveys the substrate, and the control section that controls the conveyance section and the substrate processing sections, and calculates a substrate conveyance schedule. The scheduler includes: a modeling section that models processing conditions, processing time and constraints of the substrate processing apparatus into nodes and edges using a graph network theory, prepares a graph network, and calculates a longest route length to each node; and a calculation section that calculates the substrate conveyance schedule based on the longest route length.

7. 发明申请

US20190240799A1 SUBSTRATE PROCESSING CONTROL SYSTEM, SUBSTRATE PROCESSING CONTROL METHOD, AND PROGRAM 审中-公开
公开(公告)号：US20190240799A1
公开(公告)日：2019-08-08
申请号：US16338931
申请日：2017-09-07
申请人： Ebara Corporation
发明人： Koichi TAKEDA , Tsuneo TORIKOSHI , Kunio OISHI , Katsuhide WATANABE , Hozumi YASUDA , Yu ISHII
IPC分类号： B24B37/005 , B24B37/14 , B24B49/03 , B24B49/04 , B24B55/06 , H01L21/304
CPC分类号： B24B37/005 , B24B37/12 , B24B37/14 , B24B49/03 , B24B49/04 , B24B55/06 , H01L21/304
摘要： A local polishing system comprises: a particle estimation unit (30) for estimating the film thickness distribution of a wafer; a local polishing region setting unit (11) for setting a local polishing region on the wafer based on the film thickness distribution; a polishing head selection unit (12) for selecting a polishing head based on the size of the local polishing region; a model storage (20) holding a recipe generating model that defines the relation between an input node and an output node, the input node being an attribute of the local polishing region, the output node comprising a recipe for a polishing process; a polishing recipe generator (13) that puts an attribute of the local polishing region set by the local polishing region setting unit (11) into the input node of the recipe generating model and determines a polishing recipe for polishing the local polishing region; and a polishing recipe transmitter (15) for transmitting data of the polishing recipe to a local polishing module (200) that performs local polishing.

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