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1. 发明申请

US20080179680A1 PSEUDOMORPHIC SI/SIGE/SI BODY DEVICE WITH EMBEDDED SIGE SOURCE/DRAIN 失效
标题翻译： PSEUDOMORPHIC SI / SIGE / SI身体装置与嵌入式信号源/排水
公开(公告)号：US20080179680A1
公开(公告)日：2008-07-31
申请号：US12054812
申请日：2008-03-25
申请人： Dureseti CHIDAMBARRAO , Anda C. Mocuta , Dan M. Mocuta , Carl Radens
发明人： Dureseti CHIDAMBARRAO , Anda C. Mocuta , Dan M. Mocuta , Carl Radens
IPC分类号： H01L27/12
CPC分类号： H01L21/84 , H01L21/823807 , H01L21/823814 , H01L21/823878 , H01L27/1203 , H01L29/165 , H01L29/665 , H01L29/66628 , H01L29/66636 , H01L29/7848
摘要： The invention relates to a semiconductor structure and method of manufacturing and more particularly to a CMOS device with at least one embedded SiGe layer in the source/drain region of the PFET, and at least one embedded SiGe layer in the channel region of the NFET. In one embodiment, the structure of the invention enhances the electron mobility in the NFET device, and further enhances the hole mobility in the PFET device. Additionally, by using the fabrication methods and hence achieving the final structure of the invention, it is also possible to construct a PFET and NFET each with embedded SiGe layers on the same substrate.
摘要翻译：本发明涉及半导体结构和制造方法，更具体地说涉及在PFET的源极/漏极区域中具有至少一个嵌入的SiGe层以及在NFET的沟道区域中至少一个嵌入的SiGe层的CMOS器件。在一个实施方案中，本发明的结构增强了NFET器件中的电子迁移率，并进一步提高了PFET器件中的空穴迁移率。此外，通过使用制造方法并因此实现本发明的最终结构，还可以在同一衬底上构造每个具有嵌入的SiGe层的PFET和NFET。

2. 发明授权

US07691698B2 Pseudomorphic Si/SiGe/Si body device with embedded SiGe source/drain 失效
标题翻译：具有嵌入式SiGe源极/漏极的假晶Si / SiGe / Si体器件
公开(公告)号：US07691698B2
公开(公告)日：2010-04-06
申请号：US11358483
申请日：2006-02-21
申请人： Dureseti Chidambarrao , Anda C. Mocuta , Dan M. Mocuta , Carl Radens
发明人： Dureseti Chidambarrao , Anda C. Mocuta , Dan M. Mocuta , Carl Radens
IPC分类号： H01L21/8238
CPC分类号： H01L21/84 , H01L21/823807 , H01L21/823814 , H01L21/823878 , H01L27/1203 , H01L29/165 , H01L29/665 , H01L29/66628 , H01L29/66636 , H01L29/7848
摘要： The invention relates to a semiconductor structure and method of manufacturing and more particularly to a CMOS device with at least one embedded SiGe layer in the source/drain region of the PFET, and at least one embedded SiGe layer in the channel region of the NFET. In one embodiment, the structure of the invention enhances the electron mobility in the NFET device, and further enhances the hole mobility in the PFET device. Additionally, by using the fabrication methods and hence achieving the final structure of the invention, it is also possible to construct a PFET and NFET each with embedded SiGe layers on the same substrate.
摘要翻译：本发明涉及半导体结构和制造方法，更具体地说涉及在PFET的源极/漏极区域中具有至少一个嵌入的SiGe层以及在NFET的沟道区域中至少一个嵌入的SiGe层的CMOS器件。在一个实施方案中，本发明的结构增强了NFET器件中的电子迁移率，并进一步提高了PFET器件中的空穴迁移率。此外，通过使用制造方法并因此实现本发明的最终结构，还可以在同一衬底上构造每个具有嵌入的SiGe层的PFET和NFET。

3. 发明授权

US08168971B2 Pseudomorphic Si/SiGe/Si body device with embedded SiGe source/drain 失效
标题翻译：具有嵌入式SiGe源极/漏极的假晶Si / SiGe / Si体器件
公开(公告)号：US08168971B2
公开(公告)日：2012-05-01
申请号：US12054812
申请日：2008-03-25
申请人： Dureseti Chidambarrao , Anda C. Mocuta , Dan M. Mocuta , Carl Radens
发明人： Dureseti Chidambarrao , Anda C. Mocuta , Dan M. Mocuta , Carl Radens
IPC分类号： H01L29/04
CPC分类号： H01L21/84 , H01L21/823807 , H01L21/823814 , H01L21/823878 , H01L27/1203 , H01L29/165 , H01L29/665 , H01L29/66628 , H01L29/66636 , H01L29/7848
摘要： The invention relates to a semiconductor structure and method of manufacturing and more particularly to a CMOS device with at least one embedded SiGe layer in the source/drain region of the PFET, and at least one embedded SiGe layer in the channel region of the NFET. In one embodiment, the structure of the invention enhances the electron mobility in the NFET device, and further enhances the hole mobility in the PFET device. Additionally, by using the fabrication methods and hence achieving the final structure of the invention, it is also possible to construct a PFET and NFET each with embedded SiGe layers on the same substrate.
摘要翻译：本发明涉及半导体结构和制造方法，更具体地说涉及在PFET的源极/漏极区域中具有至少一个嵌入的SiGe层以及在NFET的沟道区域中至少一个嵌入的SiGe层的CMOS器件。在一个实施方案中，本发明的结构增强了NFET器件中的电子迁移率，并进一步提高了PFET器件中的空穴迁移率。此外，通过使用制造方法并因此实现本发明的最终结构，还可以在同一衬底上构造每个具有嵌入的SiGe层的PFET和NFET。

4. 发明申请

US20080179636A1 N-FETS WITH TENSILELY STRAINED SEMICONDUCTOR CHANNELS, AND METHOD FOR FABRICATING SAME USING BURIED PSEUDOMORPHIC LAYERS 审中-公开
标题翻译：具有拉伸半导体通道的N-FET以及使用BURIED PSEUDOMORPHIC层的相同方法
公开(公告)号：US20080179636A1
公开(公告)日：2008-07-31
申请号：US11307224
申请日：2007-01-27
申请人： Dureseti Chidambarrao , Effendi Leobandung , Anda C. Mocuta , Dan M. Mocuta , David M. Onsongo , Carl J. Radens
发明人： Dureseti Chidambarrao , Effendi Leobandung , Anda C. Mocuta , Dan M. Mocuta , David M. Onsongo , Carl J. Radens
IPC分类号： H01L29/04 , H01L21/335 , H01L21/8238
CPC分类号： H01L21/26513 , H01L21/26586 , H01L21/823807 , H01L21/823814 , H01L21/823878 , H01L29/1054 , H01L29/1083 , H01L29/165 , H01L29/6653 , H01L29/66628 , H01L29/66636 , H01L29/7849
摘要： The present invention relates to high performance n-channel field effect transistors (n-FETs) that each contains a strained semiconductor channel, and methods for forming such n-FETs by using buried pseudomorphic layers that contain pseudomorphically generated compressive strain.
摘要翻译：本发明涉及各自包含应变半导体通道的高性能n沟道场效应晶体管（n-FET），以及通过使用包含假象形成的压缩应变的掩埋伪晶层来形成这种n-FET的方法。

5. 发明授权

US06916698B2 High performance CMOS device structure with mid-gap metal gate 失效
标题翻译：高性能CMOS器件结构，具有中间间隙金属栅极
公开(公告)号：US06916698B2
公开(公告)日：2005-07-12
申请号：US10795672
申请日：2004-03-08
申请人： Anda C. Mocuta , Meikei Ieong , Ricky S. Amos , Diane C. Boyd , Dan M. Mocuta , Huajie Chen
发明人： Anda C. Mocuta , Meikei Ieong , Ricky S. Amos , Diane C. Boyd , Dan M. Mocuta , Huajie Chen
IPC分类号： H01L29/423 , H01L21/8238 , H01L27/092 , H01L29/49
CPC分类号： H01L21/823807 , H01L21/823828
摘要： High performance (surface channel) CMOS devices with a mid-gap work function metal gate are disclosed wherein an epitaxial layer is used for a threshold voltage Vt adjust/decrease for the PFET area, for large Vt reductions (˜500 mV), as are required by CMOS devices with a mid-gap metal gate. The present invention provides counter doping using an in situ B doped epitaxial layer or a B and C co-doped epitaxial layer, wherein the C co-doping provides an additional degree of freedom to reduce the diffusion of B (also during subsequent activation thermal cycles) to maintain a shallow B profile, which is critical to provide a surface channel CMOS device with a mid-gap metal gate while maintaining good short channel effects. The B diffusion profiles are satisfactorily shallow, sharp and have a high B concentration for devices with mid-gap metal gates, to provide and maintain a thin, highly doped B layer under the gate oxide.
摘要翻译：公开了具有中间间隙功函数金属栅极的高性能（表面沟道）CMOS器件，其中外延层用于PFET区域的阈值电压Vt调整/减小，用于大的Vt降低（〜500mV），如需要具有中间间隙金属栅极的CMOS器件。本发明提供了使用原位B掺杂外延层或B和C共掺杂外延层的反掺杂，其中C共掺杂提供了额外的自由度以减少B的扩散（也在随后的激活热循环期间））以保持浅的B剖面，这对于提供具有中间间隙金属栅极的表面沟道CMOS器件而言是至关重要的，同时保持良好的短沟道效应。对于具有中间间隙金属栅极的器件，B扩散曲线令人满意地浅，尖锐且具有高B浓度，以在栅极氧化物下提供并保持薄的高掺杂B层。

6. 发明授权

US07723750B2 MOSFET with super-steep retrograded island 失效
标题翻译：具超级陡峭退火岛的MOSFET
公开(公告)号：US07723750B2
公开(公告)日：2010-05-25
申请号：US11774221
申请日：2007-07-06
申请人： Huilong Zhu , Effendi Leobandung , Anda C. Mocuta , Dan M. Mocuta
发明人： Huilong Zhu , Effendi Leobandung , Anda C. Mocuta , Dan M. Mocuta
IPC分类号： H01L29/737
CPC分类号： H01L29/7842 , H01L21/26586 , H01L21/823807 , H01L21/823814 , H01L29/105 , H01L29/1608 , H01L29/6656 , H01L29/6659 , H01L29/66636 , H01L29/7833 , H01L29/7848
摘要： The present invention comprises a method for forming a semiconducting device including the steps of providing a layered structure including a substrate, a low diffusivity layer of a first-conductivity dopant; and a channel layer; forming a gate stack atop a protected surface of the channel layer; etching the layered structure selective to the gate stack to expose a surface of the substrate, where a remaining portion of the low diffusivity layer provides a retrograded island substantially aligned to the gate stack having a first dopant concentration to reduce short-channel effects without increasing leakage; growing a Si-containing material atop the recessed surface of the substrate; and doping the Si-containing material with a second-conductivity dopant at a second dopant concentration. The low diffusivity layer may be Si1-x-yGexZy, where Z can be carbon (C), xenon (Xe), germanium (Ge), krypton (Kr), argon (Ar), nitrogen (N), or combinations thereof.
摘要翻译：本发明包括一种形成半导体器件的方法，包括以下步骤：提供包括衬底，第一导电掺杂剂的低扩散层的分层结构; 和通道层; 在沟道层的受保护表面上方形成栅极堆叠; 蚀刻对栅极堆叠选择性的层状结构以暴露衬底的表面，其中低扩散层的剩余部分提供基本上与具有第一掺杂剂浓度的栅极堆叠对准的退化岛，以减少短沟道效应而不增加泄漏 ; 在衬底的凹陷表面的顶部生长含Si材料; 并且以第二掺杂剂浓度用第二导电掺杂剂掺杂含Si材料。低扩散性层可以是Si1-x-yGexZy，其中Z可以是碳（C），氙（Xe），锗（Ge），氪（Kr），氩（Ar），氮（N）或它们的组合。

7. 发明授权

US08429576B2 Methods and system for analysis and management of parametric yield 有权
公开(公告)号：US08429576B2
公开(公告)日：2013-04-23
申请号：US13471789
申请日：2012-05-15
申请人： James A. Culp , Paul Chang , Dureseti Chidambarrao , Praveen Elakkumanan , Jason Hibbeler , Anda C. Mocuta
发明人： James A. Culp , Paul Chang , Dureseti Chidambarrao , Praveen Elakkumanan , Jason Hibbeler , Anda C. Mocuta
IPC分类号： G06F17/50
CPC分类号： G01R31/26 , G06F17/5045
摘要： Impact on parametric performance of physical design choices for transistors is scored for on-current and off-current of the transistors. The impact of the design parameters are incorporated into parameters that measure predicted shift in mean on-current and mean off-current and parameters that measure predicted increase in deviations in the distribution of on-current and the off-current. Statistics may be taken at a cell level, a block level, or a chip level to optimize a chip design in a design phase, or to predict changes in parametric yield during manufacturing or after a depressed parametric yield is observed. Further, parametric yield and current level may be predicted region by region and compared with observed thermal emission to pinpoint any anomaly region in a chip to facilitate detection and correction in any mistakes in chip design.

8. 发明授权

US07268049B2 Structure and method for manufacturing MOSFET with super-steep retrograded island 失效
标题翻译：具有超陡退化岛的MOSFET的制造和制造方法
公开(公告)号：US07268049B2
公开(公告)日：2007-09-11
申请号：US10954838
申请日：2004-09-30
申请人： Huilong Zhu , Effendi Leobandung , Anda C. Mocuta , Dan M. Mocuta
发明人： Huilong Zhu , Effendi Leobandung , Anda C. Mocuta , Dan M. Mocuta
IPC分类号： H01L21/336
CPC分类号： H01L29/7842 , H01L21/26586 , H01L21/823807 , H01L21/823814 , H01L29/105 , H01L29/1608 , H01L29/6656 , H01L29/6659 , H01L29/66636 , H01L29/7833 , H01L29/7848
摘要： The present invention comprises a method for forming a semiconducting device including the steps of providing a layered structure including a substrate, a low diffusivity layer of a first-conductivity dopant; and a channel layer; forming a gate stack atop a protected surface of the channel layer; etching the layered structure selective to the gate stack to expose a surface of the substrate, where a remaining portion of the low diffusivity layer provides a retrograded island substantially aligned to the gate stack having a first dopant concentration to reduce short-channel effects without increasing leakage; growing a Si-containing material atop the recessed surface of the substrate; and doping the Si-containing material with a second-conductivity dopant at a second dopant concentration. The low diffusivity layer may be Si1-x-yGexZy, where Z can be carbon (C), xenon (Xe), germanium (Ge), krypton (Kr), argon (Ar), nitrogen (N), or combinations thereof.
摘要翻译：本发明包括一种形成半导体器件的方法，包括以下步骤：提供包括衬底，第一导电掺杂剂的低扩散层的分层结构; 和通道层; 在沟道层的受保护表面上方形成栅极堆叠; 蚀刻对栅极堆叠选择性的层状结构以暴露衬底的表面，其中低扩散层的剩余部分提供基本上与具有第一掺杂剂浓度的栅极堆叠对准的退化岛，以减少短沟道效应而不增加泄漏 ; 在衬底的凹陷表面的顶部生长含Si材料; 并且以第二掺杂剂浓度用第二导电掺杂剂掺杂含Si材料。低扩散性层可以是Si 1-xy X z Z z，其中Z可以是碳（C），氙（Xe），锗（Ge），氪（Kr），氩（Ar），氮（N）或其组合。

9. 发明授权

US06762469B2 High performance CMOS device structure with mid-gap metal gate 失效
标题翻译：高性能CMOS器件结构，具有中间间隙金属栅极
公开(公告)号：US06762469B2
公开(公告)日：2004-07-13
申请号：US10127196
申请日：2002-04-19
申请人： Anda C. Mocuta , Meikei Ieong , Ricky S. Amos , Diane C. Boyd , Dan M. Mocuta , Huajie Chen
发明人： Anda C. Mocuta , Meikei Ieong , Ricky S. Amos , Diane C. Boyd , Dan M. Mocuta , Huajie Chen
IPC分类号： H01L2976
CPC分类号： H01L21/823807 , H01L21/823828
摘要： High performance (surface channel) CMOS devices with a mid-gap work function metal gate are disclosed wherein an epitaxial layer is used for a threshold voltage Vt adjust/decrease for the PFET area, for large Vt reductions (˜500 mV), as are required by CMOS devices with a mid-gap metal gate. The present invention provides counter doping using an in situ B doped epitaxial layer or a B and C co-doped epitaxial layer, wherein the C co-doping provides an additional degree of freedom to reduce the diffusion of B (also during subsequent activation thermal cycles) to maintain a shallow B profile, which is critical to provide a surface channel CMOS device with a mid-gap metal gate while maintaining good short channel effects. The B diffusion profiles are satisfactorily shallow, sharp and have a high B concentration for devices with mid-gap metal gates, to provide and maintain a thin, highly doped B layer under the gate oxide.
摘要翻译：公开了具有中间间隙功函数金属栅极的高性能（表面沟道）CMOS器件，其中外延层用于PFET区域的阈值电压Vt调整/减小，用于大的Vt降低（〜500mV），如需要具有中间间隙金属栅极的CMOS器件。本发明提供了使用原位B掺杂外延层或B和C共掺杂外延层的反掺杂，其中C共掺杂提供了额外的自由度以减少B的扩散（也在随后的激活热循环期间））以保持浅的B剖面，这对于提供具有中间间隙金属栅极的表面沟道CMOS器件而言是至关重要的，同时保持良好的短沟道效应。对于具有中间间隙金属栅极的器件，B扩散曲线令人满意地浅，尖锐且具有高B浓度，以在栅极氧化物下提供并保持薄的高掺杂B层。

10. 发明授权

US08239790B2 Methods and system for analysis and management of parametric yield 有权
标题翻译：参数收益分析与管理方法与系统
公开(公告)号：US08239790B2
公开(公告)日：2012-08-07
申请号：US13216362
申请日：2011-08-24
申请人： James A. Culp , Paul Chang , Dureseti Chidambarrao , Praveen Elakkumanan , Jason Hibbeler , Anda C. Mocuta
发明人： James A. Culp , Paul Chang , Dureseti Chidambarrao , Praveen Elakkumanan , Jason Hibbeler , Anda C. Mocuta
IPC分类号： G06F17/50
CPC分类号： G01R31/26 , G06F17/5045
摘要： Impact on parametric performance of physical design choices for transistors is scored for on-current and off-current of the transistors. The impact of the design parameters are incorporated into parameters that measure predicted shift in mean on-current and mean off-current and parameters that measure predicted increase in deviations in the distribution of on-current and the off-current. Statistics may be taken at a cell level, a block level, or a chip level to optimize a chip design in a design phase, or to predict changes in parametric yield during manufacturing or after a depressed parametric yield is observed. Further, parametric yield and current level may be predicted region by region and compared with observed thermal emission to pinpoint any anomaly region in a chip to facilitate detection and correction in any mistakes in chip design.
摘要翻译：对晶体管的导通电流和截止电流对晶体管的物理设计选择的参数性能的影响。设计参数的影响被纳入测量平均电流和平均截止电流的预测偏差的参数以及测量导通电流和截止电流分布的偏差预测增加的参数。可以在单元级别，块级或芯片级别进行统计，以在设计阶段优化芯片设计，或者在制造期间或在观察到抑制参数产量之后预测参数产量的变化。此外，可以逐区域地预测参数产量和电流水平，并与观察到的热发射进行比较，以确定芯片中的任何异常区域，以便在芯片设计中的任何错误中进行检测和校正。

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