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    • 4. 发明申请
    • THERMAL TRANSPORT STRUCTURE
    • 热运输结构
    • US20080019097A1
    • 2008-01-24
    • US11782049
    • 2007-07-24
    • Jian ZhangSandeep TonapiArun GowdaRyan Mills
    • Jian ZhangSandeep TonapiArun GowdaRyan Mills
    • H05K7/20
    • F28F13/00F28F2013/005H01L23/3677H01L23/3733H01L23/42H01L2924/0002H01L2924/12044H01L2924/00
    • A thermally manageable system is provided. The system may include a heat-generating unit, a heat-dissipating unit, and a thermal transport structure located between the heat-dissipating unit and the heat-generating unit. The thermal transport structure has a first surface in thermal communication with the heat-generating unit and a second surface in thermal communication with the heat-dissipating unit. The thermal transport structure includes a thermally conductive material having a length-to-width ratio greater than 1, and the length is oriented to directionally facilitate heat conduction in a direction about perpendicular at least one of the thermal transport structure first surface or second surface. The thermal transport layer comprises a plurality of individual thermally conductive strips or channels that define a discontinuous array within a relatively non-thermally conductive matrix.
    • 提供热管理系统。 该系统可以包括位于散热单元和发热单元之间的发热单元,散热单元和热传输结构。 热传输结构具有与发热单元热连通的第一表面和与散热单元热连通的第二表面。 热传输结构包括长度与宽度比大于1的导热材料,并且长度方向定向地促进沿热交换结构第一表面或第二表面中的至少一个的大致垂直方向的热传导。 热传递层包括在相对非导热的基质内限定不连续阵列的多个独立的导热条或通道。