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1. 发明授权

US08276604B2 Peripherally engaging electrode carriers and assemblies incorporating the same 有权
标题翻译：外围接合电极载体和结合其的组件
公开(公告)号：US08276604B2
公开(公告)日：2012-10-02
申请号：US12164288
申请日：2008-06-30
申请人： Jason Augustino , Armen Avoyan , Yan Fang , Duane Outka , Hong Shih , Stephen Whitten
发明人： Jason Augustino , Armen Avoyan , Yan Fang , Duane Outka , Hong Shih , Stephen Whitten
IPC分类号： H05H1/34 , H01J37/02 , H01J37/32 , H01L21/00 , C23C16/00
CPC分类号： H01J37/32541 , H01J37/32009 , H01J37/32605 , H01L21/67069
摘要： In accordance with one embodiment of the present disclosure, an assembly is provided comprising a multi-component electrode and a peripherally engaging electrode carrier. The peripherally engaging electrode carrier comprises a carrier frame and a plurality of reciprocating electrode supports. The multi-component electrode is positioned in the electrode accommodating aperture of the carrier frame. The backing plate of the electrode comprises a plurality of mounting recesses formed about its periphery. The reciprocating electrode supports can be reciprocated into and out of the mounting recesses. Additional embodiments of broader and narrower scope are contemplated.
摘要翻译：根据本公开的一个实施例，提供了包括多组分电极和外围接合电极载体的组件。外周接合电极载体包括载体框架和多个往复电极支撑件。多组分电极位于载体框架的电极容纳孔中。电极的背板包括围绕其周边形成的多个安装凹部。往复式电极支撑件可以往复运动进入和离开安装凹槽。考虑到更广泛和更窄范围的另外的实施例。

2. 发明申请

US20090322199A1 BACKSIDE MOUNTED ELECTRODE CARRIERS AND ASSEMBLIES INCORPORATING THE SAME 有权
标题翻译：背面安装的电极载体和装配的装置
公开(公告)号：US20090322199A1
公开(公告)日：2009-12-31
申请号：US12164285
申请日：2008-06-30
申请人： Jason Augustino , Armen Avoyan , Yan Fang , Duane Outka , Hong Shih , Stephen Whitten
发明人： Jason Augustino , Armen Avoyan , Yan Fang , Duane Outka , Hong Shih , Stephen Whitten
IPC分类号： H01J19/42
CPC分类号： H01J37/32568 , H01J37/32091 , H01J37/32605
摘要： A carrier assembly is provided comprising a backside mounted electrode carrier and electrode mounting hardware. The backside mounted electrode carrier comprises an electrode accommodating aperture, which in turn comprises a sidewall structure that is configured to limit lateral movement of an electrode positioned in the aperture. The electrode accommodating aperture further comprises one or more sidewall projections that support the weight of an electrode positioned in the aperture. The electrode mounting hardware is configured to engage an electrode positioned in the electrode accommodating aperture from the backside of the carrier and urge the electrode against the sidewall projections so as to limit axial movement of the electrode in the electrode accommodating aperture. Additional embodiments of broader and narrower scope are contemplated.
摘要翻译：提供的载体组件包括背面安装的电极载体和电极安装硬件。背面安装的电极载体包括电极容纳孔，电极容纳孔又包括被配置为限制定位在孔中的电极的横向移动的侧壁结构。电极容纳孔还包括支撑位于孔中的电极的重量的一个或多个侧壁突起。电极安装硬件被配置成从位于载体的背面的电极容纳孔中的电极接合，并且将电极推靠在侧壁突起上，以限制电极在电极容纳孔中的轴向移动。考虑到更广泛和更窄范围的另外的实施例。

3. 发明申请

US20090321018A1 PERIPHERALLY ENGAGING ELECTRODE CARRIERS AND ASSEMBLIES INCORPORATING THE SAME 有权
标题翻译：外围接合电极载体和组装
公开(公告)号：US20090321018A1
公开(公告)日：2009-12-31
申请号：US12164288
申请日：2008-06-30
申请人： Jason Augustino , Armen Avoyan , Yan Fang , Duane Outka , Hong Shih , Stephen Whitten
发明人： Jason Augustino , Armen Avoyan , Yan Fang , Duane Outka , Hong Shih , Stephen Whitten
IPC分类号： H01J37/32 , H01L21/00
CPC分类号： H01J37/32541 , H01J37/32009 , H01J37/32605 , H01L21/67069
摘要： In accordance with one embodiment of the present disclosure, an assembly is provided comprising a multi-component electrode and a peripherally engaging electrode carrier. The peripherally engaging electrode carrier comprises a carrier frame and a plurality of reciprocating electrode supports. The multi-component electrode is positioned in the electrode accommodating aperture of the carrier frame. The backing plate of the electrode comprises a plurality of mounting recesses formed about its periphery. The reciprocating electrode supports can be reciprocated into and out of the mounting recesses. Additional embodiments of broader and narrower scope are contemplated.
摘要翻译：根据本公开的一个实施例，提供了包括多组分电极和外围接合电极载体的组件。外周接合电极载体包括载体框架和多个往复电极支撑件。多组分电极位于载体框架的电极容纳孔中。电极的背板包括围绕其周边形成的多个安装凹部。往复式电极支撑件可以往复运动进入和离开安装凹槽。考虑到更广泛和更窄范围的另外的实施例。

4. 发明授权

US08221552B2 Cleaning of bonded silicon electrodes 有权
标题翻译：粘结硅电极的清洁
公开(公告)号：US08221552B2
公开(公告)日：2012-07-17
申请号：US11730296
申请日：2007-03-30
申请人： Duane Outka , Jason Augustino , Armen Avoyan , Stephen Whitten , Hong Shih , Yan Fang
发明人： Duane Outka , Jason Augustino , Armen Avoyan , Stephen Whitten , Hong Shih , Yan Fang
IPC分类号： B08B17/02 , B08B3/04 , B08B5/02 , B08B1/04
CPC分类号： B08B3/04 , H01J37/32862
摘要： Methods of cleaning plasma processing chamber components include contacting surfaces of the components with a cleaning solution, while avoiding damage of other surfaces or areas of the components by the cleaning solution. An exemplary plasma processing chamber component to be cleaning is an elastomer bonded electrode assembly having a silicon member with a plasma-exposed silicon surface, a backing member, and an elastomer bonding material between the silicon surface and the backing member.
摘要翻译：清洁等离子体处理室部件的方法包括将部件的表面与清洁溶液接触，同时避免清洁溶液损坏其它表面或部件区域。要清洁的示例性等离子体处理室部件是具有硅构件的弹性体接合电极组件，其具有等离子体暴露的硅表面，背衬构件和在硅表面和背衬构件之间的弹性体接合材料。

5. 发明申请

US20120013242A9 BACKSIDE MOUNTED ELECTRODE CARRIERS AND ASSEMBLIES INCORPORATING THE SAME 有权
标题翻译：背面安装的电极载体和装配的装置
公开(公告)号：US20120013242A9
公开(公告)日：2012-01-19
申请号：US12164285
申请日：2008-06-30
申请人： Jason Augustino , Armen Avoyan , Yan Fang , Duane Outka , Hong Shih , Stephen Whitten
发明人： Jason Augustino , Armen Avoyan , Yan Fang , Duane Outka , Hong Shih , Stephen Whitten
IPC分类号： H01J19/42
CPC分类号： H01J37/32568 , H01J37/32091 , H01J37/32605
摘要： A carrier assembly is provided comprising a backside mounted electrode carrier and electrode mounting hardware. The backside mounted electrode carrier comprises an electrode accommodating aperture, which in turn comprises a sidewall structure that is configured to limit lateral movement of an electrode positioned in the aperture. The electrode accommodating aperture further comprises one or more sidewall projections that support the weight of an electrode positioned in the aperture. The electrode mounting hardware is configured to engage an electrode positioned in the electrode accommodating aperture from the backside of the carrier and urge the electrode against the sidewall projections so as to limit axial movement of the electrode in the electrode accommodating aperture. Additional embodiments of broader and narrower scope are contemplated.
摘要翻译：提供的载体组件包括背面安装的电极载体和电极安装硬件。背面安装的电极载体包括电极容纳孔，电极容纳孔又包括被配置为限制定位在孔中的电极的横向移动的侧壁结构。电极容纳孔还包括支撑位于孔中的电极的重量的一个或多个侧壁突起。电极安装硬件被配置成从位于载体的背面的电极容纳孔中的电极接合，并且将电极推靠在侧壁突起上，以限制电极在电极容纳孔中的轴向移动。考虑到更广泛和更窄范围的另外的实施例。

6. 发明申请

US20080236618A1 Cleaning of bonded silicon electrodes 有权
标题翻译：粘结硅电极的清洁
公开(公告)号：US20080236618A1
公开(公告)日：2008-10-02
申请号：US11730296
申请日：2007-03-30
申请人： Duane Outka , Jason Augustino , Armen Avoyan , Stephen Whitten , Hong Shih , Yan Fang
发明人： Duane Outka , Jason Augustino , Armen Avoyan , Stephen Whitten , Hong Shih , Yan Fang
IPC分类号： B08B3/10 , B08B3/08
CPC分类号： B08B3/04 , H01J37/32862
摘要： Methods of cleaning plasma processing chamber components include contacting surfaces of the components with a cleaning solution, while avoiding damage of other surfaces or areas of the components by the cleaning solution. An exemplary plasma processing chamber component to be cleaning is an elastomer bonded electrode assembly having a silicon member with a plasma-exposed silicon surface, a backing member, and an elastomer bonding material between the silicon surface and the backing member.
摘要翻译：清洁等离子体处理室部件的方法包括将部件的表面与清洁溶液接触，同时避免清洁溶液损坏其它表面或部件区域。要清洁的示例性等离子体处理室部件是具有硅构件的弹性体接合电极组件，其具有等离子体暴露的硅表面，背衬构件和在硅表面和背衬构件之间的弹性体接合材料。

7. 发明授权

US08171877B2 Backside mounted electrode carriers and assemblies incorporating the same 有权
标题翻译：背面安装的电极载体和包含其的组件
公开(公告)号：US08171877B2
公开(公告)日：2012-05-08
申请号：US12164285
申请日：2008-06-30
申请人： Jason Augustino , Armen Avoyan , Yan Fang , Duane Outka , Hong Shih , Stephen Whitten
发明人： Jason Augustino , Armen Avoyan , Yan Fang , Duane Outka , Hong Shih , Stephen Whitten
IPC分类号： B05C13/00 , B05C13/02 , B05C21/00 , C23C16/00 , C23C16/50 , C23F1/00 , H01L21/306
CPC分类号： H01J37/32568 , H01J37/32091 , H01J37/32605
摘要： A carrier assembly is provided comprising a backside mounted electrode carrier and electrode mounting hardware. The backside mounted electrode carrier comprises an electrode accommodating aperture, which in turn comprises a sidewall structure that is configured to limit lateral movement of an electrode positioned in the aperture. The electrode accommodating aperture further comprises one or more sidewall projections that support the weight of an electrode positioned in the aperture. The electrode mounting hardware is configured to engage an electrode positioned in the electrode accommodating aperture from the backside of the carrier and urge the electrode against the sidewall projections so as to limit axial movement of the electrode in the electrode accommodating aperture. Additional embodiments of broader and narrower scope are contemplated.
摘要翻译：提供的载体组件包括背面安装的电极载体和电极安装硬件。背面安装的电极载体包括电极容纳孔，电极容纳孔又包括被配置为限制定位在孔中的电极的横向移动的侧壁结构。电极容纳孔还包括支撑位于孔中的电极的重量的一个或多个侧壁突起。电极安装硬件被配置成从位于载体的背面的电极容纳孔中的电极接合，并且将电极推靠在侧壁突起上，以限制电极在电极容纳孔中的轴向移动。考虑到更广泛和更窄范围的另外的实施例。

8. 发明申请

US20090325320A1 PROCESSES FOR RECONDITIONING MULTI-COMPONENT ELECTRODES 有权
标题翻译：用于重新组装多组分电极的方法
公开(公告)号：US20090325320A1
公开(公告)日：2009-12-31
申请号：US12164294
申请日：2008-06-30
申请人： Armen Avoyan , Yan Fang , Duane Outka , Hong Shih , Stephen Whitten
发明人： Armen Avoyan , Yan Fang , Duane Outka , Hong Shih , Stephen Whitten
IPC分类号： H01L21/306 , C23G1/00
CPC分类号： H01J37/32862 , H01J37/32559
摘要： A process for reconditioning a multi-component electrode comprising a silicon electrode bonded to an electrically conductive backing plate is provided. The process comprises: (i) removing metal ions from the multi-component electrode by soaking the multi-component electrode in a substantially alcohol-free DSP solution comprising sulfuric acid, hydrogen peroxide, and water and rinsing the multi-component electrode with de-ionized water; (ii) polishing one or more surfaces of the multi-component electrode following removal of metal ions there from; and (iii) removing contaminants from silicon surfaces of the multi-component electrode by treating the polished multi-component electrode with a mixed acid solution comprising hydrofluoric acid, nitric acid, acetic acid, and water and by rinsing the treated multi-component electrode with de-ionized water. Additional embodiments of broader and narrower scope are contemplated.
摘要翻译：提供了一种用于再生多组分电极的方法，其包括结合到导电背板的硅电极。该方法包括：（i）通过将多组分电极浸入含有硫酸，过氧化氢和水的基本上不含醇的DSP溶液中并从而从多组分电极中除去金属离子，并用去离子水冲洗多组分电极，电离水; （ii）在从其去除金属离子之后抛光多组分电极的一个或多个表面; 和（iii）通过用包含氢氟酸，硝酸，乙酸和水的混合酸溶液处理抛光的多组分电极，并通过用处理过的多组分电极进行漂洗来处理多组分电极的硅表面的污染物去离子水。考虑到更广泛和更窄范围的另外的实施例。

9. 发明授权

US08075701B2 Processes for reconditioning multi-component electrodes 有权
标题翻译：用于修复多组分电极的工艺
公开(公告)号：US08075701B2
公开(公告)日：2011-12-13
申请号：US12164294
申请日：2008-06-30
申请人： Armen Avoyan , Yan Fang , Duane Outka , Hong Shih , Stephen Whitten
发明人： Armen Avoyan , Yan Fang , Duane Outka , Hong Shih , Stephen Whitten
IPC分类号： C23G1/00 , B08B3/00 , H01L21/00
CPC分类号： H01J37/32862 , H01J37/32559
摘要： A process for reconditioning a multi-component electrode comprising a silicon electrode bonded to an electrically conductive backing plate is provided. The process comprises: (i) removing metal ions from the multi-component electrode by soaking the multi-component electrode in a substantially alcohol-free DSP solution comprising sulfuric acid, hydrogen peroxide, and water and rinsing the multi-component electrode with de-ionized water; (ii) polishing one or more surfaces of the multi-component electrode following removal of metal ions there from; and (iii) removing contaminants from silicon surfaces of the multi-component electrode by treating the polished multi-component electrode with a mixed acid solution comprising hydrofluoric acid, nitric acid, acetic acid, and water and by rinsing the treated multi-component electrode with de-ionized water. Additional embodiments of broader and narrower scope are contemplated.
摘要翻译：提供了一种用于再生多组分电极的方法，其包括结合到导电背板的硅电极。该方法包括：（i）通过将多组分电极浸入含有硫酸，过氧化氢和水的基本上不含醇的DSP溶液中并从而从多组分电极中除去金属离子，并用去离子水冲洗多组分电极，电离水; （ii）在从其去除金属离子之后抛光多组分电极的一个或多个表面; 和（iii）通过用包含氢氟酸，硝酸，乙酸和水的混合酸溶液处理抛光的多组分电极，并通过用处理过的多组分电极进行漂洗来处理多组分电极的硅表面的污染物去离子水。考虑到更广泛和更窄范围的另外的实施例。

10. 发明授权

US08545639B2 Method of cleaning aluminum plasma chamber parts 有权
标题翻译：铝等离子体室部件的清洗方法
公开(公告)号：US08545639B2
公开(公告)日：2013-10-01
申请号：US13285203
申请日：2011-10-31
申请人： Hong Shih , John Daugherty , Dean J. Larson , Tuochuan Huang , Armen Avoyan , Jeremy Chang , Sivakami Ramanathan , Robert Anderson , Yan Fang , Duane Outka , Paul Mulgrew
发明人： Hong Shih , John Daugherty , Dean J. Larson , Tuochuan Huang , Armen Avoyan , Jeremy Chang , Sivakami Ramanathan , Robert Anderson , Yan Fang , Duane Outka , Paul Mulgrew
IPC分类号： C23G1/00 , C23G1/02 , B08B3/00
CPC分类号： H01J37/32853 , C11D7/08 , C11D11/0047 , H01J37/32862
摘要： A method of cleaning a surface of a component of a plasma chamber, wherein the component has an aluminum or anodized aluminum surface, the method including the steps of: soaking the surface of the component in a diluted sulfuric peroxide (DSP) solution; spray rinsing the surface with water following removal of the surface from the DSP solution; soaking the surface in a dilute nitric acid (HNO3) solution; spray rinsing the surface with water following removal of the surface from the dilute nitric acid solution; and repeating at least twice the steps of soaking the surface in dilute nitric acid followed by spray rinsing the surface.
摘要翻译：一种清洁等离子体室的部件的表面的方法，其中所述部件具有铝或阳极氧化的铝表面，所述方法包括以下步骤：将所述部件的表面浸入稀释的硫酸过氧化物（DSP）溶液中; 在从DSP溶液中除去表面后，用水冲洗表面; 将表面浸入稀硝酸（HNO3）溶液中; 在从稀硝酸溶液中除去表面后，用水冲洗表面; 并重复至少两次将表面浸入稀硝酸的步骤，然后喷淋冲洗该表面。

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