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    • 4. 发明授权
    • Automated specimen inspection system for and method of distinguishing
features or anomalies under either bright field or dark field
illumination
    • 自动样本检测系统及其在明场或暗场照明下区分特征或异常的方法
    • US5917588A
    • 1999-06-29
    • US743998
    • 1996-11-04
    • Ginetto Addiego
    • Ginetto Addiego
    • G01N21/956G01N21/88G06T1/00
    • G01N21/956G01N21/8806G01N2021/8825
    • An automated inspection system and method replaces human visual inspection of the surface of a specimen having distinguishing features or anomalies that are detectable under either one or a combination of bright field and dark field illumination. A preferred embodiment is an after develop inspection macro (ADI Macro) defect inspection system that inspects the patterned surface of a semiconductor wafer for large scale (i.e., greater than about 25 micron minimum dimension range) defects. The ADI Macro inspection system detects defects that appear after the photolithography development step and include regions of defocus ("hot spots"), scratches, pattern blemishes, large particles, (i.e., particles greater than about 25 micron minimum dimension range), extra deposited photoresist, nonuniform photoresist deposition, and edge bead removal inconsistencies. Two fluorescent lamp tubes are used to illuminate the target area in dark field, and one fluorescent lamp tube is used in an oblique configuration to illuminate the target area in bright field. First and second imaging systems collect, respectively, bright field light rays and dark field light rays propagating from the illuminated target area of the wafer surface. Each of two light sensor arrays optically communicates with a different one of the first and second imaging systems. The light sensor array outputs provide a stream of digital data that is processed by an imaging computer. Defect detection from these data is accomplished by analyzing a difference image among nearby reticle fields of the specimen wafer.
    • 自动检查系统和方法取代了具有区分特征或异常的样本的表面的人类视觉检查,该特征或异常可以在明场和暗场照明的任一者或组合下检测。 优选的实施方案是后期开发的检查宏(ADI Macro)缺陷检查系统,其大尺度(即大于约25微米的最小尺寸范围)缺陷检查半导体晶片的图案化表面。 ADI Macro检测系统检测光刻显影步骤后出现的缺陷,包括散焦区域(“热点”),划痕,图案瑕疵,大颗粒(即,大于约25微米的最小尺寸范围的颗粒),额外沉积 光致抗蚀剂,不均匀光致抗蚀剂沉积和边缘珠去除不一致。 两个荧光灯管用于照明暗场中的目标区域,并且一个荧光灯管以倾斜配置使用以照亮明场中的目标区域。 第一和第二成像系统分别收集从晶片表面的照射目标区域传播的亮场光线和暗场光线。 两个光传感器阵列中的每一个与第一和第二成像系统中的不同的一个光学地通信。 光传感器阵列输出提供由成像计算机处理的数字数据流。 通过分析样品晶片的附近标线片区域之间的差分图像来实现来自这些数据的缺陷检测。
    • 5. 发明授权
    • Laser-based system for material deposition and removal
    • 用于材料沉积和去除的基于激光的系统
    • US5164565A
    • 1992-11-17
    • US687473
    • 1991-04-18
    • Ginetto AddiegoFrancois J. Henley
    • Ginetto AddiegoFrancois J. Henley
    • B23K26/00B23K26/03B23K26/06B23K26/073G02F1/13G02F1/1343G02F1/1345G02F1/1362G03F1/00G03F1/72H05K3/00H05K3/22H05K3/46
    • B23K26/032H05K3/225G02F1/136259H05K2203/0769H05K2203/107H05K2203/108H05K2203/121H05K3/0017H05K3/4685
    • A laser-based repair system provides for material removal and deposition using a repair tool having a first laser operating at a high power for cutting signal lines and operating at a lower power for ablating a target repair area in conjunction with a liquid dispensing apparatus for application of the liquid solution in a target area, and a second laser for decomposing the liquid solution in an applied layer prior to the ablation of material in the target repair area. Various repair processes can be undertaken. The invention allows high-speed material deposition and removal on a surface. In a specific embodiment of the invention, the liquid solution used is a palladium acetate and a solvent or other metallo-organic solution which is capable of pyrolytic reaction and decomposition to an electrically conductive residue. A liquid applicator or dispensing apparatus is provided which is suited to applying fine traces of liquid without clogging. An optical head is provided which project beams from a plurality of lasers and surface illumination along a common axis with an optical viewing system for lighting a target workpiece for observing the repair in progress. The invention is particularly useful in the repair of large matrices, such as liquid crystal display panels.
    • 基于激光的修复系统使用具有第一激光器的修复工具进行材料去除和沉积,所述修复工具具有用于切割信号线的第一激光器,并以较低的功率操作,以与用于应用的液体分配装置结合用于烧蚀目标修复区域 的目标区域中的液体溶液;以及第二激光器,用于在目标修复区域中的材料消融之前将施加的层中的液体溶液分解。 可以进行各种修复过程。 本发明允许在表面上高速材料沉积和去除。 在本发明的一个具体实施方案中,使用的液体溶液是能够热解反应并分解成导电残余物的乙酸钯和溶剂或其它金属有机溶液。 提供了一种液体涂布器或分配装置,其适于施加精细痕迹的液体而不堵塞。 提供一种光学头,其将来自多个激光器的光束和沿着公共轴线的表面照明投射到光学观察系统,用于照亮目标工件以观察正在进行的修复。 本发明在诸如液晶显示面板的大型基体的修复中特别有用。
    • 7. 发明授权
    • Method and apparatus for positioning and biasing an electro-optic
modulator of an electro-optic imaging system
    • 用于定位和偏置电光成像系统的电光调制器的方法和装置
    • US5387788A
    • 1995-02-07
    • US27210
    • 1993-03-05
    • Michael J. MillerGinetto AddiegoFrancois J. Henley
    • Michael J. MillerGinetto AddiegoFrancois J. Henley
    • G01R31/302G01R19/00G01R31/308G02F1/13G09G3/00H01L21/66G01J1/20
    • G09G3/006G01R31/308G02F1/1309
    • An imaging method creates a two-dimensional image of a voltage distribution or a capacitance distribution of a substrate under test using an electro-optic modulator. A coarse modulator calibration determines the effect of non-uniformities in the modulator and determines a look-up table relating the gap distance between the modulator and the substrate to the intensity of the light emerging from the modulator. A positioning means calibration determines a look-up table relating control voltage to response by the positioning means. The modulator is moved over a portion of the substrate and then undergoes a positioning step, a fine onsite calibrating step, and a measuring step. The positioning step can be accomplished using the intensity of emerging light to determine modulator gap distance, and the response verses control voltage look-up table to determine a control signal to vertically position the modulator. The look-up tables permit the modulator to be position substantially parallel to the substrate at a desired gap distance using one step positioning.
    • 成像方法使用电光调制器产生被测衬底的电压分布或电容分布的二维图像。 粗调制器校准确定调制器中的非均匀性的影响,并且确定将调制器和衬底之间的间隙距离与从调制器出射的光的强度相关联的查找表。 定位装置校准确定将控制电压与定位装置的响应相关联的查找表。 调制器在衬底的一部分上移动,然后进行定位步骤,精细的现场校准步骤和测量步骤。 可以使用出现的光的强度来确定调制器间隙距离并且响应与控制电压查找表的确定步骤,以确定控制信号以垂直定位调制器。 查找表允许调制器使用一步定位以所需的间隙距离基本上平行于基板平齐。