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1. 发明申请

US20110311789A1 Methods for Attaching Flexible Substrates to Rigid Carriers and Resulting Devices 审中-公开
标题翻译：将柔性基板连接到刚性载体和结果装置的方法
公开(公告)号：US20110311789A1
公开(公告)日：2011-12-22
申请号：US13062020
申请日：2009-09-10
申请人： Douglas E. Loy , Shawn M. O'Rourke
发明人： Douglas E. Loy , Shawn M. O'Rourke
IPC分类号： B23K31/02 , B32B3/22
CPC分类号： H01L21/6835 , H01L2221/6835 , H05K1/0393 , H05K3/007 , H05K3/341 , Y10T428/24826
摘要： Flexible substrates can be temporarily attached to a rigid carrier for processing a surface thereof by depositing a joining material at one or more contact points between a flexible substrate and a rigid carrier, contacting the flexible substrate and the rigid carrier at the one or more contact points; and exposing the one or more contact points to a temperature of between 219° C. and 1000° C. and under conditions suitable for attaching the flexible substrate and the rigid carrier at the one or more contact points via the joining material. Examples of suitable joining materials include, but are not limited to soldering or brazing materials. Such supported substrates can be used for preparing flexible displays comprising at least one electronic component and/or circuit on a surface of the flexible display.
摘要翻译：柔性基底可以临时附接到刚性载体上，以通过在柔性基底和刚性载体之间的一个或多个接触点处沉积接合材料来处理其表面，在柔性基底和刚性载体之间，在一个或多个接触点 ; 以及将所述一个或多个接触点暴露于介于219℃和1000℃之间的温度下，以及适于通过所述接合材料在所述一个或多个接触点附接所述柔性基底和所述刚性载体的条件。合适的接合材料的实例包括但不限于焊接或钎焊材料。这种支撑的基底可以用于制备在柔性显示器的表面上包括至少一个电子部件和/或电路的柔性显示器。

2. 发明授权

US09155190B2 Method of preparing a flexible substrate assembly and flexible substrate assembly therefrom 有权
标题翻译：从其制备柔性基底组件和柔性基底组件的方法
公开(公告)号：US09155190B2
公开(公告)日：2015-10-06
申请号：US13913141
申请日：2013-06-07
申请人： Jesmin Haq , Scott Ageno , Douglas E. Loy , Shawn O'Rourke , Robert Naujokaitis
发明人： Jesmin Haq , Scott Ageno , Douglas E. Loy , Shawn O'Rourke , Robert Naujokaitis
IPC分类号： H05K1/00 , H05K1/02 , H05K3/00 , H05K1/18 , H05K1/03 , H05K3/28
CPC分类号： H05K1/0271 , H05K1/0277 , H05K1/0393 , H05K1/181 , H05K3/00 , H05K3/007 , H05K3/281 , H05K2201/0145 , H05K2201/0154 , H05K2201/068 , H05K2203/0152 , H05K2203/016 , H05K2203/0191 , H05K2203/1383 , Y10T156/10 , Y10T428/14 , Y10T428/1476 , Y10T428/23914 , Y10T428/24355 , Y10T428/24942 , Y10T428/26 , Y10T428/2848 , Y10T428/31515
摘要： Some embodiments include a method of preparing a flexible substrate assembly. Other embodiments of related methods and structures are also disclosed.
摘要翻译：一些实施例包括制备柔性基底组件的方法。还公开了相关方法和结构的其它实施方案。

3. 发明授权

US08481859B2 Method of preparing a flexible substrate assembly and flexible substrate assembly therefrom 有权
标题翻译：从其制备柔性基底组件和柔性基底组件的方法
公开(公告)号：US08481859B2
公开(公告)日：2013-07-09
申请号：US13118225
申请日：2011-05-27
申请人： Jesmin Haq , Scott Ageno , Douglas E. Loy , Shawn O'Rourke , Robert Naujokaitis
发明人： Jesmin Haq , Scott Ageno , Douglas E. Loy , Shawn O'Rourke , Robert Naujokaitis
IPC分类号： H05K1/00
CPC分类号： H05K1/0271 , H05K1/0277 , H05K1/0393 , H05K1/181 , H05K3/00 , H05K3/007 , H05K3/281 , H05K2201/0145 , H05K2201/0154 , H05K2201/068 , H05K2203/0152 , H05K2203/016 , H05K2203/0191 , H05K2203/1383 , Y10T156/10 , Y10T428/14 , Y10T428/1476 , Y10T428/23914 , Y10T428/24355 , Y10T428/24942 , Y10T428/26 , Y10T428/2848 , Y10T428/31515
摘要： Some embodiments teach a method of preparing a flexible substrate assembly. The method can include: (a) providing a carrier substrate; (b) providing a cross-linking adhesive; (c) providing a plastic substrate; and (d) coupling the carrier substrate to the plastic substrate using the cross-linking adhesive. Other embodiments are disclosed in this application.
摘要翻译：一些实施例教导了制备柔性衬底组件的方法。该方法可以包括：（a）提供载体衬底; （b）提供交联粘合剂; （c）提供塑料基材; 和（d）使用交联粘合剂将载体衬底连接到塑料衬底上。在本申请中公开了其它实施例。

4. 发明申请

US20130271930A1 Method Of Preparing A Flexible Substrate Assembly And Flexible Substrate Assembly Therefrom 有权
标题翻译：制备柔性基板组件和柔性基板组件的方法
公开(公告)号：US20130271930A1
公开(公告)日：2013-10-17
申请号：US13913141
申请日：2013-06-07
申请人： Jesmin Haq , Scott Ageno , Douglas E. Loy , Shawn O'Rourke , Robert Naujokaitis
发明人： Jesmin Haq , Scott Ageno , Douglas E. Loy , Shawn O'Rourke , Robert Naujokaitis
IPC分类号： H05K1/02 , H05K3/00 , H05K1/18
CPC分类号： H05K1/0271 , H05K1/0277 , H05K1/0393 , H05K1/181 , H05K3/00 , H05K3/007 , H05K3/281 , H05K2201/0145 , H05K2201/0154 , H05K2201/068 , H05K2203/0152 , H05K2203/016 , H05K2203/0191 , H05K2203/1383 , Y10T156/10 , Y10T428/14 , Y10T428/1476 , Y10T428/23914 , Y10T428/24355 , Y10T428/24942 , Y10T428/26 , Y10T428/2848 , Y10T428/31515
摘要： Some embodiments include a method of preparing a flexible substrate assembly. Other embodiments of related methods and structures are also disclosed.
摘要翻译：一些实施例包括制备柔性基底组件的方法。还公开了相关方法和结构的其它实施方案。

5. 发明申请

US20140254113A1 METHOD OF PROVIDING AN ELECTRONIC DEVICE STRUCTURE AND RELATED ELECTRONIC DEVICE STRUCTURES 审中-公开
标题翻译：提供电子设备结构的方法及相关的电子设备结构
公开(公告)号：US20140254113A1
公开(公告)日：2014-09-11
申请号：US14288771
申请日：2014-05-28
申请人： Emmett Howard , Douglas E. Loy , Nicholas Munizza
发明人： Emmett Howard , Douglas E. Loy , Nicholas Munizza
IPC分类号： H05K1/03 , H05K3/00 , H05K1/02
CPC分类号： H05K1/0393 , H05K3/007 , H05K2203/0152 , H05K2203/016 , H05K2203/0191 , H05K2203/1383 , Y10T156/10 , Y10T156/1052 , Y10T428/31507 , Y10T428/31616 , Y10T428/31623 , Y10T428/31645
摘要： Some embodiments include a method of providing an electronic device structure. Other embodiments for related methods and electronic device structures are also disclosed.
摘要翻译：一些实施例包括提供电子设备结构的方法。还公开了相关方法和电子器件结构的其它实施例。

6. 发明申请

US20110228492A1 METHOD OF PREPARING A FLEXIBLE SUBSTRATE ASSEMBLY AND FLEXIBLE SUBSTRATE ASSEMBLY THEREFROM 有权
标题翻译：制造柔性基板组件的方法和柔性基板组装
公开(公告)号：US20110228492A1
公开(公告)日：2011-09-22
申请号：US13118225
申请日：2011-05-27
申请人： Jesmin Haq , Scott Ageno , Douglas E. Loy , Shawn O'Rourke , Robert Naujokaitis
发明人： Jesmin Haq , Scott Ageno , Douglas E. Loy , Shawn O'Rourke , Robert Naujokaitis
IPC分类号： H05K1/00 , H05K1/18 , H05K3/00 , B32B37/02 , B32B37/06 , B32B37/12 , B32B37/14 , B32B38/10 , B32B38/00
CPC分类号： H05K1/0271 , H05K1/0277 , H05K1/0393 , H05K1/181 , H05K3/00 , H05K3/007 , H05K3/281 , H05K2201/0145 , H05K2201/0154 , H05K2201/068 , H05K2203/0152 , H05K2203/016 , H05K2203/0191 , H05K2203/1383 , Y10T156/10 , Y10T428/14 , Y10T428/1476 , Y10T428/23914 , Y10T428/24355 , Y10T428/24942 , Y10T428/26 , Y10T428/2848 , Y10T428/31515
摘要： Some embodiments teach a method of preparing a flexible substrate assembly. The method can include: (a) providing a carrier substrate; (b) providing a cross-linking adhesive; (c) providing a plastic substrate; and (d) coupling the carrier substrate to the plastic substrate using the cross-linking adhesive. Other embodiments are disclosed in this application.
摘要翻译：一些实施例教导了制备柔性基底组件的方法。该方法可以包括：（a）提供载体衬底; （b）提供交联粘合剂; （c）提供塑料基材; 和（d）使用交联粘合剂将载体衬底连接到塑料衬底上。在本申请中公开了其它实施例。

7. 发明授权

US06242115B1 OLEDs containing thermally stable asymmetric charge carrier materials 失效
标题翻译：含有热稳定的非对称电荷载体材料的OLED
公开(公告)号：US06242115B1
公开(公告)日：2001-06-05
申请号：US08925029
申请日：1997-09-08
申请人： Mark E. Thomson , Bryan E. Koene , Douglas E. Loy
发明人： Mark E. Thomson , Bryan E. Koene , Douglas E. Loy
IPC分类号： H05B3312
CPC分类号： C07C211/54 , C07C211/58 , H01L51/0059 , H01L51/006 , H01L51/0071 , H01L51/5012 , Y10S428/917 , Y10T428/31504
摘要： Organic light emitting devices are comprised of an organic charge carrier layer formed from a charge carrier material that is capable of forming a stable glass due to the presence of a compound having an asymmetric molecular structure in the charge carrier material. For example, the OLED may contain hole transporting layers comprised of compounds having an asymmetric molecular structure in which hole transporting substituents are asymmetrically located around a core atom or core chemical group. The core atom may be a nitrogen atom or the core chemical group may be comprised of a single phenylene group or a biphenylene group which is substituted with at least two hole transporting amine groups, wherein at least one of the amine groups is different from at least one other amine group. For example, the compound may have the asymmetric molecular structure as shown by formula I: wherein R1, R2, R3, R4, R5 and R6 are, independently of one another, hole transporting amine groups, or hydrogen, with the proviso that at least two amine groups are present and at least one of the amine groups is different from at least one other amine group. Typically, R1 and R4 are hole transporting amine groups wherein R1 is different from R4.
摘要翻译：有机发光器件包括由电荷载体材料形成的有机电荷载体层，该电荷载体材料由于在电荷载体材料中存在具有不对称分子结构的化合物而能够形成稳定的玻璃。例如，OLED可以包含由不对称分子结构的化合物构成的空穴传输层，其中空穴传输取代基不对称地位于核心原子或核心化学基团周围。核心原子可以是氮原子，或者核心化学基团可以由被至少两个空穴传输胺基取代的单个亚苯基或亚联苯基组成，其中至少一个胺基至少不同于另一个胺基团。例如，化合物可以具有如式I所示的不对称分子结构：其中R 1，R 2，R 3，R 4，R 5和R 6彼此独立地为空穴传输胺基或氢，条件是至少存在两个胺基团，并且至少一个胺基团不同于至少一个其它胺基团。通常，R 1和R 4是空穴传输胺基，其中R 1不同于R 4。

8. 发明授权

US09721825B2 Method of providing a flexible semiconductor device and flexible semiconductor device thereof 有权
公开(公告)号：US09721825B2
公开(公告)日：2017-08-01
申请号：US15096772
申请日：2016-04-12
申请人： Michael A. Marrs , Emmett M. Howard , Douglas E. Loy , Nicholas Munizza
发明人： Michael A. Marrs , Emmett M. Howard , Douglas E. Loy , Nicholas Munizza
IPC分类号： H05K3/07 , H01L21/683 , H01L21/311 , H05K3/00 , H05K1/03 , H05K3/28
CPC分类号： H01L21/6835 , H01L21/31138 , H01L2221/6835 , H01L2221/68381 , H05K1/0393 , H05K3/007 , H05K3/281 , H05K2203/0152 , H05K2203/016 , H05K2203/0191 , H05K2203/1383 , Y10T156/10 , Y10T428/14 , Y10T428/1476 , Y10T428/23914 , Y10T428/24355 , Y10T428/24942 , Y10T428/26 , Y10T428/2848 , Y10T428/31515
摘要： Some embodiments include a method. The method can include providing a carrier substrate having an edge. Further, the method can include providing a cross-linking adhesive, and providing a flexible substrate having an edge. Further still, the method can include coupling the flexible substrate to the carrier substrate using the cross-linking adhesive such that at least a portion of the edge of the flexible substrate is recessed from the edge of the carrier substrate and such that the cross-linking adhesive has an exposed portion of the cross-linking adhesive at an offset portion of the first surface of the carrier substrate between the at least the portion of the edge of the flexible substrate and the edge of the carrier substrate. Meanwhile, the method can include etching the exposed portion of the cross-linking adhesive. Other embodiments of related methods and devices are also disclosed.

9. 发明申请

US20160225653A1 METHOD OF PROVIDING A FLEXIBLE SEMICONDUCTOR DEVICE AND FLEXIBLE SEMICONDUCTOR DEVICE THEREOF 有权
标题翻译：提供柔性半导体器件及其柔性半导体器件的方法
公开(公告)号：US20160225653A1
公开(公告)日：2016-08-04
申请号：US15096772
申请日：2016-04-12
申请人： Michael A. Marrs , Emmett M. Howard , Douglas E. Loy , Nicholas Munizza
发明人： Michael A. Marrs , Emmett M. Howard , Douglas E. Loy , Nicholas Munizza
IPC分类号： H01L21/683 , H01L21/311
CPC分类号： H01L21/6835 , H01L21/31138 , H01L2221/6835 , H01L2221/68381 , H05K1/0393 , H05K3/007 , H05K3/281 , H05K2203/0152 , H05K2203/016 , H05K2203/0191 , H05K2203/1383 , Y10T156/10 , Y10T428/14 , Y10T428/1476 , Y10T428/23914 , Y10T428/24355 , Y10T428/24942 , Y10T428/26 , Y10T428/2848 , Y10T428/31515
摘要： Some embodiments include a method. The method can include providing a carrier substrate having an edge. Further, the method can include providing a cross-linking adhesive, and providing a flexible substrate having an edge. Further still, the method can include coupling the flexible substrate to the carrier substrate using the cross-linking adhesive such that at least a portion of the edge of the flexible substrate is recessed from the edge of the carrier substrate and such that the cross-linking adhesive has an exposed portion of the cross-linking adhesive at an offset portion of the first surface of the carrier substrate between the at least the portion of the edge of the flexible substrate and the edge of the carrier substrate. Meanwhile, the method can include etching the exposed portion of the cross-linking adhesive. Other embodiments of related methods and devices are also disclosed.
摘要翻译：一些实施例包括一种方法。该方法可以包括提供具有边缘的载体衬底。此外，该方法可以包括提供交联粘合剂，并提供具有边缘的柔性基材。此外，该方法可以包括使用交联粘合剂将柔性基底连接到载体基底上，使得柔性基底的边缘的至少一部分从载体基底的边缘凹陷，并且使得交联粘合剂在载体基材的第一表面的偏移部分处具有在柔性基材的边缘的至少部分与载体基材的边缘之间的交联粘合剂的暴露部分。同时，该方法可以包括蚀刻交联粘合剂的暴露部分。还公开了相关方法和装置的其它实施例。

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