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1. 发明申请

US20090205854A1 Printed circuit board for a package and manufacturing method thereof 审中-公开
标题翻译：一种封装用印刷电路板及其制造方法
公开(公告)号：US20090205854A1
公开(公告)日：2009-08-20
申请号：US12219140
申请日：2008-07-16
申请人： Dong-Gyu Lee , Jin-Won Choi , Ki-Young Yoo , Tae-Joon Chung
发明人： Dong-Gyu Lee , Jin-Won Choi , Ki-Young Yoo , Tae-Joon Chung
IPC分类号： H05K1/09 , H05K3/00
CPC分类号： H05K3/243 , H01L2224/16 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H05K1/0269 , H05K3/0035 , H05K3/244 , H05K3/282 , H05K3/3452 , H05K3/3473 , H05K2201/0391 , H05K2201/09918 , H05K2203/054 , Y10T29/49149 , H01L2924/00
摘要： A printed circuit board for use in a package and to a method of manufacturing the printed circuit board. The method of manufacturing the printed circuit board can include: providing a substrate, on one side of which at least one solder pad and at least one guide pad are formed; forming a solder resist layer over the one side of the substrate; uncovering at least one portion of the solder resist layer such that the guide pad is exposed; applying a surface treatment on the exposed guide pad; uncovering at least one portion of the solder resist layer such that the solder pad is exposed; and forming a solder bump on the exposed solder pad. With this method, the amount of surface treatment applied can be minimized, for reduced costs, and the occurrence of undiffused layers can be avoided, for improved reliability in the final product.
摘要翻译：一种用于封装的印刷电路板和制造印刷电路板的方法。制造印刷电路板的方法可以包括：提供衬底，在衬底的一侧上形成至少一个焊盘和至少一个引导垫; 在衬底的一侧上形成阻焊层; 露出阻焊层的至少一部分，使得引导垫暴露; 在暴露的导向垫上进行表面处理; 露出阻焊层的至少一部分，使焊料焊盘露出; 并在暴露的焊盘上形成焊料凸块。通过这种方法，可以最小化施加的表面处理量，从而降低成本，并且可以避免出现未扩散的层，从而提高最终产品的可靠性。

2. 发明授权

US07736952B2 Wafer packaging method 失效
标题翻译：晶圆包装方法
公开(公告)号：US07736952B2
公开(公告)日：2010-06-15
申请号：US12010544
申请日：2008-01-25
申请人： Soon-Jin Cho , Jin-Won Choi , Seung-Hyun Cho , Chung-Woo Cho , Dong-Gyu Lee , Seok-Hwan Ahn
发明人： Soon-Jin Cho , Jin-Won Choi , Seung-Hyun Cho , Chung-Woo Cho , Dong-Gyu Lee , Seok-Hwan Ahn
IPC分类号： H01L21/00 , H01L21/58
CPC分类号： H01L24/11 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05024 , H01L2224/05147 , H01L2224/05571 , H01L2224/05572 , H01L2224/056 , H01L2224/13099 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/00014
摘要： A wafer packaging method is disclosed.An aspect of the invention is to provide a wafer packaging method comprising; attaching tape onto one side of a carrier, the carrier having a through-hole formed therein; attaching a wafer onto the tape exposed inside the through-hole such that at least one electrode of the wafer is exposed; and performing a packaging process on the carrier such that the wafer is packaged.
摘要翻译：公开了一种晶片封装方法。本发明的一个方面是提供一种晶片封装方法，包括：将带附着到载体的一侧上，所述载体具有形成在其中的通孔; 将晶片附接到暴露在通孔内的带上，使得晶片的至少一个电极露出; 以及在所述载体上执行封装处理以使所述晶片被封装。

3. 发明申请

US20090087950A1 Wafer packaging method 失效
标题翻译：晶圆包装方法
公开(公告)号：US20090087950A1
公开(公告)日：2009-04-02
申请号：US12010544
申请日：2008-01-25
申请人： Soon-Jin Cho , Jin-Won Choi , Seung-Hyun Cho , Chung-Woo Cho , Dong-Gyu Lee , Seok-Hwan Ahn
发明人： Soon-Jin Cho , Jin-Won Choi , Seung-Hyun Cho , Chung-Woo Cho , Dong-Gyu Lee , Seok-Hwan Ahn
IPC分类号： H01L21/58
CPC分类号： H01L24/11 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05024 , H01L2224/05147 , H01L2224/05571 , H01L2224/05572 , H01L2224/056 , H01L2224/13099 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/00014
摘要： A wafer packaging method is disclosed.An aspect of the invention is to provide a wafer packaging method comprising; attaching tape onto one side of a carrier, the carrier having a through-hole formed therein; attaching a wafer onto the tape exposed inside the through-hole such that at least one electrode of the wafer is exposed; and performing a packaging process on the carrier such that the wafer is packaged.
摘要翻译：公开了一种晶片封装方法。本发明的一个方面是提供一种晶片封装方法，包括：将带附着到载体的一侧上，所述载体具有形成在其中的通孔; 将晶片附接到暴露在通孔内的带上，使得晶片的至少一个电极露出; 以及在所述载体上执行封装处理以使所述晶片被封装。

4. 发明申请

US20110012261A1 Post bump and method of forming the same 审中-公开
标题翻译：后凸块及其形成方法
公开(公告)号：US20110012261A1
公开(公告)日：2011-01-20
申请号：US12923453
申请日：2010-09-22
申请人： Jin-Won Choi , Chang-Suo Ryu , Seung-Hyun Cho , Seung-Wan Kim
发明人： Jin-Won Choi , Chang-Suo Ryu , Seung-Hyun Cho , Seung-Wan Kim
IPC分类号： H01L23/48
CPC分类号： H05K3/3484 , H01L21/4853 , H01L23/49816 , H01L24/02 , H01L24/03 , H01L24/11 , H01L24/12 , H01L24/16 , H01L2224/0401 , H01L2224/1131 , H01L2224/1147 , H01L2224/11901 , H01L2224/13022 , H01L2224/1308 , H01L2224/13082 , H01L2224/13111 , H01L2224/13147 , H01L2224/16 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/30105 , H01L2924/3025 , H05K3/243 , H05K3/4007 , H05K2201/0367 , H05K2203/043 , H05K2203/054 , H05K2203/0568 , H05K2203/0571 , Y10T29/49155 , H01L2924/00014 , H01L2224/13099 , H01L2224/29099
摘要： A post bump formed over an electrode pad of a substrate for electrically connecting to an external device, the post bump including a metal post formed over the electrode pad; and a solder formed over the metal post and shaped as a dome, the dome occupying a space defined by imaginary lines extending from a perimeter of the metal post along an axial direction of the metal post.
摘要翻译：在用于电连接到外部装置的基板的电极焊盘上形成的凸块，所述柱凸起包括形成在所述电极焊盘上的金属柱; 以及形成在所述金属柱上并形成为圆顶的焊料，所述圆顶占据由沿所述金属柱的轴向方向从所述金属柱的周边延伸的假想线限定的空间。

5. 发明授权

US07595292B2 Conjugated biological molecules and their preparation 有权
标题翻译：共轭生物分子及其制备
公开(公告)号：US07595292B2
公开(公告)日：2009-09-29
申请号：US10564340
申请日：2004-07-12
申请人： Stephen James Brocchini , Antony Robert Godwin , Elisa Pedone , Jin-Won Choi , Sunil Shaunak
发明人： Stephen James Brocchini , Antony Robert Godwin , Elisa Pedone , Jin-Won Choi , Sunil Shaunak
IPC分类号： A61K38/16 , A61K39/00
CPC分类号： A61K47/48215 , A61K47/60
摘要： Novel biologically active compounds of the general formula (I) in which one of X and X′ represents a polymer, and the other represents a hydrogen atom; each Q independently represents a linking group; W represents an electron-withdrawing moiety or a moiety preparable by reduction of an electron-withdrawing moiety; or, if X′ represents a polymer, X-Q-W- together may represent an electron withdrawing group; and in addition, if X represents a polymer, X′ and electron withdrawing group W together with the interjacent atoms may form a ring; each of Z1 and Z2 independently represents a group derived from a biological molecule, each of which is linked to A and B via a nucleophilic moiety; or Z1 and Z2 together represent a single group derived from a biological molecule which is linked to A and B via two nucleophilic moieties; A is a C1-5 alkylene or alkenylene chain; and B is a bond or a C1-4 alkylene or alkenylene chain; are formed by conjugating a suitable polymer to a suitable biologically active molecule via nucleophilic groups in said molecule, preferably via a disulphide bridge.
摘要翻译：通式（I）的新型生物活性化合物，其中X和X'之一表示聚合物，另一个表示氢原子; 每个Q独立地表示连接基团; W表示吸电子部分或可通过还原吸电子部分制备的部分; 或者如果X'代表聚合物，则X-Q-W一起可以代表吸电子基团; 此外，如果X表示聚合物，则X'和吸电子基团W与中间原子一起可以形成环; Z 1和Z 2各自独立地表示衍生自生物分子的基团，其各自经由亲核部分与A和B连接; 或Z 1和Z 2一起表示衍生自经由两个亲核部分与A和B连接的生物分子的单一基团; A是C 1-5亚烷基或亚烯基链; 和B是键或C 1-4亚烷基或亚烯基链; 通过将所述分子中的亲核基团，优选通过二硫桥将合适的聚合物与合适的生物活性分子缀合而形成。

6. 发明申请

US20090184420A1 Post bump and method of forming the same 审中-公开
标题翻译：后凸块及其形成方法
公开(公告)号：US20090184420A1
公开(公告)日：2009-07-23
申请号：US12213466
申请日：2008-06-19
申请人： Jin-Won Choi , Chang-Sup Ryu , Seung-Hyun Cho , Seung-Wan Kim
发明人： Jin-Won Choi , Chang-Sup Ryu , Seung-Hyun Cho , Seung-Wan Kim
IPC分类号： H01L23/488 , H01L21/44 , H05K3/00 , H05K1/00
CPC分类号： H05K3/3484 , H01L21/4853 , H01L23/49816 , H01L24/02 , H01L24/03 , H01L24/11 , H01L24/12 , H01L24/16 , H01L2224/0401 , H01L2224/1131 , H01L2224/1147 , H01L2224/11901 , H01L2224/13022 , H01L2224/1308 , H01L2224/13082 , H01L2224/13111 , H01L2224/13147 , H01L2224/16 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/30105 , H01L2924/3025 , H05K3/243 , H05K3/4007 , H05K2201/0367 , H05K2203/043 , H05K2203/054 , H05K2203/0568 , H05K2203/0571 , Y10T29/49155 , H01L2924/00014 , H01L2224/13099 , H01L2224/29099
摘要： A post bump and a method of forming the post bump are disclosed. The method of forming the post bump can include: forming a resist layer, in which an aperture is formed in correspondence to a position of an electrode pad, over a substrate, on which the electrode pad is formed; forming a metal post by filling a part of the aperture with a metallic material; filling a remaining part of the aperture with solder; reflowing the solder by applying heat; and removing the resist layer. This method can be utilized to prevent deviations in the plated solder and prevent the unnecessary flowing of the solder over the sides of the metal post during reflowing, so that the amount of solder used can be minimized.
摘要翻译：公开了一种后凸块和形成凸块的方法。形成后凸块的方法可以包括：在其上形成有电极焊盘的基板上形成抗蚀剂层，其中形成有孔对应于电极焊盘的位置; 通过用金属材料填充孔的一部分来形成金属柱; 用焊料填充孔的剩余部分; 通过加热回流焊料; 并除去抗蚀剂层。该方法可以用于防止电镀焊料中的偏差，并且防止在回流期间焊料在金属柱的侧面上不必要的流动，使得可以使所使用的焊料的量最小化。

7. 发明授权

US09292199B2 Function execution method and apparatus thereof 有权
标题翻译：功能执行方法及其装置
公开(公告)号：US09292199B2
公开(公告)日：2016-03-22
申请号：US12557322
申请日：2009-09-10
申请人： Jin-Won Choi
发明人： Jin-Won Choi
IPC分类号： G06F3/0488
CPC分类号： G06F3/04886 , G06F3/0488 , G06F3/04883
摘要： A function execution method and apparatus thereof for displaying one or more sub-functions included in a function selected by a first touch on a trace according to a second touch input based upon the first and the second touches inputted with a timing difference, and executing the relevant sub-function selected among the displayed one or more sub-functions. For this purpose, a function execution method according to the present invention is performed by comprising: detecting a first touch input touched on a display unit; detecting a drag created by a second touch inputted while maintaining the first touch; and displaying one or more sub-functions included in a function selected by the first touch along a trace of the detected drag on the display unit.
摘要翻译：一种功能执行方法及其装置，用于根据基于以定时差输入的第一触摸和第二触摸，根据第二触摸输入，在轨迹上由第一次触摸选择的功能中包含的一个或多个子功能，以及执行在显示的一个或多个子功能中选择相关子功能。为此，根据本发明的功能执行方法包括：检测在显示单元上触摸的第一触摸输入; 检测在保持第一次触摸的同时输入的第二触摸产生的拖动; 以及在所述显示单元上沿着所述检测到的拖动的迹线，显示包括在由所述第一触摸选择的功能中的一个或多个子功能。

8. 发明申请

US20060210526A1 Conjugated biological molecules and their preparation 有权
标题翻译：共轭生物分子及其制备
公开(公告)号：US20060210526A1
公开(公告)日：2006-09-21
申请号：US10564340
申请日：2004-07-12
申请人： Stephen Brocchini , Antony Godwin , Elisa Pedone , Jin-Won Choi , Sunil Shaunak
发明人： Stephen Brocchini , Antony Godwin , Elisa Pedone , Jin-Won Choi , Sunil Shaunak
IPC分类号： A61K38/16 , A61K31/785 , C08G63/91 , C08G63/48
CPC分类号： A61K47/48215 , A61K47/60
摘要： Novel biologically active compounds of the general formula (I) in which one of X and X′ represents a polymer, and the other represents a hydrogen atom; each Q independently represents a linking group; W represents an electron-withdrawing moiety or a moiety preparable by reduction of an electron-withdrawing moiety; or, if X′ represents a polymer, X-Q-W- together may represent an electron withdrawing group; and in addition, if X represents a polymer, X′ and electron withdrawing group W together with the interjacent atoms may form a ring; each of Z1 and Z2 independently represents a group derived from a biological molecule, each of which is linked to A and B via a nucleophilic moiety; or Z1 and Z2 together represent a single group derived from a biological molecule which is linked to A and B via two nucleophilic moieties; A is a C1-5 alkylene or alkenylene chain; and B is a bond or a C1-4 alkylene or alkenylene chain; are formed by conjugating a suitable polymer to a suitable biologically active molecule via nucleophilic groups in said molecule, preferably via a disulphide bridge.
摘要翻译：通式（I）的新型生物活性化合物，其中X和X'之一表示聚合物，另一个表示氢原子; 每个Q独立地表示连接基团; W表示吸电子部分或可通过还原吸电子部分制备的部分; 或者如果X'代表聚合物，则X-Q-W一起可以代表吸电子基团; 此外，如果X表示聚合物，则X'和吸电子基团W与中间原子一起可以形成环; Z 1和Z 2各自独立地表示衍生自生物分子的基团，其各自通过亲核部分连接到A和B; 或Z 1和Z 2一起代表衍生自经由两个亲核部分与A和B连接的生物分子的单一基团; A是C 1-5亚烷基或亚烯基链; 和B是键或C 1-4亚烷基或亚烯基链; 通过将所述分子中的亲核基团，优选通过二硫桥将合适的聚合物与合适的生物活性分子缀合而形成。

9. 发明申请

US20120100391A1 HOT-DIP GALVANIZED STEEL SHEET HAVING EXCELLENT PLATING QUALITIES, PLATING ADHESION AND SPOT WELDABILITY AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：具有优良镀层质量的镀锌钢板，镀层粘合性和点焊性及其制造方法
公开(公告)号：US20120100391A1
公开(公告)日：2012-04-26
申请号：US13059279
申请日：2010-11-24
申请人： Jung-Woo Lee , Myung-Soo Kim , Seung-Bok Lee , Jin-Won Choi , Du-Youl Choi , Young-Ha Kim , Ju-Youn Lee , Dae-Young Kang
发明人： Jung-Woo Lee , Myung-Soo Kim , Seung-Bok Lee , Jin-Won Choi , Du-Youl Choi , Young-Ha Kim , Ju-Youn Lee , Dae-Young Kang
IPC分类号： B32B15/01 , B05D3/02 , B05D1/36 , B05D1/18
CPC分类号： C23C2/02 , B23K35/0261 , B23K35/3053 , B32B15/013 , B32B15/015 , C21D9/46 , C22C18/04 , C22C38/02 , C22C38/04 , C22C38/06 , C23C2/06 , C23C2/28 , Y10T428/12799
摘要： Provided is a hot-dip galvanized steel sheet having excellent plating qualities, plating adhesion and spot weldability, in which an alloy phase is formed at the interface between a base steel sheet and a galvanized layer, and a manufacturing method thereof.
摘要翻译：本发明提供一种在基材钢板和镀锌层之间的界面处形成合金相的电镀质量，电镀附着力和点焊性优异的热浸镀锌钢板及其制造方法。

10. 发明申请

US20100271792A1 ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：电子元件封装及其制造方法
公开(公告)号：US20100271792A1
公开(公告)日：2010-10-28
申请号：US12612158
申请日：2009-11-04
申请人： Jin-Won Choi , Soon-Jin Cho , Hueng-Jae Oh , Seung-Wan Kim , Seon-Jae Mun
发明人： Jin-Won Choi , Soon-Jin Cho , Hueng-Jae Oh , Seung-Wan Kim , Seon-Jae Mun
IPC分类号： H05K7/02 , B23K31/02
CPC分类号： B23K1/0016 , B23K2101/42 , H01L2224/05001 , H01L2224/05026 , H01L2224/05568 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/81192 , H01L2224/92125 , H01L2924/00014 , H05K3/243 , H05K3/3452 , H05K2201/0367 , H05K2201/0989 , H05K2203/054 , H01L2924/00 , H01L2224/05599 , H01L2224/05099
摘要： An electronic component package and a method of manufacturing the same are disclosed. The method can include: providing a board, on which a multiple number of pads are formed; forming a solder resist layer, in which an opening superimposing over all of the pads is formed, on the board; forming metal posts over the pads, respectively; mounting an electronic component on the board by bonding the electrodes to the metal posts; and forming an underfill resin layer in the opening such that the underfill resin layer is interposed between the electronic component and the board. The solder resist layer may function as a dam that prevents the underfill resin layer from leaking in lateral directions during the subsequent underfill process so that the additional processes, such as dispensing, etc., that were required for forming a separate dam can be omitted, and the process time and costs can be reduced.
摘要翻译：公开了一种电子部件封装及其制造方法。该方法可以包括：提供一个板，其上形成多个焊盘; 形成阻焊层，其中在所述板上形成叠加在所有焊盘上的开口; 分别在焊盘上形成金属柱; 通过将电极粘合到金属柱上来将电子部件安装在电路板上; 并且在开口中形成底部填充树脂层，使得底部填充树脂层插入在电子部件和板之间。阻焊层可以用作防止底部填充树脂层在随后的底部填充过程中在侧向泄漏的坝，从而可以省略形成单独的坝所需的附加过程，例如分配等，并且可以减少处理时间和成本。

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