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1. 发明申请

US20070284993A1 Side Illumination Lens and Luminescent Device Using the Same 有权
标题翻译：侧面照明镜头和使用其的发光装置
公开(公告)号：US20070284993A1
公开(公告)日：2007-12-13
申请号：US11576882
申请日：2005-10-07
申请人： Do-Hyung Kim , Chung-Hoon Lee , Keon-Young Lee , Kwang-Il Park
发明人： Do-Hyung Kim , Chung-Hoon Lee , Keon-Young Lee , Kwang-Il Park
IPC分类号： F21K2/00 , G02B17/00
CPC分类号： G02B19/0071 , G02B19/0028 , G02B19/0061 , H01L33/54 , H01L2224/48091 , H01L2224/48247 , H01L2924/19107 , H01L2924/00014
摘要： The present invention relates to a side illumination lens and a luminescent device using the same, and provides a body, a total reflection surface with a total reflection slope with respect to a central axis of the body, and a linear and/or curved refractive surface(s) formed to extend from a periphery of the total reflection surface; and a luminescent device including the lens. According to the present invention, a lens with total internal reflection surfaces with different slopes, and a linear and/or curved refractive surface(s) allows light emitted forward from a luminescent chip to be guided to a side of the lens. Further, a linear surface(s) formed in a direction perpendicular or parallel to a central axis of a lens and a curved surface are formed on an edge of the lens so that a process of fabricating the lens is facilitated, thereby reducing a defective rate and fabrication costs of the lens.
摘要翻译：本发明涉及一种侧面照明透镜及其使用该发光装置的发光装置，其特征在于，具有相对于所述主体的中心轴线具有全反射斜率的全身反射面以及直线和/或弯曲的折射面形成为从全反射表面的周边延伸; 以及包括该透镜的发光装置。根据本发明，具有具有不同斜率的全内反射表面以及线性和/或弯曲折射表面的透镜允许从发光芯片向前发射的光被引导到透镜的一侧。此外，在透镜的边缘上形成在垂直于或平行于透镜的中心轴线的方向上形成的线性表面，从而便于制造透镜的工艺，从而降低了缺陷率和镜头的制造成本。

2. 发明授权

US07748873B2 Side illumination lens and luminescent device using the same 有权
标题翻译：侧面照明镜头及使用其的发光装置
公开(公告)号：US07748873B2
公开(公告)日：2010-07-06
申请号：US11576882
申请日：2005-10-07
申请人： Do-Hyung Kim , Chung-Hoon Lee , Keon-Young Lee , Kwang-Il Park
发明人： Do-Hyung Kim , Chung-Hoon Lee , Keon-Young Lee , Kwang-Il Park
IPC分类号： F21V5/00
CPC分类号： G02B19/0071 , G02B19/0028 , G02B19/0061 , H01L33/54 , H01L2224/48091 , H01L2224/48247 , H01L2924/19107 , H01L2924/00014
摘要： The present invention relates to a side illumination lens and a luminescent device using the same, and provides a body, a total reflection surface with a total reflection slope with respect to a central axis of the body, and a linear and/or curved refractive surface(s) formed to extend from a periphery of the total reflection surface; and a luminescent device including the lens. According to the present invention, a lens with total internal reflection surfaces with different slopes, and a linear and/or curved refractive surface(s) allows light emitted forward from a luminescent chip to be guided to a side of the lens. Further, a linear surface(s) formed in a direction perpendicular or parallel to a central axis of a lens and a curved surface are formed on an edge of the lens so that a process of fabricating the lens is facilitated, thereby reducing a defective rate and fabrication costs of the lens.
摘要翻译：本发明涉及一种侧面照明透镜及其使用该发光装置的发光装置，其特征在于，具有相对于所述主体的中心轴线具有全反射斜率的全身反射面以及直线和/或弯曲的折射面形成为从全反射表面的周边延伸; 以及包括该透镜的发光装置。根据本发明，具有具有不同斜率的全内反射表面以及线性和/或弯曲折射表面的透镜允许从发光芯片向前发射的光被引导到透镜的一侧。此外，在透镜的边缘上形成在垂直于或平行于透镜的中心轴线的方向上形成的线性表面，从而便于制造透镜的工艺，从而降低了缺陷率和镜头的制造成本。

3. 发明授权

US07901113B2 Side illumination lens and luminescent device using the same 有权
标题翻译：侧面照明镜头及使用其的发光装置
公开(公告)号：US07901113B2
公开(公告)日：2011-03-08
申请号：US12730856
申请日：2010-03-24
申请人： Do-Hyung Kim , Chung-Hoon Lee , Keon-Young Lee , Kwang-Il Park
发明人： Do-Hyung Kim , Chung-Hoon Lee , Keon-Young Lee , Kwang-Il Park
IPC分类号： F21V5/00
CPC分类号： G02B19/0071 , G02B19/0028 , G02B19/0061 , H01L33/54 , H01L2224/48091 , H01L2224/48247 , H01L2924/19107 , H01L2924/00014
摘要： The present invention relates to a side illumination lens and a luminescent device using the same, and provides a body, a total reflection surface with a total reflection slope with respect to a central axis of the body, and a linear and/or curved refractive surface(s) formed to extend from a periphery of the total reflection surface; and a luminescent device including the lens. According to the present invention, a lens with total internal reflection surfaces with different slopes, and a linear and/or curved refractive surface(s) allows light emitted forward from a luminescent chip to be guided to a side of the lens. Further, a linear surface(s) formed in a direction perpendicular or parallel to a central axis of a lens and a curved surface are formed on an edge of the lens so that a process of fabricating the lens is facilitated, thereby reducing a defective rate and fabrication costs of the lens.
摘要翻译：本发明涉及一种侧面照明透镜及其使用该发光装置的发光装置，其特征在于，具有相对于所述主体的中心轴线具有全反射斜率的全身反射面以及直线和/或弯曲的折射面形成为从全反射表面的周边延伸; 以及包括该透镜的发光装置。根据本发明，具有具有不同斜率的全内反射表面以及线性和/或弯曲折射表面的透镜允许从发光芯片向前发射的光被引导到透镜的一侧。此外，在透镜的边缘上形成在垂直于或平行于透镜的中心轴线的方向上形成的线性表面，从而便于制造透镜的工艺，从而降低了缺陷率和镜头的制造成本。

4. 发明申请

US20100220485A1 SIDE ILLUMINATION LENS AND LUMINESCENT DEVICE USING THE SAME 有权
标题翻译：使用相同的侧面照明镜头和发光装置
公开(公告)号：US20100220485A1
公开(公告)日：2010-09-02
申请号：US12730856
申请日：2010-03-24
申请人： Do-Hyung Kim , Chung-Hooon Lee , Keon-Young Lee , Kwang-Il Park
发明人： Do-Hyung Kim , Chung-Hooon Lee , Keon-Young Lee , Kwang-Il Park
IPC分类号： F21V13/04
CPC分类号： G02B19/0071 , G02B19/0028 , G02B19/0061 , H01L33/54 , H01L2224/48091 , H01L2224/48247 , H01L2924/19107 , H01L2924/00014
摘要： The present invention relates to a side illumination lens and a luminescent device using the same, and provides a body, a total reflection surface with a total reflection slope with respect to a central axis of the body, and a linear and/or curved refractive surface(s) formed to extend from a periphery of the total reflection surface; and a luminescent device including the lens. According to the present invention, a lens with total internal reflection surfaces with different slopes, and a linear and/or curved refractive surface(s) allows light emitted forward from a luminescent chip to be guided to a side of the lens. Further, a linear surface(s) formed in a direction perpendicular or parallel to a central axis of a lens and a curved surface are formed on an edge of the lens so that a process of fabricating the lens is facilitated, thereby reducing a defective rate and fabrication costs of the lens.
摘要翻译：本发明涉及一种侧面照明透镜及其使用该发光装置的发光装置，其特征在于，具有相对于所述主体的中心轴线具有全反射斜率的全身反射面以及直线和/或弯曲的折射面形成为从全反射表面的周边延伸; 以及包括该透镜的发光装置。根据本发明，具有具有不同斜率的全内反射表面以及线性和/或弯曲折射表面的透镜允许从发光芯片向前发射的光被引导到透镜的一侧。此外，在透镜的边缘上形成在垂直于或平行于透镜的中心轴线的方向上形成的线性表面，从而便于制造透镜的工艺，从而降低了缺陷率和镜头的制造成本。

5. 发明授权

US07042022B2 Chip light emitting diode and fabrication method thereof 有权
标题翻译：芯片发光二极管及其制造方法
公开(公告)号：US07042022B2
公开(公告)日：2006-05-09
申请号：US10754389
申请日：2004-01-09
申请人： Kwan-Young Han , Do-Hyung Kim , Seung-Man Yang , Chung-Hoon Lee , Hong-San Kim , Kwang-Il Park
发明人： Kwan-Young Han , Do-Hyung Kim , Seung-Man Yang , Chung-Hoon Lee , Hong-San Kim , Kwang-Il Park
IPC分类号： H01L29/22
CPC分类号： H01L33/54 , H01L33/486 , H01L2224/48091 , H01L2924/1815 , H01L2924/00014
摘要： A chip light emitting diode having a wide viewing angle, and a fabrication method thereof. The chip light emitting diode has a resin package sealing a light emitting chip which has at least one curved projecting part. The curved projecting part has a cross section which is substantially semicircular, or substantially or partially elliptical or parabolic. The curved projecting part preferably has a cross section which is comprised of a plurality of straight lines, an angle being formed between adjacent lines. The cross section is elongated to form a cylindrical outer surface of the resin package.
摘要翻译：具有宽视角的芯片发光二极管及其制造方法。芯片发光二极管具有密封具有至少一个弯曲突出部分的发光芯片的树脂封装。弯曲的突出部分具有基本上是半圆形的或基本上或部分是椭圆形或抛物线形的横截面。弯曲的突出部分优选地具有由多条直线组成的横截面，在相邻线之间形成一角度。横截面是细长的以形成树脂封装的圆柱形外表面。

6. 再颁专利

USRE42112E1 Chip light emitting diode and fabrication method thereof 有权
标题翻译：芯片发光二极管及其制造方法
公开(公告)号：USRE42112E1
公开(公告)日：2011-02-08
申请号：US11652468
申请日：2007-01-11
申请人： Kwan-Young Han , Do-Hyung Kim , Seung-Man Yang , Chung-Hoon Lee , Hong-San Kim , Kwang-Il Park
发明人： Kwan-Young Han , Do-Hyung Kim , Seung-Man Yang , Chung-Hoon Lee , Hong-San Kim , Kwang-Il Park
IPC分类号： H01L29/22
CPC分类号： H01L33/54 , H01L33/486 , H01L2224/48091 , H01L2924/1815 , H01L2924/00014
摘要： A chip light emitting diode having a wide viewing angle, and a fabrication method thereof. The chip light emitting diode has a resin package sealing a light emitting chip which has at least one curved projecting part. The curved projecting part has a cross section which is substantially semicircular, or substantially or partially elliptical or parabolic. The curved projecting part preferably has a cross section which is comprised of a plurality of straight lines, an angle being formed between adjacent lines. The cross section is elongated to form a cylindrical outer surface of the resin package.
摘要翻译：具有宽视角的芯片发光二极管及其制造方法。芯片发光二极管具有密封具有至少一个弯曲突出部分的发光芯片的树脂封装。弯曲的突出部分具有基本上是半圆形的或基本上或部分是椭圆形或抛物线形的横截面。弯曲的突出部分优选地具有由多条直线组成的横截面，在相邻线之间形成一角度。横截面是细长的以形成树脂封装的圆柱形外表面。

7. 发明申请

US20080023721A1 Light Emitting Diode Package Having Multiple Molding Resins 有权
标题翻译：具有多个成型树脂的发光二极管封装
公开(公告)号：US20080023721A1
公开(公告)日：2008-01-31
申请号：US11575128
申请日：2005-06-23
申请人： Chung-Hoon Lee , Do-Hyung Kim , Keon-Young Lee
发明人： Chung-Hoon Lee , Do-Hyung Kim , Keon-Young Lee
IPC分类号： H01L29/22
CPC分类号： H01L33/52 , H01L33/486 , H01L33/56 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/12041 , H01L2924/19107 , H01L2924/00 , H01L2924/00014
摘要： Disclosed is a light emitting diode (LED) package having multiple molding resins. The LED package includes a pair of lead terminals. At least portions of the pair of lead terminals are embedded in a package main body. The package main body has an opening through which the pair of lead terminals is exposed. An LED die is mounted in the opening and electrically connected to the pair of lead terminals. A first molding resin covers the LED die. A second molding resin with higher hardness than the first molding resin covers the first molding resin. Therefore, stress to be imposed on the LED die can be reduced and the deformation of the molding resins can be prevented.
摘要翻译：公开了具有多个成型树脂的发光二极管（LED）封装。 LED封装包括一对引线端子。一对引线端子的至少一部分嵌入在封装主体中。包装主体具有一对开口，一对引线端子通过该开口露出。 LED管芯安装在开口中并电连接到一对引线端子。第一模塑树脂覆盖LED芯片。具有比第一模塑树脂硬度更高的第二模塑树脂覆盖第一模塑树脂。因此，可以减少施加在LED模具上的应力，并且可以防止模塑树脂的变形。

8. 发明申请

US20050017259A1 Chip light emitting diode and fabrication method thereof 有权
标题翻译：芯片发光二极管及其制造方法
公开(公告)号：US20050017259A1
公开(公告)日：2005-01-27
申请号：US10754389
申请日：2004-01-09
申请人： Kwan-Young Han , Do-Hyung Kim , Seung-Man Yang , Chung-Hoon Lee , Hong-San Kim , Kwang-Il Park
发明人： Kwan-Young Han , Do-Hyung Kim , Seung-Man Yang , Chung-Hoon Lee , Hong-San Kim , Kwang-Il Park
IPC分类号： H01L33/54 , H01L27/15 , H01L33/56 , H01L33/62 , H01L33/64 , H01L33/00
CPC分类号： H01L33/54 , H01L33/486 , H01L2224/48091 , H01L2924/1815 , H01L2924/00014
摘要： A chip light emitting diode having a wide viewing angle, and a fabrication method thereof. The chip light emitting diode has a resin package sealing a light emitting chip which has at least one curved projecting part. The curved projecting part has a cross section which is substantially semicircular, or substantially or partially elliptical or parabolic. The curved projecting part preferably has a cross section which is comprised of a plurality of straight lines, an angle being formed between adjacent lines. The cross section is elongated to form a cylindrical outer surface of the resin package.
摘要翻译：具有宽视角的芯片发光二极管及其制造方法。芯片发光二极管具有密封具有至少一个弯曲突出部分的发光芯片的树脂封装。弯曲的突出部分具有基本上是半圆形的或基本上或部分是椭圆形或抛物线形的横截面。弯曲的突出部分优选地具有由多条直线组成的横截面，在相邻线之间形成一角度。横截面是细长的以形成树脂封装的圆柱形外表面。

9. 发明授权

US07855395B2 Light emitting diode package having multiple molding resins on a light emitting diode die 有权
标题翻译：在发光二极管裸片上具有多个成型树脂的发光二极管封装
公开(公告)号：US07855395B2
公开(公告)日：2010-12-21
申请号：US11575128
申请日：2005-06-23
申请人： Chung-Hoon Lee , Do-Hyung Kim , Keon-Young Lee
发明人： Chung-Hoon Lee , Do-Hyung Kim , Keon-Young Lee
IPC分类号： H01L33/00 , H01L23/495 , H01L23/34
CPC分类号： H01L33/52 , H01L33/486 , H01L33/56 , H01L33/62 , H01L33/642 , H01L33/647 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/12041 , H01L2924/19107 , H01L2924/00 , H01L2924/00014
摘要： Disclosed is a light emitting diode (LED) package having multiple molding resins. The LED package includes a pair of lead terminals. At least portions of the pair of lead terminals are embedded in a package main body. The package main body has an opening through which the pair of lead terminals is exposed. An LED die is mounted in the opening and electrically connected to the pair of lead terminals. A first molding resin covers the LED die. A second molding resin with higher hardness than the first molding resin covers the first molding resin. Therefore, stress to be imposed on the LED die can be reduced and the deformation of the molding resins can be prevented.
摘要翻译：公开了具有多个成型树脂的发光二极管（LED）封装。 LED封装包括一对引线端子。一对引线端子的至少一部分嵌入在封装主体中。包装主体具有一对开口，一对引线端子通过该开口露出。 LED管芯安装在开口中并电连接到一对引线端子。第一模塑树脂覆盖LED芯片。具有比第一模塑树脂硬度更高的第二模塑树脂覆盖第一模塑树脂。因此，可以减少施加在LED模具上的应力，并且可以防止模塑树脂的变形。

10. 发明授权

US08569939B2 Luminous device with heat pipe and method of manufacturing heat pipe lead for luminous device 有权
标题翻译：具有热管的发光装置及制造用于发光装置的热管引线的方法
公开(公告)号：US08569939B2
公开(公告)日：2013-10-29
申请号：US11575292
申请日：2005-08-26
申请人： Do-Hyung Kim , Moon-Whan Shin , Woong-Joon Hwang , Chung-Hoon Lee
发明人： Do-Hyung Kim , Moon-Whan Shin , Woong-Joon Hwang , Chung-Hoon Lee
IPC分类号： H01J1/02 , H01J7/24 , H01J61/52 , H01K1/58
CPC分类号： H01L33/648 , F28D15/02 , H01L24/97 , H01L2224/48091 , H01L2224/48247 , H01L2924/12041 , H01L2924/15724 , H01L2924/351 , H01L2924/00014 , H01L2924/00
摘要： The present invention relates to a luminous device with a heat pipe formed therein and a heat pipe lead for a luminous device. The present invention provides a luminous device including a heat pipe lead or electrode and a luminous chip mounted onto the heat pipe lead or electrode. The luminous device of the present invention further comprises a heat dissipation member, such as a heat radiating plate or thermoelectric device, installed at an end of the heat pipe lead or electrode. Therefore, through the heat pipe lead or electrode of the present invention, a higher heat dissipation effect greater can be obtained as compared with the conventional one. As a result, it is possible to reduce thermal stress on a luminous device and to prevent the occurrence of a phenomenon in which external impurities penetrate into the luminous device. In addition, the cooling efficiency and the light-emitting efficiency of a luminous chip can be maximized by further disposing a heat dissipation member outside the heat pipe.
摘要翻译：本发明涉及一种其中形成有热管的发光装置和用于发光装置的热管引线。本发明提供了一种发光装置，其包括热管引线或电极以及安装在热管引线或电极上的发光芯片。本发明的发光装置还包括安装在热管引线或电极的端部的诸如散热板或热电装置的散热构件。因此，通过本发明的热管引线或电极，与以往相比，能够得到较大的散热效果。结果，可以降低发光器件上的热应力，并且防止外部杂质渗透到发光器件中的现象的发生。此外，通过在散热管外部进一步布置散热构件，可以使发光芯片的冷却效率和发光效率最大化。

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