会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 4. 发明授权
    • Semiconductor light emitting device
    • 半导体发光器件
    • US08779412B2
    • 2014-07-15
    • US13553344
    • 2012-07-19
    • Sang Heon HanDo Young RheeJong Hyun LeeJin Young LimYoung Sun Kim
    • Sang Heon HanDo Young RheeJong Hyun LeeJin Young LimYoung Sun Kim
    • H01L33/00H01L29/06
    • H01L33/06H01L33/32
    • There is provided a semiconductor light emitting device including: first and second conductivity type semiconductor layers; and an active layer disposed between the first and second conductivity type semiconductor layers and having a structure in which a plurality of quantum barrier layers and a plurality of quantum well layers are alternately disposed, wherein at least one of the plurality of quantum well layers includes a first region in which band gap energy is reduced through a first slope and a second region in which band gap energy is reduced through a second slope different from the first slope. The influence of polarization is minimized by adjusting the shape of the band gap of the quantum well layer, crystallinity and internal quantum efficiency can be enhanced.
    • 提供一种半导体发光器件,包括:第一和第二导电类型半导体层; 以及设置在第一和第二导电类型半导体层之间并且具有多个量子势垒层和多个量子阱层交替设置的结构的有源层,其中多个量子阱层中的至少一个包括 带隙能量通过第一斜率​​减小的第一区域和通过不同于第一斜率的第二斜率使带隙能量减小的第二区域。 通过调整量子阱层的带隙的形状,极化的影响被最小化,可以提高结晶度和内部量子效率。
    • 10. 发明授权
    • Method for manufacturing semiconductor laser device
    • 制造半导体激光器件的方法
    • US07192884B2
    • 2007-03-20
    • US10689629
    • 2003-10-22
    • Dong Joon KimByung Deuk MoonSang Heon Han
    • Dong Joon KimByung Deuk MoonSang Heon Han
    • H01L21/302
    • H01S5/0421H01S5/2081H01S5/2206H01S5/2231H01S2304/00
    • Disclosed is a method for manufacturing a semiconductor laser device, comprising the steps of: (a) forming a first conductive-type clad layer, an active layer, and a second conductive-type clad layer on a first conductive-type semiconductor substrate; (b) forming a ridge structure by selectively etching the second conductive-type clad layer; (c) forming a current blocking layer around the ridge structure, the current blocking layer having protrusions on the upper surface thereof adjacent to the ridge structure, and an amorphous and/or polycrystalline layer on a partial area thereof; and (d) removing at least the amorphous and/or polycrystalline layer from the current blocking layer, and wet-etching the upper surface of the current blocking layer so that the protrusions are reduced in size.
    • 本发明公开了一种半导体激光器件的制造方法,包括以下步骤:(a)在第一导电型半导体衬底上形成第一导电型覆盖层,有源层和第二导电型覆盖层; (b)通过选择性地蚀刻第二导电型覆盖层形成脊结构; (c)在所述脊结构周围形成电流阻挡层,所述电流阻挡层在其与所述脊结构相邻的上表面上具有突起,以及在其部分区域上的非晶和/或多晶层; 和(d)从电流阻挡层中去除至少非晶和/或多晶层,并且湿蚀刻电流阻挡层的上表面,使得突起的尺寸减小。