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    • 5. 发明授权
    • Methods for hermetically sealing microchip reservoir devices
    • 密封微芯片储液装置的方法
    • US06827250B2
    • 2004-12-07
    • US10184259
    • 2002-06-28
    • Scott A. UhlandBenjamin F. PolitoStephen J. HermanJohn T. Santini, Jr.John M. Maloney
    • Scott A. UhlandBenjamin F. PolitoStephen J. HermanJohn T. Santini, Jr.John M. Maloney
    • B23K106
    • A61K9/0097
    • Methods are provided for hermetically sealing the reservoirs of microchip devices and for hermetically sealing the substrate assemblies in a hermetic packaging structure. In one embodiment, the method comprises (1) providing a primary substrate having a front side and a back side, the substrate comprising a plurality of reservoirs positioned between the front side and the back side, each reservoir being loaded with molecules or a secondary device for controlled release or exposure, the reservoirs having at least one opening in need of sealing, the primary substrate including one or more hermetic sealing materials; (2) providing a hermetic sealing substrate having a surface composed of one or more hermetic sealing materials; (3) positioning the hermetic sealing substrate over the reservoir openings and contacting said hermetic sealing materials of the primary substrate with said hermetic sealing materials of the hermetic sealing substrate; and (4) applying energy or a mechanical force to the contacted sealing materials effective to form a hermetic seal between the hermetic sealing substrate and the primary substrate to hermetically seal the reservoir openings.
    • 提供了用于气密地密封微芯片装置的储存器的方法,以及用于密封密封封装结构中的基板组件。 在一个实施例中,该方法包括(1)提供具有前侧和后侧的主基底,所述基底包括位于前侧和后侧之间的多个储存器,每个储存器装载有分子或辅助装置 为了控制释放或暴露,储存器具有至少一个需要密封的开口,主基底包括一个或多个气密密封材料; (2)提供具有由一种或多种密封材料构成的表面的气密密封基材; (3)将气密密封基板定位在储存器开口上,并使主基板的气密密封材料与气密密封基板的气密密封材料接触; 和(4)将能量或机械力施加到接触的密封材料上,以有效地在气密密封基底和初级基底之间形成气密密封,从而气密地密封储层开口。