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    • 4. 发明申请
    • Silicone epoxy formulations
    • 硅氧烷环氧配方
    • US20050282975A1
    • 2005-12-22
    • US10873699
    • 2004-06-22
    • Deborah HaitkoSlawomir Rubinsztajn
    • Deborah HaitkoSlawomir Rubinsztajn
    • B32B27/38C08G59/30C08G59/42C08G59/68C08L63/00C08L83/00C08L83/06H01L21/56H01L23/29
    • C08L83/06C08G59/306C08G59/4215C08G59/687H01L23/293H01L2924/0002Y10T428/31511Y10T428/31663H01L2924/00
    • An encapsulant composition is provided. The composition includes an epoxy composition including at least a silicone epoxy of the general formula: MaM′bDcD′dTeT′fQg wherein a, b, c, d, e, f, and g are independently integers of zero or above, and wherein the sum of b, d, and f is one or greater; M is R13SiO1/2; M′ is (Z)R22SiO1/2; D is R32SiO2/2; D′ is (Z)R4SiO2/2; T is R5SiO3/2; and T′ is (Z)SiO3/2; Q is SiO4/2 and R1, R2, R3, R4, R5 are independently selected from the group consisting of H, C1-22 alkyl, C1-22 alkoxy, C2-22 alkenyl, C6-14 aryl, C6-22 alkyl substituted aryl, C6-22 arylalkyl, aminoalkyls, and mixtures thereof; and Z, independently at each occurrence, is an organic radical containing an epoxy group, a curing agent, and a filler. The composition is substantially free of Pt.
    • 提供了一种密封剂组合物。 组合物包括至少包含以下通式的硅氧烷环氧树脂的环氧组合物:<?in-line-formula description =“In-line Formulas”end =“lead”?> M a M' b D D D 其中a,b,c,d,e,f和g独立地为零或以上的整数,其中a,b,c,d,e,f和g独立地为0以上的整数, 并且其中b,d和f的和为1或更大; M是R 1,R 2,R 3,R 1,R 2, M'是(Z)R 2 2 2 SiO 1/2 1/2; D是R 3 2 SiO 2/2/2; D'是(Z)R 4 SiO 2/2/2; T是R 5 SiO 3/2/2; 和T'是(Z)SiO 3/2/2; Q是SiO 4/2和R 1,R 2,R 3,R 4, R 5,R 5独立地选自H,C 1-12烷基,C 1-22烷氧基,C 2-22烯基,C 6-14芳基,C 6-22烷基取代的芳基,C 6-22 -S 芳基烷基,氨基烷基及其混合物; 和Z独立地是含有环氧基,固化剂和填料的有机基团。 组合物基本上不含Pt。