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1. 发明申请

US20050282976A1 Silicone epoxy formulations 审中-公开
标题翻译：硅氧烷环氧配方
公开(公告)号：US20050282976A1
公开(公告)日：2005-12-22
申请号：US10874078
申请日：2004-06-22
申请人： Deborah Haitko , Donald Buckley
发明人： Deborah Haitko , Donald Buckley
IPC分类号： C08L83/00 , C08L83/06
CPC分类号： C08L83/06 , C08L2666/02
摘要： An encapsulant composition is provided. The composition includes an epoxy composition including at least two siloxane repeat units and a curing agent. The encapsulant composition is particularly suited for encapsulating light emitting diode components.
摘要翻译：提供了一种密封剂组合物。该组合物包括包含至少两个硅氧烷重复单元和固化剂的环氧组合物。密封剂组合物特别适用于封装发光二极管组件。

2. 发明申请

US20050097941A1 Gas sensor device 有权
标题翻译：气体传感器装置
公开(公告)号：US20050097941A1
公开(公告)日：2005-05-12
申请号：US10706767
申请日：2003-11-12
申请人： Peter Sandvik , Vinayak Tilak , Jesse Tucker , Stanton Weaver , David Shaddock , Jonathan Male , John Lemmon , Mark Woodmansee , Venkatesan Manivannan , Deborah Haitko
发明人： Peter Sandvik , Vinayak Tilak , Jesse Tucker , Stanton Weaver , David Shaddock , Jonathan Male , John Lemmon , Mark Woodmansee , Venkatesan Manivannan , Deborah Haitko
IPC分类号： G01N27/414 , G01N33/00 , G01N7/00
CPC分类号： G01N27/4141 , G01N33/0037 , Y02A50/245
摘要： A gas sensor device including a semiconductor substrate; one or more catalytic gate-electrodes deposited on a surface of the semiconductor substrate; one or more ohmic contacts deposited on the surface of the semiconductor substrate and a passivation layer deposited on at least a portion of the surface; wherein the semiconductor substrate includes a material selected from the group consisting of silicon carbide, diamond, Group III nitrides, alloys of Group III nitrides, zinc oxide, and any combinations thereof.
摘要翻译：一种气体传感器装置，包括半导体衬底; 沉积在半导体衬底的表面上的一个或多个催化栅电极; 沉积在半导体衬底的表面上的一个或多个欧姆接触层和沉积在该表面的至少一部分上的钝化层; 其中所述半导体衬底包括选自碳化硅，金刚石，III族氮化物，III族氮化物的合金，氧化锌及其任何组合的材料。

3. 发明申请

US20050282975A1 Silicone epoxy formulations 审中-公开
标题翻译：硅氧烷环氧配方
公开(公告)号：US20050282975A1
公开(公告)日：2005-12-22
申请号：US10873699
申请日：2004-06-22
申请人： Deborah Haitko , Slawomir Rubinsztajn
发明人： Deborah Haitko , Slawomir Rubinsztajn
IPC分类号： B32B27/38 , C08G59/30 , C08G59/42 , C08G59/68 , C08L63/00 , C08L83/00 , C08L83/06 , H01L21/56 , H01L23/29
CPC分类号： C08L83/06 , C08G59/306 , C08G59/4215 , C08G59/687 , H01L23/293 , H01L2924/0002 , Y10T428/31511 , Y10T428/31663 , H01L2924/00
摘要： An encapsulant composition is provided. The composition includes an epoxy composition including at least a silicone epoxy of the general formula: MaM′bDcD′dTeT′fQg wherein a, b, c, d, e, f, and g are independently integers of zero or above, and wherein the sum of b, d, and f is one or greater; M is R13SiO1/2; M′ is (Z)R22SiO1/2; D is R32SiO2/2; D′ is (Z)R4SiO2/2; T is R5SiO3/2; and T′ is (Z)SiO3/2; Q is SiO4/2 and R1, R2, R3, R4, R5 are independently selected from the group consisting of H, C1-22 alkyl, C1-22 alkoxy, C2-22 alkenyl, C6-14 aryl, C6-22 alkyl substituted aryl, C6-22 arylalkyl, aminoalkyls, and mixtures thereof; and Z, independently at each occurrence, is an organic radical containing an epoxy group, a curing agent, and a filler. The composition is substantially free of Pt.
摘要翻译：提供了一种密封剂组合物。组合物包括至少包含以下通式的硅氧烷环氧树脂的环氧组合物：<？in-line-formula description =“In-line Formulas”end =“lead”？> M a M' b D D D 其中a，b，c，d，e，f和g独立地为零或以上的整数，其中a，b，c，d，e，f和g独立地为0以上的整数，并且其中b，d和f的和为1或更大; M是R 1，R 2，R 3，R 1，R 2， M'是（Z）R 2 2 2 SiO 1/2 1/2; D是R 3 2 SiO 2/2/2; D'是（Z）R 4 SiO 2/2/2; T是R 5 SiO 3/2/2; 和T'是（Z）SiO 3/2/2; Q是SiO 4/2和R 1，R 2，R 3，R 4， R 5，R 5独立地选自H，C 1-12烷基，C 1-22烷氧基，C 2-22烯基，C 6-14芳基，C 6-22烷基取代的芳基，C 6-22 -S 芳基烷基，氨基烷基及其混合物; 和Z独立地是含有环氧基，固化剂和填料的有机基团。组合物基本上不含Pt。

4. 发明申请

US20050008865A1 Curable epoxy compositions and articles made therefrom 审中-公开
标题翻译：可固化的环氧组合物和由其制成的制品
公开(公告)号：US20050008865A1
公开(公告)日：2005-01-13
申请号：US10613955
申请日：2003-07-07
申请人： Slawomir Rubinsztajn , Deborah Haitko
发明人： Slawomir Rubinsztajn , Deborah Haitko
IPC分类号： C08G59/68 , B32B27/38 , C08L63/00
CPC分类号： C08G59/68 , Y10T428/31511
摘要： A curable epoxy formulation comprising at least one epoxy monomer, at least one organofunctionalized colloidal silica, at least one alkyl onium cure catalyst, and optional reagents is provided in the present invention. Also disclosed are a packaged solid state device comprising an encapsulant comprising the aforementioned curable epoxy formulation.
摘要翻译：在本发明中提供了包含至少一种环氧单体，至少一种有机官能化胶体二氧化硅，至少一种烷基鎓固化催化剂和任选的试剂的可固化环氧树脂制剂。还公开了一种封装的固态器件，其包括包含上述可固化环氧树脂制剂的密封剂。

5. 发明申请

US20070228331A1 Q silicone-containing composition, optoelectronic encapsulant thereof and device thereof 审中-公开
标题翻译： Q含硅酮组合物，其光电密封剂及其装置
公开(公告)号：US20070228331A1
公开(公告)日：2007-10-04
申请号：US11391021
申请日：2006-03-28
申请人： Deborah Haitko , John Leman
发明人： Deborah Haitko , John Leman
IPC分类号： H05B33/00 , H05B33/04 , C09K11/02
CPC分类号： C09K11/02 , C09K11/665 , C09K11/7731 , C09K11/7734 , C09K11/7738 , C09K11/7739 , C09K11/774 , C09K11/7749 , C09K11/7761 , C09K11/7774 , C09K11/778 , C09K11/7787 , C09K2211/1433 , H01L33/502 , H01L2224/48091 , H01L2924/00014
摘要： The invention provides a composition comprising a phosphor and a Q-containing silicone; an encapsulant formulation comprising a phosphor and a Q-containing silicone; and a device including an optoelectronic device such as LED, a phosphor, and a Q-containing silicone. The Q-containing silicone passes thermal shock condition of up to 150° C., and has many suitable properties such as transparency and viscosity to function as a phosphor binder.
摘要翻译：本发明提供包含磷光体和含Q的硅氧烷的组合物; 包含磷光体和含Q的硅氧烷的密封剂制剂; 以及包括诸如LED，磷光体和含Q聚硅氧烷的光电子器件的器件。含Q的硅氧烷通过高达150℃的热冲击条件，具有诸如透明度和粘度的许多合适的性能，用作磷光体粘合剂。

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