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1. 发明申请

US20050127489A1 Microelectronic device signal transmission by way of a lid 审中-公开
标题翻译：微电子器件信号通过盖子传输
公开(公告)号：US20050127489A1
公开(公告)日：2005-06-16
申请号：US10733183
申请日：2003-12-10
申请人： Debendra Mallik , Chris Baldwin , Brent Stone
发明人： Debendra Mallik , Chris Baldwin , Brent Stone
IPC分类号： H01L21/48 , H01L21/60 , H01L23/02 , H01L23/04 , H01L23/36 , H01L23/492 , H01L23/498
CPC分类号： H01L23/492 , H01L23/04 , H01L23/36 , H01L23/49833 , H01L24/81 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/81801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/15153 , H01L2924/15165 , H01L2924/15192 , H01L2924/15311 , H01L2924/15331 , H01L2924/16195 , H01L2924/19041 , H01L2924/19043 , H01L2924/19106 , H01L2924/00015 , H01L2924/00 , H01L2224/05599
摘要： A microelectronic device package including an electrically conductive lid having an attachment surface, a substrate having an attachment surface, at least one interconnect extending between the lid attachment surface and the substrate attachment surface, at least one microelectronic die disposed between the lid attachment surface and the substrate attachment surface, and the substrate having at least one first conductive trace extending between the electrically conductive first interconnect and the microelectronic die. The microelectronic device package allows for the use of the electrically conductive lid as a path for conducting signals (preferably power or ground) to and/or from a microelectronic die.
摘要翻译：一种微电子器件封装，其包括具有附接表面的导电盖，具有附接表面的基底，在所述盖附接表面和所述基板附接表面之间延伸的至少一个互连件，设置在所述盖附接表面和所述盖附接表面之间的至少一个微电子管芯衬底附着表面，以及具有在导电的第一互连和微电子管芯之间延伸的至少一个第一导电迹线的衬底。微电子器件封装允许使用导电盖作为用于向微电子管芯和/或从微电子管芯传导信号（优选功率或接地）的路径。

2. 发明授权

US06220152B1 Barbeque rotisserie enclosure 失效
标题翻译：烧烤烤架外壳
公开(公告)号：US06220152B1
公开(公告)日：2001-04-24
申请号：US09468587
申请日：1999-12-21
申请人： Chris Baldwin , Mike Lobelio
发明人： Chris Baldwin , Mike Lobelio
IPC分类号： A47J3704
CPC分类号： A47J37/0786 , A47J37/0694
摘要： A barbeque rotisserie enclosure includes a hollow vessel for substantially releasably encapsulating food to be barbequed. The hollow vessel includes a hollow cylinder having a first closed end and a second open end the second open end for placing food into the hollow cylinder and the first closed end being permanently sealed with a first end cap. The second open end is releasably sealed with a second end cap; wherein the hollow vessel is capable of being rotated over a heat source. The barbeque rotisserie enclosure further includes a baffle housed concentrically within and adjacent to an inner surface of the hollow cylinder, thereby preventing direct contact of flames with the food and also substantially preventing direct contact of liquids emanating from the food with the heat source.
摘要翻译：烧烤烤架外壳包括用于基本上可释放地包封待烧烤的食物的中空容器。中空容器包括具有第一封闭端的中空圆柱体和第二开口端，用于将食物放入中空圆柱体中的第二开口端，并且第一封闭端部用第一端盖永久地密封。第二开口端用第二端盖可释放地密封; 其中所述中空容器能够在热源上旋转。烧烤烤架外壳还包括挡板，其同心地容纳在中空圆筒的内表面内并与之相邻，从而防止火焰与食物的直接接触，并且还基本上防止从食物发出的液体与热源的直接接触。

3. 发明申请

US20090116000A1 FIBER OPTIC SHAPE DETERMINATION SYSTEM 审中-公开
标题翻译：光纤形状测定系统
公开(公告)号：US20090116000A1
公开(公告)日：2009-05-07
申请号：US12254451
申请日：2008-10-20
申请人： JASON KIDDY , Chris Baldwin , John Niemczuk
发明人： JASON KIDDY , Chris Baldwin , John Niemczuk
IPC分类号： G01N21/00 , F17D5/00 , E21B47/00
CPC分类号： G01B11/18 , E21B47/00 , Y10T137/8359
摘要： A fiber optic shape determination system having at least one optical fiber for placement within or along an elongated structure. The optical fiber defines an optical path for conveying an optical signal. The optical path manifests an interaction with the optical signal wherein the interaction occurs in a continuous fashion during the propagation of the optical signal along the optical path and produces a measurable response, the response conveying information about strain imparted to the optical fiber and a location along the optical fiber at which the strain occurs. The shape determination system also has a measurement component coupled to the optical fiber to sense the response and for determining the strain applied at different locations along the fiber and for deriving a shape of optic fiber, accordingly.
摘要翻译：一种光纤形状确定系统，其具有用于放置在细长结构内或沿着细长结构的至少一个光纤。光纤限定用于传送光信号的光路。光路表现出与光信号的相互作用，其中在光信号沿着光路传播期间相互作用发生相互作用并且产生可测量的响应，该响应传达关于赋予光纤的应变的信息和沿着发生应变的光纤。形状确定系统还具有耦合到光纤的测量部件以感测响应并且用于确定施加在沿着光纤的不同位置处的应变并相应地导出光纤的形状。

4. 发明授权

US06784532B2 Power/ground configuration for low impedance integrated circuit 有权
公开(公告)号：US06784532B2
公开(公告)日：2004-08-31
申请号：US10209847
申请日：2002-07-31
申请人： Dong Zhong , Farzaneh Yahyaei-Moayyed , David G. Figueroa , Chris Baldwin , Jiangqi He , Yuan-Liang Li
发明人： Dong Zhong , Farzaneh Yahyaei-Moayyed , David G. Figueroa , Chris Baldwin , Jiangqi He , Yuan-Liang Li
IPC分类号： H01L2352
CPC分类号： H01L23/49838 , H01L23/50 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： An integrated circuit including a die, a power terminal and a ground terminal all mounted onto a substrate. The power terminal including a body and a first extension projecting from the body, and the ground terminal including a body and a second extension projecting from the body. The second extension on the ground terminal being adjacent to the first extension on the power terminal to offset inductance that is generated by supplying current to the die through the power terminal.

5. 发明授权

US06777818B2 Mechanical support system for a thin package 失效
公开(公告)号：US06777818B2
公开(公告)日：2004-08-17
申请号：US10045315
申请日：2001-10-24
申请人： Chris Baldwin
发明人： Chris Baldwin
IPC分类号： H01L2329
CPC分类号： H01L23/13 , H01L23/49811 , H01L23/49833 , H01L23/642 , H01L2224/16 , H01L2924/1433 , H01L2924/15312 , H01L2924/19106
摘要： An electronic package includes an IC, such as a die, mounted onto one side of a thin interposer and a pin carrier mounted to an opposing side of the interposer. The pin carrier includes a cavity underneath the die. The cavity allows capacitors, or other electronic components, to be mounted against the interposer beneath the die. The cavity in the pin carrier is filled with an encapsulant to mechanically support the thin interposer in the area of the cavity during operation of an electronic system that includes the package.

6. 发明授权

US06362438B1 Enhanced plated-through hole and via contact design 有权
标题翻译：增强的电镀通孔和通孔接触设计
公开(公告)号：US06362438B1
公开(公告)日：2002-03-26
申请号：US09461901
申请日：1999-12-15
申请人： Tee Onn Chong , Chris Baldwin , Chee-Yee Chung
发明人： Tee Onn Chong , Chris Baldwin , Chee-Yee Chung
IPC分类号： H05K111
CPC分类号： H01L23/49827 , H01L2924/0002 , H05K1/112 , H05K3/4602 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , H05K2201/0979 , H05K2201/10704 , H05K2201/10734 , H01L2924/00
摘要： The present invention provides a circuit board with a plated-through hole, wherein a first end of the plated-through hole is electrically attached to a cap formed of conductive material. One or more surface pads terminate on a surface layer of the printed circuit board, and are connected to the cap by one or more vias extending from the cap to the one or more surface pads. In some embodiments, the circuit board is a substrate for mounting an integrated circuit, such as a ball-grid array integrated circuit. The invention includes methods for making the novel circuit board, as well as integrated circuit assemblies comprising the novel circuit board with an integrated circuit mounted thereto.
摘要翻译：本发明提供一种具有电镀通孔的电路板，其中电镀通孔的第一端电连接到由导电材料形成的盖上。一个或多个表面焊盘终止在印刷电路板的表面层上，并且通过从盖延伸到一个或多个表面焊盘的一个或多个通孔连接到盖。在一些实施例中，电路板是用于安装诸如球栅阵列集成电路的集成电路的基板。本发明包括制造新型电路板的方法，以及包括具有安装在其上的集成电路的新颖电路板的集成电路组件。

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