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1. 发明授权

US07161243B2 System and apparatus for socket and package power/ground bar to increase current carrying capacity for higher IC power delivery 失效
标题翻译：用于插座和封装电源/接地棒的系统和设备，以增加用于更高IC功率传输的载流能力
公开(公告)号：US07161243B2
公开(公告)日：2007-01-09
申请号：US11133999
申请日：2005-05-20
申请人： Hong Xie , Brent Stone
发明人： Hong Xie , Brent Stone
IPC分类号： H01L29/10 , H01L23/48 , H01L21/66 , H05K5/06 , H05K7/14 , G01R31/26
CPC分类号： H01L23/50 , H01L2924/0002 , H05K7/1007 , H05K7/1092 , H01L2924/00
摘要： A socket and package apparatus are disclosed for increasing the amount of power that can be delivered from an IC board to an IC where the IC package is mounted in a socket connected to the IC board. In one embodiment, the IC package includes a first power plane along with a power carrier and one or more pin receptacles. The power bar carrier includes a first conducting panel that is electrically coupled to the first power plane along a first adjacent edge. The first conducting panel is also electrically coupled to a first plurality of conducting pads.
摘要翻译：公开了一种插座和封装装置，用于增加可从IC板传送到集成电路的功率的量，其中IC封装安装在与IC板连接的插座中。在一个实施例中，IC封装包括与功率载体和一个或多个插脚插座一起的第一电源平面。功率棒载体包括沿着第一相邻边缘电耦合到第一电源平面的第一导电板。第一导电板还电耦合到第一多个导电焊盘。

2. 发明申请

US20060166401A1 Hybrid package with non-insertable and insertable conductive features, complementary receptacle, and methods of fabrication therefor 有权
标题翻译：具有不可插入和可插入导电特征的混合包装，互补插座及其制造方法
公开(公告)号：US20060166401A1
公开(公告)日：2006-07-27
申请号：US11390531
申请日：2006-03-27
申请人： Brent Stone
发明人： Brent Stone
IPC分类号： H01L21/50
CPC分类号： H01L23/49811 , H01L23/49838 , H01L2924/0002 , H01L2924/00
摘要： A hybrid electronic circuit package (102, FIG. 1) includes non-insertable conductive features (110) and insertable conductive features (112) at a surface of the package. A hybrid receptacle (120), such as a socket, for example, includes non-insertable contacts (124) and insertable contacts (126), which are positioned in a complementary manner with the non-insertable and insertable features of the package. A vertical securement device (132, 134, 136) applies a vertical compressive force to the package (102) to compress the non-insertable features (110) against the non-insertable contacts (124). Further, a normal force securement device can be used to provide a sustained normal force to compress the insertable features and contacts together. In one embodiment, the non-insertable features are land grid array lands and the insertable features are low insertion force features.
摘要翻译：混合电子电路封装（102，图1）在封装的表面处包括不可插入的导电特征（110）和可插入的导电特征（112）。例如，诸如插座的混合容座（120）包括不可插入的触点（124）和可插入触点（126），其以与封装的不可插入和插入的特征互补的方式定位。垂直固定装置（132,134,136）向包装（102）施加垂直的压缩力以将不可插入的特征（110）压靠在不可插入的触点（124）上。此外，可以使用法向力固定装置来提供持续的法向力以将可插入特征和触点压缩在一起。在一个实施例中，不可插入的特征是平面栅格阵列平台，并且可插入特征是低插入力特征。

3. 发明申请

US20050287828A1 Tilted land grid array package and socket, systems, and methods 有权
标题翻译：倾斜的土地网格阵列封装和插座，系统和方法
公开(公告)号：US20050287828A1
公开(公告)日：2005-12-29
申请号：US10880149
申请日：2004-06-28
申请人： Brent Stone , Michael Walk
发明人： Brent Stone , Michael Walk
IPC分类号： H01R12/00 , H05K7/10
CPC分类号： H05K7/1069
摘要： A electrical interface for an electronic package, using lands on the package which are non-planar with metal layers within the package. This non-planar or tilted land grid array (TLGA) package is assembled with a complementary TLGA socket to make electronic connection to the package.
摘要翻译：一种用于电子封装的电接口，其使用与封装内的金属层非平面的封装上的焊盘。这种非平面或倾斜的焊盘格栅阵列（TLGA）封装与互补的TLGA插座组装在一起，以使电子连接到封装。

4. 发明授权

US06979891B2 Integrated circuit packaging architecture 失效
公开(公告)号：US06979891B2
公开(公告)日：2005-12-27
申请号：US10657437
申请日：2003-09-08
申请人： Dustin P. Wood , Brent Stone
发明人： Dustin P. Wood , Brent Stone
IPC分类号： H01L23/367 , H01L23/498 , H01L23/50 , H01L23/538 , H01L25/18 , H05K1/02 , H01L23/02
CPC分类号： H01L25/18 , H01L23/367 , H01L23/49805 , H01L23/50 , H01L23/5385 , H01L2224/16225 , H01L2224/73253 , H01L2924/01078 , H01L2924/01079 , H01L2924/15174 , H01L2924/15311 , H01L2924/16195 , H01L2924/3011 , H05K1/0263
摘要： A system may include an integrated circuit package having a package power contact and a package ground contact, and an interposer to physically receive a portion of the package and including a lip. A system may also include a first card having a card power contact to interface with the package power contact and a card ground contact to interface with the package ground contact, where the first card defines an opening to receive a portion of the interposer, and the lip is to support a portion of the first card.

5. 发明申请

US20050208791A1 System and apparatus for socket and package power/ground bar to increase current carrying capacity for higher IC power delivery 失效
标题翻译：用于插座和封装电源/接地棒的系统和设备，以增加用于更高IC功率传输的载流能力
公开(公告)号：US20050208791A1
公开(公告)日：2005-09-22
申请号：US11133999
申请日：2005-05-20
申请人： Hong Xie , Brent Stone
发明人： Hong Xie , Brent Stone
IPC分类号： H01R33/76 , H01L23/50 , H05K7/10 , H01R12/00
CPC分类号： H01L23/50 , H01L2924/0002 , H05K7/1007 , H05K7/1092 , H01L2924/00
摘要： A socket and package apparatus are disclosed for increasing the amount of power that can be delivered from an IC board to an IC where the IC package is mounted in a socket connected to the IC board. In one embodiment, the IC package includes a first power plane along with a power carrier and one or more pin receptacles. The power bar carrier includes a first conducting panel that is electrically coupled to the first power plane along a first adjacent edge. The first conducting panel is also electrically coupled to a first plurality of conducting pads.
摘要翻译：公开了一种插座和封装装置，用于增加可从IC板传送到集成电路的功率的量，其中IC封装安装在与IC板连接的插座中。在一个实施例中，IC封装包括与功率载体和一个或多个插脚插座一起的第一电源平面。功率棒载体包括沿着第一相邻边缘电耦合到第一电源平面的第一导电板。第一导电板还电耦合到第一多个导电焊盘。

6. 发明授权

US07429497B2 Hybrid package with non-insertable and insertable conductive features, complementary receptacle, and methods of fabrication therefor 有权
标题翻译：具有不可插入和可插入导电特征的混合包装，互补插座及其制造方法
公开(公告)号：US07429497B2
公开(公告)日：2008-09-30
申请号：US11390531
申请日：2006-03-27
申请人： Brent Stone
发明人： Brent Stone
IPC分类号： H01L21/00 , H01L23/02 , G01R31/28 , G01R31/02
CPC分类号： H01L23/49811 , H01L23/49838 , H01L2924/0002 , H01L2924/00
摘要： A hybrid electronic circuit package (102, FIG. 1) includes non-insertable conductive features (110) and insertable conductive features (112) at a surface of the package. A hybrid receptacle (120), such as a socket, for example, includes non-insertable contacts (124) and insertable contacts (126), which are positioned in a complementary manner with the non-insertable and insertable features of the package. A vertical securement device (132, 134, 136) applies a vertical compressive force to the package (102) to compress the non-insertable features (110) against the non-insertable contacts (124). Further, a normal force securement device can be used to provide a sustained normal force to compress the insertable features and contacts together. In one embodiment, the non-insertable features are land grid array lands and the insertable features are low insertion force features.
摘要翻译：混合电子电路封装（102，图1）在封装的表面处包括不可插入的导电特征（110）和可插入的导电特征（112）。例如，诸如插座的混合容座（120）包括不可插入的触点（124）和可插入触点（126），其以与封装的不可插入和插入的特征互补的方式定位。垂直固定装置（132,134,136）向包装（102）施加垂直的压缩力以将不可插入的特征（110）压靠在不可插入的触点（124）上。此外，可以使用法向力固定装置来提供持续的法向力以将可插入特征和触点压缩在一起。在一个实施例中，不可插入的特征是平面栅格阵列平台，并且可插入特征是低插入力特征。

7. 发明申请

US20050285243A1 Integrated circuit packages, systems, and methods 有权
标题翻译：集成电路封装，系统和方法
公开(公告)号：US20050285243A1
公开(公告)日：2005-12-29
申请号：US10880150
申请日：2004-06-28
申请人： Brent Stone , Dustin Wood , Kaladhar Radhakrishnan
发明人： Brent Stone , Dustin Wood , Kaladhar Radhakrishnan
IPC分类号： H01L23/02 , H01L23/498 , H01L23/50
CPC分类号： H01L23/50 , H01L23/49833 , H01L23/49838 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： An integrated circuit package includes a first capacitor supported by a surface of a substrate, and a second capacitor supported by the surface of the substrate. The first capacitor is within a die shadow region, and the second capacitor lies outside of the die shadow region.
摘要翻译：集成电路封装包括由衬底的表面支撑的第一电容器和由衬底的表面支撑的第二电容器。第一电容器在阴影区域内，第二电容器位于阴影阴影区域的外部。

8. 发明授权

US06853061B2 Dual power supply method and apparatus 失效
标题翻译：双电源方式和装置
公开(公告)号：US06853061B2
公开(公告)日：2005-02-08
申请号：US10273608
申请日：2002-10-18
申请人： Kris Frutschy , Glenn Stewart , Hong Xie , Brent Stone
发明人： Kris Frutschy , Glenn Stewart , Hong Xie , Brent Stone
IPC分类号： H01L23/50 , H01R12/16 , H01R12/24 , H05K1/02 , H05K1/14 , H05K1/18 , H05K3/22 , H01L23/02
CPC分类号： H01L23/50 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/16152 , H01R12/594 , H01R12/721 , H01R12/79 , H01R12/88 , H01R12/89 , H05K1/0262 , H05K1/0263 , H05K1/141 , H05K1/147 , H05K1/181 , H05K3/222 , H05K2201/10189 , H05K2201/10356 , H05K2201/10734 , H01L2924/00 , H01L2224/0401
摘要： The present invention relates to apparatus and methods for providing a low resistance power supply to a microelectronic package through the use of dual conductive paths. A first conductive path contained within the substrate and supplies current, primarily in responding to transient current demands to the microelectronic package. A lower resistance second conductive path supplies primarily steady state current to the microelectronic package through an electrical connection to an edge of the microelectronic package. Resistance in the second conductive path is reduced by using a power clamp to connect the second power supply to the microelectronic package.
摘要翻译：本发明涉及通过使用双导电路径向微电子封装提供低电阻电源的装置和方法。衬底内包含的第一导电路径，主要用于响应瞬时电流对微电子封装的要求而提供电流。较低电阻的第二导电路径通过与微电子封装的边缘的电连接向微电子封装提供主要的稳态电流。通过使用功率钳将第二电源连接到微电子封装来减小第二导电路径中的电阻。

9. 发明申请

US20060024982A1 Socket cover with recessed center and method 失效
标题翻译：带凹陷中心的插座盖和方法
公开(公告)号：US20060024982A1
公开(公告)日：2006-02-02
申请号：US10901703
申请日：2004-07-29
申请人： Brent Stone
发明人： Brent Stone
IPC分类号： H01R13/60
CPC分类号： H05K7/1053
摘要： A socket cover with a recessed center, method for using such a socket cover and system using such a socket cover are described herein.
摘要翻译：这里描述了具有凹陷中心的插座盖，使用这种插座盖的方法和使用这种插座盖的系统。

10. 发明申请

US20050127489A1 Microelectronic device signal transmission by way of a lid 审中-公开
标题翻译：微电子器件信号通过盖子传输
公开(公告)号：US20050127489A1
公开(公告)日：2005-06-16
申请号：US10733183
申请日：2003-12-10
申请人： Debendra Mallik , Chris Baldwin , Brent Stone
发明人： Debendra Mallik , Chris Baldwin , Brent Stone
IPC分类号： H01L21/48 , H01L21/60 , H01L23/02 , H01L23/04 , H01L23/36 , H01L23/492 , H01L23/498
CPC分类号： H01L23/492 , H01L23/04 , H01L23/36 , H01L23/49833 , H01L24/81 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/81801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/15153 , H01L2924/15165 , H01L2924/15192 , H01L2924/15311 , H01L2924/15331 , H01L2924/16195 , H01L2924/19041 , H01L2924/19043 , H01L2924/19106 , H01L2924/00015 , H01L2924/00 , H01L2224/05599
摘要： A microelectronic device package including an electrically conductive lid having an attachment surface, a substrate having an attachment surface, at least one interconnect extending between the lid attachment surface and the substrate attachment surface, at least one microelectronic die disposed between the lid attachment surface and the substrate attachment surface, and the substrate having at least one first conductive trace extending between the electrically conductive first interconnect and the microelectronic die. The microelectronic device package allows for the use of the electrically conductive lid as a path for conducting signals (preferably power or ground) to and/or from a microelectronic die.
摘要翻译：一种微电子器件封装，其包括具有附接表面的导电盖，具有附接表面的基底，在所述盖附接表面和所述基板附接表面之间延伸的至少一个互连件，设置在所述盖附接表面和所述盖附接表面之间的至少一个微电子管芯衬底附着表面，以及具有在导电的第一互连和微电子管芯之间延伸的至少一个第一导电迹线的衬底。微电子器件封装允许使用导电盖作为用于向微电子管芯和/或从微电子管芯传导信号（优选功率或接地）的路径。

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