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    • 7. 发明申请
    • THERMOELECTRIC MATERIALS COMBINING INCREASED POWER FACTOR AND REDUCED THERMAL CONDUCTIVITY
    • 热电材料结合增加的功率因数和降低的热导率
    • US20090269584A1
    • 2009-10-29
    • US12429841
    • 2009-04-24
    • Lon E. BellDmitri Kossakovski
    • Lon E. BellDmitri Kossakovski
    • H01B1/00B29C43/00B32B5/16
    • H01L35/34Y10T428/2982
    • A thermoelectric material and a method of forming a thermoelectric material are provided. The method of forming a thermoelectric material includes providing at least one compound fabricated by a first technique and having a first power factor and a first thermal conductivity. The method further includes modifying a spatial structure of the at least one compound by a second technique different from the first technique. The modified at least one compound has a plurality of portions separated from one another by a plurality of boundaries. The plurality of portions include one or more portions having a second power factor not less than the first power factor, and the modified at least one compound has a second thermal conductivity less than the first thermal conductivity.
    • 提供热电材料和形成热电材料的方法。 形成热电材料的方法包括提供至少一种通过第一技术制造并具有第一功率因数和第一热导率的化合物。 该方法还包括通过与第一技术不同的第二技术来修改至少一种化合物的空间结构。 改性的至少一种化合物具有通过多个边界彼此分离的多个部分。 多个部分包括具有不小于第一功率因数的第二功率因数的一个或多个部分,并且修改的至少一个化合物具有小于第一热导率的第二热导率。