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    • 1. 发明授权
    • Disk plating system
    • 磁盘电镀系统
    • US4822467A
    • 1989-04-18
    • US113872
    • 1987-10-27
    • David YoungRichard LamoureWilliam BrattVincent RuscelloJohn E. Wilson
    • David YoungRichard LamoureWilliam BrattVincent RuscelloJohn E. Wilson
    • C25D17/00
    • C25D17/005C25D17/06
    • The invention is an electroplating apparatus which partially submerges disks in the electrolytic solution, and provides electrical contact to the portions of the disk protruding above the solution. The disks are rotated during plating such that successive portions of the disk emerge from the solution, contact the electrical contact and then re-enter the solution. The disks are inserted into individual disk holders consisting of non-conductive shielding rings attached to a common bracket. The shielding rings are hinged such that the rings may be opened to insert the disks. When the disks are enclosed in the rings, they are supported by small non-conductive support wheels rotatably mounted in the rings. The rings remain stationary as the disks are rotated. To promote even plating, selectively-coated anode sheets are interleaved with the disk holding rings such that each holder has an anode sheet on either side.
    • 本发明是一种电镀设备,其部分地浸没在电解溶液中的盘,并且提供与在溶液上突出的盘的部分的电接触。 盘在电镀过程中旋转,使得盘的连续部分从溶液中出现,接触电接触,然后重新进入溶液。 盘被插入由连接到公共支架的非导电屏蔽环组成的单个盘保持器中。 屏蔽环被铰接,使得环可以打开以插入盘。 当盘被封闭在环中时,它们由可旋转地安装在环中的小的非导电支撑轮支撑。 当盘旋转时,环保持静止。 为了促进均匀电镀,选择性涂覆的阳极片与盘保持环交错,使得每个保持器在任一侧具有阳极片。