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1. 发明授权

US06905961B2 Land grid array stiffener for use with flexible chip carriers 失效
标题翻译：用于柔性芯片载体的土地格栅阵列加强筋
公开(公告)号：US06905961B2
公开(公告)日：2005-06-14
申请号：US10336579
申请日：2003-01-03
申请人： David Vincent Caletka , Krishna Darbha , William Infantolino , Eric Arthur Johnson
发明人： David Vincent Caletka , Krishna Darbha , William Infantolino , Eric Arthur Johnson
IPC分类号： H01L23/498 , H01L21/44
CPC分类号： H01L23/4985 , H01L2224/16 , H01L2924/01087 , H01L2924/10253 , H01L2924/15311 , H01L2924/16195 , H01L2924/00
摘要： A flexible chip carrier with contact pads on its upper surface matching those of the chip with said pads conductively connected to land grid array (LGA) pads on its lower surface matching the those of a card or PCB. The chip carrier is provided with a stiffening layer at the LGA interface. The stiffening layer is mechanically attached to the lower surface of the chip carrier. Holes are formed in the stiffening layer to expose the LGA pads. The holes are then filled with a conductive adhesive material. Compliant LGA bumps are applied to the uncured conductive adhesive material which material is then cured.
摘要翻译：具有在其上表面上具有接触焊盘的柔性芯片载体，其与所述芯片的接触焊盘匹配，所述焊盘导电地连接到其下表面上与卡或PCB匹配的焊盘格栅阵列（LGA）焊盘。芯片载体在LGA接口处设有加强层。加强层机械地附接到芯片载体的下表面。在加强层中形成孔以暴露LGA垫。然后用导电粘合剂材料填充孔。对未固化的导电粘合剂材料施加合适的LGA凸块，该材料然后被固化。

2. 发明授权

US06528892B2 Land grid array stiffener use with flexible chip carriers 有权
公开(公告)号：US06528892B2
公开(公告)日：2003-03-04
申请号：US09874196
申请日：2001-06-05
申请人： David Vincent Caletka , Krishna NMN Darbha , William NMN Infantolino , Eric Arthur Johnson
发明人： David Vincent Caletka , Krishna NMN Darbha , William NMN Infantolino , Eric Arthur Johnson
IPC分类号： H01L2348
CPC分类号： H01L23/4985 , H01L2224/16 , H01L2924/01087 , H01L2924/10253 , H01L2924/15311 , H01L2924/16195 , H01L2924/00
摘要： A flexible chip carrier with contact pads on its upper surface matching those of the chip with said pads conductively connected to land grid array (LGA) pads on its lower surface matching the those of a card or PCB. The chip carrier is provided with a stiffening layer at the LGA interface. The stiffening layer is mechanically attached to the lower surface of the chip carrier. Holes are formed in the stiffening layer to expose the LGA pads. The holes are then filled with a conductive adhesive material. Compliant LGA bumps are applied to the uncured conductive adhesive material which material is then cured.

3. 发明授权

US07134645B1 Winch assembly for use with synthetic ropes 失效
标题翻译：绞车总成用于合成绳索
公开(公告)号：US07134645B1
公开(公告)日：2006-11-14
申请号：US10358911
申请日：2003-02-05
申请人： Eric Arthur Johnson , Stuart Leigh Phoenix
发明人： Eric Arthur Johnson , Stuart Leigh Phoenix
IPC分类号： B66D1/36
CPC分类号： B66D1/741
摘要： A winch assembly is disclosed that eliminates rope crushing, even when synthetic ropes are used. Tension is applied to the rope by at least one traction sheave so that the tension at the drum is reduced. By using multiple sheaves with large wrap angles traction can be applied to the rope over a much larger area, reducing shear stress and minimizing internal wear due to relative motion of rope components. The winch drum and at least one traction sheave are driven independently, preferably by AC induction motors using frequency control. The winch assembly may operate in conjunction with a hydraulic tensioner so that lower horsepower motors can be used to maintain constant tension in moving systems.
摘要翻译：公开了一种绞车组件，即使在使用合成绳索时也可消除绳索破碎。通过至少一个牵引滑轮对绳索施加张力，使得滚筒处的张力减小。通过使用具有大包角的多个滑轮，牵引力可以在更大的面积上施加到绳索上，减少剪切应力并且最小化由于绳索部件的相对运动引起的内部磨损。绞车鼓和至少一个牵引滑轮独立地驱动，优选地通过使用频率控制的AC感应电动机驱动。绞车组件可以与液压张紧器一起操作，使得较低马力的马达可用于在运动系统中保持恒定的张力。

4. 发明授权

US06691769B2 Heat sink for convection cooling in horizontal applications 有权
标题翻译：散热器用于水平应用中的对流冷却
公开(公告)号：US06691769B2
公开(公告)日：2004-02-17
申请号：US09924210
申请日：2001-08-07
申请人： Eric Arthur Johnson , Randall Joseph Stutzman
发明人： Eric Arthur Johnson , Randall Joseph Stutzman
IPC分类号： F28F700
CPC分类号： H01L23/467 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A heat sink for free convection cooling in horizontal applications is provided. Specifically, the heat sink includes a plurality of spaced apart cooling fins, which are supported by an angled base. The cooling fins are transversely attached to the base and extend in a substantially vertical direction. In addition, the cooling fins extend beyond an outer edge of the base so that air can flow horizontally beneath the base and then vertically through the spaced apart cooling fins.
摘要翻译：提供了一种用于水平应用中自由对流冷却的散热器。具体地，散热器包括多个间隔开的冷却翅片，其由倾斜的基座支撑。冷却翅片横向地附接到基部并且在基本垂直的方向上延伸。此外，冷却翅片延伸超过基座的外边缘，使得空气可以水平地在基座下方流动，然后垂直地流过间隔开的散热片。

5. 发明授权

US5888849A Method for fabricating an electronic package 失效
标题翻译：电子封装的制造方法
公开(公告)号：US5888849A
公开(公告)日：1999-03-30
申请号：US833478
申请日：1997-04-07
申请人： Eric Arthur Johnson
发明人： Eric Arthur Johnson
IPC分类号： H01L21/56 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L21/565 , H01L2224/16 , H01L2924/15311
摘要： An electronic package is fabricated by providing a thin, circuitized substrate having electrical circuitry on a first surface; and then molding a dielectric body to the first surface of the substrate. The dielectric body contains an opening for exposing a portion of the surface of the thin circuitized substrate having at least a portion of the electrical circuitry. A semiconductor device is then positioned within the opening of the molded dielectric body and is electrically coupled to at least a portion of the electrical circuitry on the exposed portion of the surface of the thin circuitized substrate. Next, a plurality of electrical conductive members are secured to a surface of the thin circuitized substrate that is opposite the first surface.
摘要翻译：通过在第一表面上提供具有电路的薄的电路化基板来制造电子封装; 然后将电介质体模塑到衬底的第一表面上。电介质体包含用于暴露具有电路的至少一部分的薄电路化衬底的表面的一部分的开口。然后将半导体器件定位在模制的电介质体的开口内，并且电耦合到薄电路化衬底的表面的暴露部分上的电路的至少一部分。接下来，多个导电构件固定到薄电路基板的与第一表面相对的表面。

6. 发明授权

US07264649B1 System for allergen reduction through indoor humidity control 失效
标题翻译：通过室内湿度控制减轻过敏原的系统
公开(公告)号：US07264649B1
公开(公告)日：2007-09-04
申请号：US10898042
申请日：2004-07-23
申请人： Eric Arthur Johnson , Joseph Duane Kulesza
发明人： Eric Arthur Johnson , Joseph Duane Kulesza
IPC分类号： B01D53/04 , B01D53/26
CPC分类号： B01D53/261 , B01D53/28 , B01J20/267 , B01J20/28033 , B01J20/28035 , B01J20/28047 , B01J20/3204 , B01J20/3282 , B01J20/3425 , B01J20/3441 , B01J20/3483 , F24F11/30 , F24F2110/20
摘要： The invention provides a humidity control system (HCS) to control indoor humidity within a specified range so as to reduce indoor house-dust mite allergen levels. The invention also provides a hydrogel absorber/desorber for reversibly absorbing water vapor from air releasing water vapor to air. The invention employs a reversible hydrogel desiccant as the active element for absorption and desorption of water, thus rendering the HCS more effective and energy-efficient than traditional humidification/dehumidification systems. The HCS of the invention treats indoor air by drawing fresh air in from outside and adjusting the humidity of the air-stream. In certain embodiments, fresh air is drawn in from the outside and mixed with recirculated air. The HCS uses a controller to introduce fresh air into the interior space and to control air circulation within it. Relative humidity is monitored remotely throughout the interior space using wired or wireless sensors.
摘要翻译：本发明提供一种控制室内湿度在规定范围内的湿度控制系统（HCS），以减少室内尘螨变应原水平。本发明还提供一种水凝胶吸收剂/解吸器，用于从空气中释放水蒸气到空气中可逆地吸收水蒸气。本发明采用可逆水凝胶干燥剂作为吸收和解吸水的活性元素，从而使得HCS比传统的加湿/除湿系统更有效和节能。本发明的HCS通过从外部抽出新鲜空气并调节空气流的湿度来处理室内空气。在某些实施例中，新鲜空气从外部吸入并与再循环的空气混合。 HCS使用控制器将新鲜空气引入内部空间并控制其内部的空气流通。使用有线或无线传感器在整个室内空间监控相对湿度。

7. 发明授权

US06883593B2 Heat sink for convection cooling in horizontal applications 失效
标题翻译：散热器用于水平应用中的对流冷却
公开(公告)号：US06883593B2
公开(公告)日：2005-04-26
申请号：US10762904
申请日：2004-01-22
申请人： Eric Arthur Johnson , Randall Joseph Stutzman
发明人： Eric Arthur Johnson , Randall Joseph Stutzman
IPC分类号： H01L23/367 , H01L23/467 , F28F7/00
CPC分类号： H01L23/467 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A heat sink for free convection cooling in horizontal applications is provided. Specifically, the heat sink includes a plurality of spaced apart cooling fins, which are supported by an angled base. The cooling fins are transversely attached to the base and extend in a substantially vertical direction. In addition, the cooling fins extend beyond an outer edge of the base so that air can flow horizontally beneath the base and then vertically through the spaced apart cooling fins.
摘要翻译：提供了一种用于水平应用中自由对流冷却的散热器。具体地，散热器包括多个间隔开的冷却翅片，其由倾斜的基座支撑。冷却翅片横向地附接到基部并且在基本垂直的方向上延伸。此外，冷却翅片延伸超过基座的外边缘，使得空气可以水平地在基座下方流动，然后垂直地流过间隔开的散热片。

8. 发明授权

US06512295B2 Coupled-cap flip chip BGA package with improved cap design for reduced interfacial stresses 有权
公开(公告)号：US06512295B2
公开(公告)日：2003-01-28
申请号：US09797078
申请日：2001-03-01
申请人： Michael Anthony Gaynes , Eric Arthur Johnson
发明人： Michael Anthony Gaynes , Eric Arthur Johnson
IPC分类号： H01L2940
CPC分类号： H01L23/3128 , H01L21/563 , H01L23/4334 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要： Plastic ball grid array (PBGA) packages comprised of organic carriers on which are mounted and encapsulated semiconductor chips, providing for the mounting of so-called flip-chips. The chips are overlaid with a heat spreading thermally-conductive cap of a mesh-like material which is interstitially filled with an adhesive to prevent delamination caused by mismatches in the coefficients of thermal expansion, which result in contractions which cause the entire package arrangement to warp, leading to delamination between an encapsulant and cap and resulting in failure of connect joints and the ball grid arrays.

9. 发明授权

US5726079A Thermally enhanced flip chip package and method of forming 失效
公开(公告)号：US5726079A
公开(公告)日：1998-03-10
申请号：US715212
申请日：1996-09-17
申请人： Eric Arthur Johnson
发明人： Eric Arthur Johnson
IPC分类号： H01L23/12 , H01L21/60 , H01L23/31 , H01L23/433 , H01L21/44
CPC分类号： H01L24/81 , H01L23/3128 , H01L23/4334 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/81801 , H01L2924/01004 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/10253 , H01L2924/15311 , H01L2924/181
摘要： A thermally conductive planar member is in thermally conductive communication with a flip chip encapsulated within a dielectric material that surrounds portions of the thermally conductive planar member, the flip-chip, and a predefined portion of a substrate member. The present invention provides a flip chip package having pick-and-place capability without the thermal resistance disadvantage of capped chip packages.

10. 发明授权

US07551058B1 Sensor for monitoring environmental parameters in concrete 失效
标题翻译：用于监测混凝土中环境参数的传感器
公开(公告)号：US07551058B1
公开(公告)日：2009-06-23
申请号：US10732717
申请日：2003-12-10
申请人： Eric Arthur Johnson , Joseph Duane Kulesza
发明人： Eric Arthur Johnson , Joseph Duane Kulesza
IPC分类号： H04Q5/22
CPC分类号： G01N33/383 , G01N27/226
摘要： The invention provides a sensor for monitoring an environmental parameter in concrete comprising an enclosure for embedding in concrete; a detecting means connected to the enclosure for detecting at least one environmental parameter in concrete, the detecting means comprising at least one capacitive element for measuring capacitive change; an active material connected to the enclosure, the active material being liable to respond to the environmental parameter and the active material being operably connected to the capacitive element; a RFID chip mounted within the enclosure, the RFID chip being operably connected to the detecting means; and an antenna operably connected to the RFID chip, the antenna being operably connected to the detecting means, and the antenna being part of an L-R-C circuit whose resonance frequency shifts within an assigned frequency band. The invention also provides a MEMS-based capacitor that responds to an environmental parameter in concrete.
摘要翻译：本发明提供了一种用于监测混凝土中的环境参数的传感器，包括：用于嵌入混凝土的外壳; 连接到所述外壳的检测装置，用于检测具体的至少一个环境参数，所述检测装置包括用于测量电容变化的至少一个电容元件; 连接到所述外壳的活性材料，所述活性材料易于响应所述环境参数，并且所述活性材料可操作地连接到所述电容元件; 安装在所述外壳内的RFID芯片，所述RFID芯片可操作地连接到所述检测装置; 以及可操作地连接到所述RFID芯片的天线，所述天线可操作地连接到所述检测装置，并且所述天线是共振频率在分配频带内移动的L-R-C电路的一部分。本发明还提供了一种基于混凝土的环境参数的基于MEMS的电容器。

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