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1. 发明授权

US06512295B2 Coupled-cap flip chip BGA package with improved cap design for reduced interfacial stresses 有权
公开(公告)号：US06512295B2
公开(公告)日：2003-01-28
申请号：US09797078
申请日：2001-03-01
申请人： Michael Anthony Gaynes , Eric Arthur Johnson
发明人： Michael Anthony Gaynes , Eric Arthur Johnson
IPC分类号： H01L2940
CPC分类号： H01L23/3128 , H01L21/563 , H01L23/4334 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要： Plastic ball grid array (PBGA) packages comprised of organic carriers on which are mounted and encapsulated semiconductor chips, providing for the mounting of so-called flip-chips. The chips are overlaid with a heat spreading thermally-conductive cap of a mesh-like material which is interstitially filled with an adhesive to prevent delamination caused by mismatches in the coefficients of thermal expansion, which result in contractions which cause the entire package arrangement to warp, leading to delamination between an encapsulant and cap and resulting in failure of connect joints and the ball grid arrays.

2. 发明授权

US06670223B2 Coupled-cap flip chip BGA package with improved cap design for reduced interfacial stresses 失效
标题翻译：耦合盖倒装芯片BGA封装，具有改进的盖设计，降低界面应力
公开(公告)号：US06670223B2
公开(公告)日：2003-12-30
申请号：US10285023
申请日：2002-10-31
申请人： Michael Anthony Gaynes , Eric Arthur Johnson
发明人： Michael Anthony Gaynes , Eric Arthur Johnson
IPC分类号： H01L2148
CPC分类号： H01L23/3128 , H01L21/563 , H01L23/4334 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要： Wire bond packages which mount encapsulated semiconductor chips, such as plastic ball grid array (PBGA) packages providing for the mounting of so-called flip-chips. The chips are overlaid with a heat spreading thermally-conductive cap of a mesh-like material which is interstitially the filled with an adhesive to prevent delamination caused by mismatches in the coefficients of thermal expansion, which result in contractions which cause the entire package arrangement to warp, leading to delamination between an encapsulant and cap and resulting in failure of connect joints and the ball grid arrays.
摘要翻译：封装半导体芯片的引线键合封装，例如塑料球栅阵列（PBGA）封装，提供所谓的倒装芯片的安装。芯片覆盖有网状材料的热扩散导热盖，其间隙填充有粘合剂，以防止由热膨胀系数中的错配引起的分层，导致导致整个封装布置的收缩翘曲，导致密封剂和帽之间的分层，并导致连接接头和球栅阵列的故障。

3. 发明授权

US06403882B1 Protective cover plate for flip chip assembly backside 失效
标题翻译：倒装芯片组装背面的保护盖板
公开(公告)号：US06403882B1
公开(公告)日：2002-06-11
申请号：US08884796
申请日：1997-06-30
申请人： William Tze-You Chen , Michael Anthony Gaynes , Eric Arthur Johnson , Tien Yue Wu
发明人： William Tze-You Chen , Michael Anthony Gaynes , Eric Arthur Johnson , Tien Yue Wu
IPC分类号： H01L2302
CPC分类号： H01L23/49816 , H01L23/16 , H01L23/36 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2924/15311 , H01L2224/0401
摘要： A chip package includes a die having an active surface and an inactive surface. An adhesive is formed on the inactive surface where the adhesive has a low Young's modulus of elasticity. The low Young's modulus of elasticity may be 10,000 psi or less; 1,000 psi or less; or, preferably, about 1,000 psi. Further, the adhesive may include a thermal conducting material. A protective plate is coupled to the inactive surface using the adhesive and a chip carrier is coupled to the active surface of the die.
摘要翻译：芯片封装包括具有活性表面和非活性表面的模具。在非活性表面上形成粘合剂，其中粘合剂具有低的杨氏弹性模量。低杨氏弹性模量可以是10,000psi或更小; 1,000 psi以下; 或优选约1,000psi。此外，粘合剂可以包括导热材料。使用粘合剂将保护板耦合到非活性表面，并且芯片载体耦合到模具的有效表面。

4. 发明授权

US06495771B2 Compliant multi-layered circuit board for PBGA applications 失效
标题翻译：符合PBGA应用的多层电路板
公开(公告)号：US06495771B2
公开(公告)日：2002-12-17
申请号：US09820563
申请日：2001-03-29
申请人： Michael Anthony Gaynes , Eric Arthur Johnson
发明人： Michael Anthony Gaynes , Eric Arthur Johnson
IPC分类号： H05K103
CPC分类号： H05K3/462 , H01L23/49833 , H01L2224/16225 , H01L2924/00014 , H01L2924/15311 , H05K1/0272 , H05K3/28 , H05K3/321 , H05K3/4623 , H05K3/4697 , H05K2201/09536 , Y10T29/49126 , H01L2224/0401
摘要： A electronic package is constituted of a compliant multi-layered circuit board or printed circuit board package, particularly for use in ball grid array (BGA) applications wherein two or possibly greater numbers of naturally spaced sub-composites are equipped with electronic circuitry which is interconnected through the intermediary of conductive adhesives. Pursuant to a method of producing, no other mechanical connection is provided intermediate these spaced sub-composites except, possibly, along the periphery of the structure thereof, where a molded plastic seal may be provided in order to form a protection against the ingress environmental or external influences. The unfilled void, space or interspatial volume which is present between the spaced sub-composite facilitates the deformation in shear of the conductive adhesive interconnections, such as epoxy resins or the like, with extremely little constraint of the various components.
摘要翻译：电子封装由兼容的多层电路板或印刷电路板封装构成，特别是用于球栅阵列（BGA）应用中，其中两个或可能更多数量的自然间隔的子复合材料配备有互连的电子电路通过导电胶的中介。根据生产方法，除了可能沿着其结构的周边之外，在这些间隔的子复合材料之间没有提供其它机械连接，其中可以提供模制塑料密封件，以形成防止侵入环境或外部影响存在于间隔的副复合物之间的未填充的空隙，空间或空间体积有助于导电粘合剂互连（例如环氧树脂等）的剪切变形，对各种组分的限制非常小。

5. 发明授权

US07134645B1 Winch assembly for use with synthetic ropes 失效
标题翻译：绞车总成用于合成绳索
公开(公告)号：US07134645B1
公开(公告)日：2006-11-14
申请号：US10358911
申请日：2003-02-05
申请人： Eric Arthur Johnson , Stuart Leigh Phoenix
发明人： Eric Arthur Johnson , Stuart Leigh Phoenix
IPC分类号： B66D1/36
CPC分类号： B66D1/741
摘要： A winch assembly is disclosed that eliminates rope crushing, even when synthetic ropes are used. Tension is applied to the rope by at least one traction sheave so that the tension at the drum is reduced. By using multiple sheaves with large wrap angles traction can be applied to the rope over a much larger area, reducing shear stress and minimizing internal wear due to relative motion of rope components. The winch drum and at least one traction sheave are driven independently, preferably by AC induction motors using frequency control. The winch assembly may operate in conjunction with a hydraulic tensioner so that lower horsepower motors can be used to maintain constant tension in moving systems.
摘要翻译：公开了一种绞车组件，即使在使用合成绳索时也可消除绳索破碎。通过至少一个牵引滑轮对绳索施加张力，使得滚筒处的张力减小。通过使用具有大包角的多个滑轮，牵引力可以在更大的面积上施加到绳索上，减少剪切应力并且最小化由于绳索部件的相对运动引起的内部磨损。绞车鼓和至少一个牵引滑轮独立地驱动，优选地通过使用频率控制的AC感应电动机驱动。绞车组件可以与液压张紧器一起操作，使得较低马力的马达可用于在运动系统中保持恒定的张力。

6. 发明授权

US06691769B2 Heat sink for convection cooling in horizontal applications 有权
标题翻译：散热器用于水平应用中的对流冷却
公开(公告)号：US06691769B2
公开(公告)日：2004-02-17
申请号：US09924210
申请日：2001-08-07
申请人： Eric Arthur Johnson , Randall Joseph Stutzman
发明人： Eric Arthur Johnson , Randall Joseph Stutzman
IPC分类号： F28F700
CPC分类号： H01L23/467 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A heat sink for free convection cooling in horizontal applications is provided. Specifically, the heat sink includes a plurality of spaced apart cooling fins, which are supported by an angled base. The cooling fins are transversely attached to the base and extend in a substantially vertical direction. In addition, the cooling fins extend beyond an outer edge of the base so that air can flow horizontally beneath the base and then vertically through the spaced apart cooling fins.
摘要翻译：提供了一种用于水平应用中自由对流冷却的散热器。具体地，散热器包括多个间隔开的冷却翅片，其由倾斜的基座支撑。冷却翅片横向地附接到基部并且在基本垂直的方向上延伸。此外，冷却翅片延伸超过基座的外边缘，使得空气可以水平地在基座下方流动，然后垂直地流过间隔开的散热片。

7. 发明授权

US5888849A Method for fabricating an electronic package 失效
标题翻译：电子封装的制造方法
公开(公告)号：US5888849A
公开(公告)日：1999-03-30
申请号：US833478
申请日：1997-04-07
申请人： Eric Arthur Johnson
发明人： Eric Arthur Johnson
IPC分类号： H01L21/56 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L21/565 , H01L2224/16 , H01L2924/15311
摘要： An electronic package is fabricated by providing a thin, circuitized substrate having electrical circuitry on a first surface; and then molding a dielectric body to the first surface of the substrate. The dielectric body contains an opening for exposing a portion of the surface of the thin circuitized substrate having at least a portion of the electrical circuitry. A semiconductor device is then positioned within the opening of the molded dielectric body and is electrically coupled to at least a portion of the electrical circuitry on the exposed portion of the surface of the thin circuitized substrate. Next, a plurality of electrical conductive members are secured to a surface of the thin circuitized substrate that is opposite the first surface.
摘要翻译：通过在第一表面上提供具有电路的薄的电路化基板来制造电子封装; 然后将电介质体模塑到衬底的第一表面上。电介质体包含用于暴露具有电路的至少一部分的薄电路化衬底的表面的一部分的开口。然后将半导体器件定位在模制的电介质体的开口内，并且电耦合到薄电路化衬底的表面的暴露部分上的电路的至少一部分。接下来，多个导电构件固定到薄电路基板的与第一表面相对的表面。

8. 发明授权

US07264649B1 System for allergen reduction through indoor humidity control 失效
标题翻译：通过室内湿度控制减轻过敏原的系统
公开(公告)号：US07264649B1
公开(公告)日：2007-09-04
申请号：US10898042
申请日：2004-07-23
申请人： Eric Arthur Johnson , Joseph Duane Kulesza
发明人： Eric Arthur Johnson , Joseph Duane Kulesza
IPC分类号： B01D53/04 , B01D53/26
CPC分类号： B01D53/261 , B01D53/28 , B01J20/267 , B01J20/28033 , B01J20/28035 , B01J20/28047 , B01J20/3204 , B01J20/3282 , B01J20/3425 , B01J20/3441 , B01J20/3483 , F24F11/30 , F24F2110/20
摘要： The invention provides a humidity control system (HCS) to control indoor humidity within a specified range so as to reduce indoor house-dust mite allergen levels. The invention also provides a hydrogel absorber/desorber for reversibly absorbing water vapor from air releasing water vapor to air. The invention employs a reversible hydrogel desiccant as the active element for absorption and desorption of water, thus rendering the HCS more effective and energy-efficient than traditional humidification/dehumidification systems. The HCS of the invention treats indoor air by drawing fresh air in from outside and adjusting the humidity of the air-stream. In certain embodiments, fresh air is drawn in from the outside and mixed with recirculated air. The HCS uses a controller to introduce fresh air into the interior space and to control air circulation within it. Relative humidity is monitored remotely throughout the interior space using wired or wireless sensors.
摘要翻译：本发明提供一种控制室内湿度在规定范围内的湿度控制系统（HCS），以减少室内尘螨变应原水平。本发明还提供一种水凝胶吸收剂/解吸器，用于从空气中释放水蒸气到空气中可逆地吸收水蒸气。本发明采用可逆水凝胶干燥剂作为吸收和解吸水的活性元素，从而使得HCS比传统的加湿/除湿系统更有效和节能。本发明的HCS通过从外部抽出新鲜空气并调节空气流的湿度来处理室内空气。在某些实施例中，新鲜空气从外部吸入并与再循环的空气混合。 HCS使用控制器将新鲜空气引入内部空间并控制其内部的空气流通。使用有线或无线传感器在整个室内空间监控相对湿度。

9. 发明授权

US06883593B2 Heat sink for convection cooling in horizontal applications 失效
标题翻译：散热器用于水平应用中的对流冷却
公开(公告)号：US06883593B2
公开(公告)日：2005-04-26
申请号：US10762904
申请日：2004-01-22
申请人： Eric Arthur Johnson , Randall Joseph Stutzman
发明人： Eric Arthur Johnson , Randall Joseph Stutzman
IPC分类号： H01L23/367 , H01L23/467 , F28F7/00
CPC分类号： H01L23/467 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A heat sink for free convection cooling in horizontal applications is provided. Specifically, the heat sink includes a plurality of spaced apart cooling fins, which are supported by an angled base. The cooling fins are transversely attached to the base and extend in a substantially vertical direction. In addition, the cooling fins extend beyond an outer edge of the base so that air can flow horizontally beneath the base and then vertically through the spaced apart cooling fins.
摘要翻译：提供了一种用于水平应用中自由对流冷却的散热器。具体地，散热器包括多个间隔开的冷却翅片，其由倾斜的基座支撑。冷却翅片横向地附接到基部并且在基本垂直的方向上延伸。此外，冷却翅片延伸超过基座的外边缘，使得空气可以水平地在基座下方流动，然后垂直地流过间隔开的散热片。

10. 发明授权

US06528892B2 Land grid array stiffener use with flexible chip carriers 有权
公开(公告)号：US06528892B2
公开(公告)日：2003-03-04
申请号：US09874196
申请日：2001-06-05
申请人： David Vincent Caletka , Krishna NMN Darbha , William NMN Infantolino , Eric Arthur Johnson
发明人： David Vincent Caletka , Krishna NMN Darbha , William NMN Infantolino , Eric Arthur Johnson
IPC分类号： H01L2348
CPC分类号： H01L23/4985 , H01L2224/16 , H01L2924/01087 , H01L2924/10253 , H01L2924/15311 , H01L2924/16195 , H01L2924/00
摘要： A flexible chip carrier with contact pads on its upper surface matching those of the chip with said pads conductively connected to land grid array (LGA) pads on its lower surface matching the those of a card or PCB. The chip carrier is provided with a stiffening layer at the LGA interface. The stiffening layer is mechanically attached to the lower surface of the chip carrier. Holes are formed in the stiffening layer to expose the LGA pads. The holes are then filled with a conductive adhesive material. Compliant LGA bumps are applied to the uncured conductive adhesive material which material is then cured.

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