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1. 发明授权

US07523848B2 Method and apparatus for measuring the size of free air balls on a wire bonder 失效
标题翻译：用于测量引线接合机上游离气球尺寸的方法和装置
公开(公告)号：US07523848B2
公开(公告)日：2009-04-28
申请号：US11148540
申请日：2005-06-09
申请人： David T. Beatson , Deepak Sood , Norman Lucas , Zhijie Wang
发明人： David T. Beatson , Deepak Sood , Norman Lucas , Zhijie Wang
IPC分类号： B23K31/02 , G01B11/00
CPC分类号： B23K20/007 , B23K20/10 , B23K31/12 , B23K2101/40 , H01L2224/78301 , H01L2924/14
摘要： A system for measuring the size of free air balls for use with a wire bonder having a wire bonding tool and an Electric Flame Off (EFO) device is provided. The system includes an imager disposed above a first image plane, a prism disposed below the imager, and at least one lens positioned between the first image plane and the prism in a first optical path. The at least one lens is positioned between the prism and the imager in a second optical path, where the second optical path is different from the first optical path. An image of the free air ball disposed at a lower portion of the wire bonding tool is provided to the imager via the prism and the at least one lens.
摘要翻译：提供了一种用于测量与具有引线接合工具和电火焰熄灭（EFO）装置的引线接合器一起使用的自由空气球的尺寸的系统。该系统包括设置在第一图像平面上方的成像器，设置在成像器下方的棱镜以及位于第一光路中的第一像面与棱镜之间的至少一个透镜。所述至少一个透镜位于所述棱镜和所述成像器之间的第二光路中，其中所述第二光路不同于所述第一光路。设置在引线接合工具的下部的自由空气球的图像通过棱镜和至少一个透镜被提供给成像器。

2. 发明授权

US07527186B2 Method and apparatus for mapping a position of a capillary tool tip using a prism 失效
标题翻译：用于使用棱镜映射毛细管刀尖的位置的方法和装置
公开(公告)号：US07527186B2
公开(公告)日：2009-05-05
申请号：US11148486
申请日：2005-06-09
申请人： David T. Beatson , Deepak Sood , Norman Lucas
发明人： David T. Beatson , Deepak Sood , Norman Lucas
IPC分类号： G01B11/14 , G02B5/22 , B23K26/20
CPC分类号： H01L24/78 , B23K20/007 , H01L2224/78301 , H01L2224/859 , H01L2924/00014 , H01L2924/01005 , H01L2924/0102 , H01L2924/01033 , H01L2924/01077 , H01L2924/01082 , H01L2924/12043 , H01L2924/14 , Y10S228/904 , H01L2224/48 , H01L2224/45099 , H01L2924/00
摘要： A system for determining wire bonding tool placement for use with a wire bonder and an optical imager is provided. The system includes a prism disposed below the optical imager and the wire bonding tool. The system also includes at least one lens positioned between the prism and a lower portion of the wire bonding tool along a first optical axis. The at least one lens and the prism define an object plane between the at least one lens and the lower portion of the wire bonding tool. The at least one lens is positioned between the prism and the optical imager along a second optical axis. The at least one lens and the prism define an image plane between the at least one lens and the optical imager.
摘要翻译：提供了一种用于确定用于引线接合器和光学成像器的引线接合工具布置的系统。该系统包括设置在光学成像器下方的棱镜和引线接合工具。该系统还包括沿着第一光轴定位在棱镜和引线接合工具的下部之间的至少一个透镜。所述至少一个透镜和所述棱镜在所述至少一个透镜和所述引线接合工具的下部之间限定物平面。所述至少一个透镜沿着第二光轴定位在所述棱镜和所述光学成像器之间。所述至少一个透镜和所述棱镜限定所述至少一个透镜和所述光学成像器之间的图像平面。

3. 发明申请

US20050284914A1 Method and apparatus for measuring the size of free air balls on a wire bonder 失效
标题翻译：用于测量引线接合机上游离气球尺寸的方法和装置
公开(公告)号：US20050284914A1
公开(公告)日：2005-12-29
申请号：US11148540
申请日：2005-06-09
申请人： David Beatson , Deepak Sood , Norman Lucas , Zhijie Wang
发明人： David Beatson , Deepak Sood , Norman Lucas , Zhijie Wang
IPC分类号： B23K20/00 , B23K20/10 , B23K31/02 , B23K31/12 , B23K37/00
CPC分类号： B23K20/007 , B23K20/10 , B23K31/12 , B23K2101/40 , H01L2224/78301 , H01L2924/14
摘要： A system for measuring the size of free air balls for use with a wire bonder having a wire bonding tool and an Electric Flame Off (EFO) device is provided. The system includes an imager disposed above a first image plane, a prism disposed below the imager, and at least one lens positioned between the first image plane and the prism in a first optical path. The at least one lens is positioned between the prism and the imager in a second optical path, where the second optical path is different from the first optical path. An image of the free air ball disposed at a lower portion of the wire bonding tool is provided to the imager via the prism and the at least one lens.
摘要翻译：提供了一种用于测量与具有引线接合工具和电火焰熄灭（EFO）装置的引线接合器一起使用的自由空气球的尺寸的系统。该系统包括设置在第一图像平面上方的成像器，设置在成像器下方的棱镜以及位于第一光路中的第一像面与棱镜之间的至少一个透镜。所述至少一个透镜位于所述棱镜和所述成像器之间的第二光路中，其中所述第二光路不同于所述第一光路。设置在引线接合工具的下部的自由空气球的图像通过棱镜和至少一个透镜被提供给成像器。

4. 发明授权

US06997368B2 Fiber alignment process using cornercube offset tool 失效
公开(公告)号：US06997368B2
公开(公告)日：2006-02-14
申请号：US10458535
申请日：2003-06-10
申请人： David T. Beatson , Deepak Sood , Ashoke Banerjee
发明人： David T. Beatson , Deepak Sood , Ashoke Banerjee
IPC分类号： B23K31/02
CPC分类号： B23K20/007 , B23K20/002 , B23K20/10 , B23K31/12 , B23K2101/40 , H01L2224/78301 , H05K13/08
摘要： A system and method for aligning optical fibers that takes into account variations due to temperature changes and other nonrandom systemic effects. The system includes an alignment tool having a plurality of internal reflection surfaces and located below a vision plane of the first one of the pair of optical fibers, and an optical detector to receive an indirect image of a bottom surface of the first optical fiber through the alignment tool, such an offset between the first optical fiber and the optical detector is determined based on the indirect image received by the optical detector. The method comprises the steps of providing a cornercube offset tool having a plurality of total internal reflection surfaces below a vision plane of the first optical fiber, and receiving an indirect image of the first optical fiber through the cornercube offset tool.

5. 发明授权

US06729530B2 Fiber alignment apparatus and process using cornercube offset tool 失效
标题翻译：光纤对准装置和工艺采用角撑角偏移工具
公开(公告)号：US06729530B2
公开(公告)日：2004-05-04
申请号：US10131873
申请日：2002-04-25
申请人： David T. Beatson , Deepak Sood , Ashoke Banerjee
发明人： David T. Beatson , Deepak Sood , Ashoke Banerjee
IPC分类号： B23K3102
CPC分类号： B23K20/007 , B23K20/002 , B23K20/10 , B23K31/12 , B23K2101/40 , H01L2224/78301 , H05K13/08
摘要： A system and method for aligning optical fibers that takes into account variations due to temperature changes and other nonrandom systemic effects. The system includes an alignment tool having a plurality of internal reflection surfaces and located below a vision plane of the first one of the pair of optical fibers, and an optical detector to receive an indirect image of a bottom surface of the first optical fiber through the alignment tool, such an offset between the first optical fiber and the optical detector is determined based on the indirect image received by the optical detector. The method comprises the steps of providing a cornercube offset tool having a plurality of total internal reflection surfaces below a vision plane of the first optical fiber, and receiving an indirect image of the first optical fiber through the cornercube offset tool.
摘要翻译：用于对准考虑到温度变化和其他非随机系统影响的变化的光纤的系统和方法。该系统包括具有多个内部反射表面并且位于该对光纤中的第一个的视平面下方的对准工具，以及光学检测器，用于通过第一光纤的第一光纤的底表面接收间接图像基于由光学检测器接收的间接图像来确定第一光纤和光学检测器之间的这种偏移的对准工具。该方法包括以下步骤：提供具有在第一光纤的视平面下方的多个全内反射表面的角架偏移工具，以及通过角架偏移工具接收第一光纤的间接图像。

6. 发明申请

US20120128229A1 IMAGING OPERATIONS FOR A WIRE BONDING SYSTEM 审中-公开
标题翻译：一种线束接合系统的成像操作
公开(公告)号：US20120128229A1
公开(公告)日：2012-05-24
申请号：US13293727
申请日：2011-11-10
申请人： Paul W. Sucro , Zhijie Wang , Deepak Sood , Peter M. Lister
发明人： Paul W. Sucro , Zhijie Wang , Deepak Sood , Peter M. Lister
IPC分类号： G06K9/00
CPC分类号： H01L24/78 , G06T7/0008 , G06T7/001 , G06T2207/20221 , G06T2207/30148 , H01L2224/48091 , H01L2224/48465 , H01L2224/78 , H01L2224/859 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A method of imaging a feature of a semiconductor device is provided. The method includes the steps of: (a) imaging a first portion of a semiconductor device to form a first imaged portion; (b) imaging a subsequent portion of the semiconductor device to form a subsequent imaged portion; (c) adding the subsequent imaged portion to the first imaged portion to form a combined imaged portion; and (d) comparing the combined imaged portion to a reference image of a feature to determine a level of correlation of the combined imaged portion to the reference image.
摘要翻译：提供了一种对半导体器件的特征进行成像的方法。该方法包括以下步骤：（a）对半导体器件的第一部分进行成像以形成第一成像部分; （b）对所述半导体器件的后续部分进行成像以形成随后的成像部分; （c）将随后的成像部分添加到第一成像部分以形成组合的成像部分; 和（d）将组合的成像部分与特征的参考图像进行比较，以确定组合的成像部分与参考图像的相关程度。

7. 发明申请

US20110174865A1 METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDUCTOR PROCESSING OPERATIONS 有权
标题翻译：教导用于电线连接和相关半导体加工操作的方法
公开(公告)号：US20110174865A1
公开(公告)日：2011-07-21
申请号：US13072930
申请日：2011-03-28
申请人： Michael T. Deley , Zhijie Wang , Peter M. Lister , Deepak Sood
发明人： Michael T. Deley , Zhijie Wang , Peter M. Lister , Deepak Sood
IPC分类号： B23K31/12 , G06K9/00
CPC分类号： B23K20/004 , B23K2101/40 , H01L23/544 , H01L24/05 , H01L24/06 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2223/5442 , H01L2223/54426 , H01L2223/54473 , H01L2223/5448 , H01L2224/02166 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/0603 , H01L2224/48227 , H01L2224/48465 , H01L2224/49171 , H01L2224/78901 , H01L2224/85121 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , Y10S228/904 , H01L2224/78 , H01L2924/00 , H01L2224/05556 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.
摘要翻译：提供了一种教导用于引线键合操作的眼点的方法。该方法包括：（1）从半导体器件的区域中选择一组形状用作眼点，以及（2）使用（a）样品半导体器件或（b）与半导体器件相关的预定数据。教学步骤包括相对于彼此定义每个形状的位置。

8. 发明授权

US08100317B2 Method of teaching eyepoints for wire bonding and related semiconductor processing operations 有权
标题翻译：教导用于引线键合和相关半导体加工操作的眼点的方法
公开(公告)号：US08100317B2
公开(公告)日：2012-01-24
申请号：US13072930
申请日：2011-03-28
申请人： Michael T. Deley , Peter M. Lister , Deepak Sood , Zhijie Wang
发明人： Michael T. Deley , Peter M. Lister , Deepak Sood , Zhijie Wang
IPC分类号： B23K31/00 , B23K11/00
CPC分类号： B23K20/004 , B23K2101/40 , H01L23/544 , H01L24/05 , H01L24/06 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2223/5442 , H01L2223/54426 , H01L2223/54473 , H01L2223/5448 , H01L2224/02166 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/0603 , H01L2224/48227 , H01L2224/48465 , H01L2224/49171 , H01L2224/78901 , H01L2224/85121 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , Y10S228/904 , H01L2224/78 , H01L2924/00 , H01L2224/05556 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.
摘要翻译：提供了一种教导用于引线键合操作的眼点的方法。该方法包括：（1）从半导体器件的区域中选择一组形状用作眼点，以及（2）使用（a）样品半导体器件或（b）与半导体器件相关的预定数据。教学步骤包括相对于彼此定义每个形状的位置。

9. 发明申请

US20100181365A1 METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDUCTOR PROCESSING OPERATIONS 有权
标题翻译：教导用于电线连接和相关半导体加工操作的方法
公开(公告)号：US20100181365A1
公开(公告)日：2010-07-22
申请号：US12093403
申请日：2007-03-13
申请人： Michael T. Deley , Peter M. Lister , Deepak Sood , Zhijie Wang
发明人： Michael T. Deley , Peter M. Lister , Deepak Sood , Zhijie Wang
IPC分类号： B23K31/02 , B23K20/00
CPC分类号： B23K20/004 , B23K2101/40 , H01L23/544 , H01L24/05 , H01L24/06 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2223/5442 , H01L2223/54426 , H01L2223/54473 , H01L2223/5448 , H01L2224/02166 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/0603 , H01L2224/48227 , H01L2224/48465 , H01L2224/49171 , H01L2224/78901 , H01L2224/85121 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , Y10S228/904 , H01L2224/78 , H01L2924/00 , H01L2224/05556 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.
摘要翻译：提供了一种教导用于引线键合操作的眼点的方法。该方法包括：（1）从半导体器件的区域中选择一组形状用作眼点，以及（2）使用（a）样品半导体器件或（b）与半导体器件相关的预定数据。教学步骤包括相对于彼此定义每个形状的位置。

10. 发明授权

US07931186B2 Method of teaching eyepoints for wire bonding and related semiconductor processing operations 有权
标题翻译：教导用于引线键合和相关半导体加工操作的眼点的方法
公开(公告)号：US07931186B2
公开(公告)日：2011-04-26
申请号：US12093403
申请日：2007-03-13
申请人： Michael T. Deley , Peter M. Lister , Deepak Sood , Zhijie Wang
发明人： Michael T. Deley , Peter M. Lister , Deepak Sood , Zhijie Wang
IPC分类号： B23K31/00 , B23K11/00
CPC分类号： B23K20/004 , B23K2101/40 , H01L23/544 , H01L24/05 , H01L24/06 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2223/5442 , H01L2223/54426 , H01L2223/54473 , H01L2223/5448 , H01L2224/02166 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/0603 , H01L2224/48227 , H01L2224/48465 , H01L2224/49171 , H01L2224/78901 , H01L2224/85121 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , Y10S228/904 , H01L2224/78 , H01L2924/00 , H01L2224/05556 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.
摘要翻译：提供了一种教导用于引线键合操作的眼点的方法。该方法包括：（1）从半导体器件的区域中选择一组形状用作眼点，以及（2）使用（a）样品半导体器件或（b）与半导体器件相关的预定数据。教学步骤包括相对于彼此定义每个形状的位置。

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