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1. 发明申请

US20120128229A1 IMAGING OPERATIONS FOR A WIRE BONDING SYSTEM 审中-公开
标题翻译：一种线束接合系统的成像操作
公开(公告)号：US20120128229A1
公开(公告)日：2012-05-24
申请号：US13293727
申请日：2011-11-10
申请人： Paul W. Sucro , Zhijie Wang , Deepak Sood , Peter M. Lister
发明人： Paul W. Sucro , Zhijie Wang , Deepak Sood , Peter M. Lister
IPC分类号： G06K9/00
CPC分类号： H01L24/78 , G06T7/0008 , G06T7/001 , G06T2207/20221 , G06T2207/30148 , H01L2224/48091 , H01L2224/48465 , H01L2224/78 , H01L2224/859 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A method of imaging a feature of a semiconductor device is provided. The method includes the steps of: (a) imaging a first portion of a semiconductor device to form a first imaged portion; (b) imaging a subsequent portion of the semiconductor device to form a subsequent imaged portion; (c) adding the subsequent imaged portion to the first imaged portion to form a combined imaged portion; and (d) comparing the combined imaged portion to a reference image of a feature to determine a level of correlation of the combined imaged portion to the reference image.
摘要翻译：提供了一种对半导体器件的特征进行成像的方法。该方法包括以下步骤：（a）对半导体器件的第一部分进行成像以形成第一成像部分; （b）对所述半导体器件的后续部分进行成像以形成随后的成像部分; （c）将随后的成像部分添加到第一成像部分以形成组合的成像部分; 和（d）将组合的成像部分与特征的参考图像进行比较，以确定组合的成像部分与参考图像的相关程度。

2. 发明授权

US08100317B2 Method of teaching eyepoints for wire bonding and related semiconductor processing operations 有权
标题翻译：教导用于引线键合和相关半导体加工操作的眼点的方法
公开(公告)号：US08100317B2
公开(公告)日：2012-01-24
申请号：US13072930
申请日：2011-03-28
申请人： Michael T. Deley , Peter M. Lister , Deepak Sood , Zhijie Wang
发明人： Michael T. Deley , Peter M. Lister , Deepak Sood , Zhijie Wang
IPC分类号： B23K31/00 , B23K11/00
CPC分类号： B23K20/004 , B23K2101/40 , H01L23/544 , H01L24/05 , H01L24/06 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2223/5442 , H01L2223/54426 , H01L2223/54473 , H01L2223/5448 , H01L2224/02166 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/0603 , H01L2224/48227 , H01L2224/48465 , H01L2224/49171 , H01L2224/78901 , H01L2224/85121 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , Y10S228/904 , H01L2224/78 , H01L2924/00 , H01L2224/05556 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.
摘要翻译：提供了一种教导用于引线键合操作的眼点的方法。该方法包括：（1）从半导体器件的区域中选择一组形状用作眼点，以及（2）使用（a）样品半导体器件或（b）与半导体器件相关的预定数据。教学步骤包括相对于彼此定义每个形状的位置。

3. 发明申请

US20110174865A1 METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDUCTOR PROCESSING OPERATIONS 有权
标题翻译：教导用于电线连接和相关半导体加工操作的方法
公开(公告)号：US20110174865A1
公开(公告)日：2011-07-21
申请号：US13072930
申请日：2011-03-28
申请人： Michael T. Deley , Zhijie Wang , Peter M. Lister , Deepak Sood
发明人： Michael T. Deley , Zhijie Wang , Peter M. Lister , Deepak Sood
IPC分类号： B23K31/12 , G06K9/00
CPC分类号： B23K20/004 , B23K2101/40 , H01L23/544 , H01L24/05 , H01L24/06 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2223/5442 , H01L2223/54426 , H01L2223/54473 , H01L2223/5448 , H01L2224/02166 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/0603 , H01L2224/48227 , H01L2224/48465 , H01L2224/49171 , H01L2224/78901 , H01L2224/85121 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , Y10S228/904 , H01L2224/78 , H01L2924/00 , H01L2224/05556 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.
摘要翻译：提供了一种教导用于引线键合操作的眼点的方法。该方法包括：（1）从半导体器件的区域中选择一组形状用作眼点，以及（2）使用（a）样品半导体器件或（b）与半导体器件相关的预定数据。教学步骤包括相对于彼此定义每个形状的位置。

4. 发明申请

US20100181365A1 METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDUCTOR PROCESSING OPERATIONS 有权
标题翻译：教导用于电线连接和相关半导体加工操作的方法
公开(公告)号：US20100181365A1
公开(公告)日：2010-07-22
申请号：US12093403
申请日：2007-03-13
申请人： Michael T. Deley , Peter M. Lister , Deepak Sood , Zhijie Wang
发明人： Michael T. Deley , Peter M. Lister , Deepak Sood , Zhijie Wang
IPC分类号： B23K31/02 , B23K20/00
CPC分类号： B23K20/004 , B23K2101/40 , H01L23/544 , H01L24/05 , H01L24/06 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2223/5442 , H01L2223/54426 , H01L2223/54473 , H01L2223/5448 , H01L2224/02166 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/0603 , H01L2224/48227 , H01L2224/48465 , H01L2224/49171 , H01L2224/78901 , H01L2224/85121 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , Y10S228/904 , H01L2224/78 , H01L2924/00 , H01L2224/05556 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.
摘要翻译：提供了一种教导用于引线键合操作的眼点的方法。该方法包括：（1）从半导体器件的区域中选择一组形状用作眼点，以及（2）使用（a）样品半导体器件或（b）与半导体器件相关的预定数据。教学步骤包括相对于彼此定义每个形状的位置。

5. 发明授权

US07931186B2 Method of teaching eyepoints for wire bonding and related semiconductor processing operations 有权
标题翻译：教导用于引线键合和相关半导体加工操作的眼点的方法
公开(公告)号：US07931186B2
公开(公告)日：2011-04-26
申请号：US12093403
申请日：2007-03-13
申请人： Michael T. Deley , Peter M. Lister , Deepak Sood , Zhijie Wang
发明人： Michael T. Deley , Peter M. Lister , Deepak Sood , Zhijie Wang
IPC分类号： B23K31/00 , B23K11/00
CPC分类号： B23K20/004 , B23K2101/40 , H01L23/544 , H01L24/05 , H01L24/06 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2223/5442 , H01L2223/54426 , H01L2223/54473 , H01L2223/5448 , H01L2224/02166 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05599 , H01L2224/0603 , H01L2224/48227 , H01L2224/48465 , H01L2224/49171 , H01L2224/78901 , H01L2224/85121 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , Y10S228/904 , H01L2224/78 , H01L2924/00 , H01L2224/05556 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.
摘要翻译：提供了一种教导用于引线键合操作的眼点的方法。该方法包括：（1）从半导体器件的区域中选择一组形状用作眼点，以及（2）使用（a）样品半导体器件或（b）与半导体器件相关的预定数据。教学步骤包括相对于彼此定义每个形状的位置。

6. 发明授权

US5699448A Split field optics for locating multiple components 失效
标题翻译：分离场光学元件用于定位多个组件
公开(公告)号：US5699448A
公开(公告)日：1997-12-16
申请号：US498128
申请日：1995-07-05
申请人： Michael J. Gorenflo , Peter M. Lister
发明人： Michael J. Gorenflo , Peter M. Lister
IPC分类号： G01B11/00 , G06K9/20 , G06T1/00 , G06K9/00
CPC分类号： G06K9/20
摘要： An apparatus and method is provided for capturing component location information through the use of fiber optic conduits. In various embodiments, an image of a component attached to a translatable and rotatable spindle is captured and transmitted along a fiber optic conduit to a camera coupled to an image processing computer. The image processing computer determines component location on the spindle based on the transmitted image and, where necessary, generates component location correction information so that the spindle and attached component can be moved to a determined location. A plurality of fiber optic conduits may be bundled together to provide a single combined image of multiple components attached to multiple spindles which can be captured by a single camera, wherein the image processing computer segregates the images and determines multiple component location correction information.
摘要翻译：提供了一种通过使用光纤导管捕获部件位置信息的装置和方法。在各种实施例中，附接到可平移和可旋转的主轴的部件的图像被捕获并沿着光纤导管传送到耦合到图像处理计算机的照相机。图像处理计算机基于所发送的图像来确定主轴上的分量位置，并且在必要时产生分量位置校正信息，使得主轴和附接分量可以移动到确定的位置。多个光纤管道可以捆绑在一起以提供附接到多个主轴的多个部件的单个组合图像，多个主轴可以由单个相机捕获，其中图像处理计算机分离图像并确定多个部件位置校正信息。

7. 发明授权

US5317374A Method and apparatus for measuring a distance to an object from dual two dimensional images thereof 失效
标题翻译：用于从其双重二维图像测量到物体的距离的方法和装置
公开(公告)号：US5317374A
公开(公告)日：1994-05-31
申请号：US951009
申请日：1992-09-25
申请人： Peter M. Lister
发明人： Peter M. Lister
IPC分类号： G01C3/32 , G01S11/12 , G02B5/04 , G01C3/00
CPC分类号： G01C3/32 , G01S11/12 , G02B5/045
摘要： A prismatic viewing plate is situated across the focal axis between an object and an imaging device such as a camera capable of acquiring only a two dimensional image of the object. A characteristic of the prismatic plate is that it presents dual images of the object to the imaging device. Characteristic of the separation between the dual images is that it is dependent upon the distance of the object from the prismatic plate. These characteristics are employed to determine a range to the object by measuring the separation between the dual images, visually or by use of one of the many available machine vision techniques. A third dimension of a surface profile also can be obtained by scanning a spot of light over the object while separately viewing the spot through the prismatic plate and measuring the separation between dual images of the light spot at various points of the scan.
摘要翻译：棱镜式观察板位于物体与成像装置之间的焦点轴线上，诸如能够仅获得物体的二维图像的照相机。棱镜板的特征在于它将物体的双重图像呈现给成像装置。双重图像之间的分离的特征在于它取决于物体与棱镜板的距离。这些特征用于通过在视觉上或通过使用许多可用的机器视觉技术之一来测量双重图像之间的距离来确定对象的范围。通过在物体上扫描光斑，同时通过棱镜板分别观察光斑并测量扫描的各个点处的光斑的双重图像之间的距离，也可以获得表面轮廓的第三尺寸。

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