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    • 2. 发明授权
    • Method and apparatus for controlling electromagnetic radiation emissions generated by electrical components
    • 用于控制由电气部件产生的电磁辐射辐射的方法和装置
    • US06274807B1
    • 2001-08-14
    • US09191962
    • 1998-11-13
    • David PommerenkeDavid DickeyJames J DeBlancVictoria Tsang
    • David PommerenkeDavid DickeyJames J DeBlancVictoria Tsang
    • H05K900
    • H05K9/0062
    • A method and apparatus is provided for reducing or eliminating the amount of electromagnetic radiation being emitted from a system assembly comprising one or more subassemblies which comprise electrical circuits which generate electromagnetic radiation. The method and apparatus of the present invention also reduce or prevent electromagnetic radiation generated by sources outside of the system assembly from interfering with and adversely affecting the electrical circuits comprised in the subassemblies. To achieve these goals, the present invention provides an electromagnetic compatibility (EMC) solution which comprises a plurality of lossy elements, and/or elements comprised of a combination of lossy and conductive material, to reduce electromagnetic radiation. Thus, the conventional EMC solution, which utilizes conductive gaskets on system assemblies and subassemblies, and which requires adequate contact between parts in order to be effective, is replaced by the EMC solution of the present invention, which is more effective at higher frequencies and does not have stringent contact requirements.
    • 提供了一种用于减少或消除从包括一个或多个子组件的系统组件发射的电磁辐射量的方法和装置,所述子组件包括产生电磁辐射的电路。 本发明的方法和装置还减少或防止由系统组件外部的源产生的电磁辐射干扰和不利地影响组件中包括的电路。 为了实现这些目的,本发明提供一种电磁兼容性(EMC)解决方案,其包括多个有损元素和/或由有损和导电材料的组合组成的元件,以减少电磁辐射。 因此,在系统组件和子组件上使用导电垫圈并且需要部件之间充分接触以有效的传统EMC解决方案被本发明的EMC解决方案所取代,该解决方案在较高频率下更有效 没有严格的联系要求。
    • 5. 发明授权
    • Circuit board construction for differential bus distribution
    • 差分总线分配电路板结构
    • US06423909B1
    • 2002-07-23
    • US09795603
    • 2001-02-27
    • Carl R. HaynieDavid DickeyJames J. deBlanc
    • Carl R. HaynieDavid DickeyJames J. deBlanc
    • H01R1204
    • H05K1/0228H01R12/712H05K1/115H05K2201/09236H05K2201/09245H05K2201/09709H05K2201/10189
    • A circuit board including differential bus traces on or buried within both sides of the board, interconnecting electronic devices such as disk drives, processors, and connectors for external cables. Via fields, which mimic the size and configuration of the device and cable connector fields, are located between each connector on the board. The via fields link bus traces on or within one side of the board with respective bus traces on or within the other side of the board. The via fields may include subtle, unequal undulations in the trace patterns to provide equalization in the lengths of all trace pairs. The via fields and the connector fields both include repetitive conductor order reversals in the trace connections on opposing sides of the board, to reduce crosstalk between channels. The via fields may be oriented parallel with respect to collinearly arranged devices, or orthogonal with respect to devices or connectors which are parallel. Where a connector has laterally offset groups of pin connections, a via field may also include offset groups of vias to provide trace length equalization.
    • 电路板包括位于板的两侧或掩埋在板的两侧的差分总线迹线,互连电子设备,例如磁盘驱动器,处理器和用于外部电缆的连接器。 通过字段,模拟设备和电缆连接器字段的大小和配置,位于板上的每个连接器之间。 通孔区域将板的一侧上或其一侧的总线走线与板上另一侧的相应总线迹线相连。 通路区域可以包括迹线图案中微妙的,不相等的波动,以提供所有迹线对的长度的均衡。 通孔区域和连接器区域都包括在板的相对侧上的迹线连接中的重复导体顺序反转,以减少通道之间的串扰。 通孔区域可以相对于共线布置的器件取向平行,或者相对于平行的器件或连接器正交。 在连接器具有横向偏移销连接组的位置上,通孔区域还可以包括通孔的偏移组,以提供迹线长度均衡。
    • 8. 发明授权
    • Electromagnetic interference gasket
    • 电磁干扰垫片
    • US06320122B1
    • 2001-11-20
    • US09416490
    • 1999-10-12
    • David DickeyJames J. DeBlancAndrew M. Cherniski
    • David DickeyJames J. DeBlancAndrew M. Cherniski
    • H05K0900
    • H05K9/0018Y10T428/1362
    • An EMI device that provides a low impedance mechanism for conducting noise currents in all orientations back to the source of the noise currents in order to more effectively reduce EMI emissions is herein described. The EMI device is constructed from an elastomer core that is wrapped with a metallized electrically conductive material. The gasket is die cut and as such includes one or more open edges that are non-conductive. The non-conductive edges are stitched with a conductive material thereby enabling multiple conduction paths between any surface or edge of the gasket with a electrically conductive enclosure. In this manner, the gasket is able to provide a return path back to the source of the noise currents for all orientations of the noise currents and hence, more effectively reduce EMI emissions.
    • 这里描述了EMI器件,其提供用于将所有取向中的噪声电流传导回噪声电流源的低阻抗机制,以便更有效地降低EMI发射。 EMI器件由用金属化的导电材料包裹的弹性体芯构成。 垫圈是模切的,因此包括一个或多个不导电的开口边缘。 非导电边缘用导电材料缝合,从而使得在垫圈的任何表面或边缘之间具有导电外壳的多个传导路径。 以这种方式,垫圈能够为噪声电流的所有取向提供返回到噪声电流源的返回路径,因此更有效地减少EMI辐射。
    • 9. 发明授权
    • Data storage module alignment system and method
    • 数据存储模块对齐系统及方法
    • US06317329B1
    • 2001-11-13
    • US09191301
    • 1998-11-13
    • James L. DowdyAlicia G. MercerHerbert J. TanzerDarrel W. PoulterDavid Dickey
    • James L. DowdyAlicia G. MercerHerbert J. TanzerDarrel W. PoulterDavid Dickey
    • H05K700
    • H05K7/1424H05K7/1418
    • A data storage module alignment system and method for use in a data storage module and enclosure system including a module enclosure having a plurality of bay slots and at least one data storage module. The data storage module alignment system comprises at least one alignment guide that is adapted to be mounted at the module enclosure entrance and at least one guide rail that is adapted to be mounted to the data storage module. The alignment guide includes a plurality of guide channels having rounded edges. The guide rail is sized and shaped for receipt within the guide channels. Typically, the alignment guide further includes a plurality of guide flanges that are arranged asymmetrically along the alignment guide. The inner side of each guide flange defines an edge of one of the guide channels and includes chamfers which facilitate initial alignment of the data storage module within one of the bay slots of the module enclosure.
    • 一种用于数据存储模块和机壳系统的数据存储模块对准系统和方法,包括具有多个托架槽和至少一个数据存储模块的模块外壳。 数据存储模块对准系统包括适于安装在模块外壳入口处的至少一个对准引导件和适于安装到数据存储模块的至少一个导轨。 对准引导件包括具有圆形边缘的多个引导通道。 导轨的尺寸和形状适于在导向通道内接收。 通常,对准引导件还包括沿对准引导件非对称布置的多个引导凸缘。 每个引导凸缘的内侧限定一个导向通道的边缘,并且包括倒角,其有助于数据存储模块在模块外壳的一个托架间隙内的初始对准。