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1. 发明授权

US6060341A Method of making an electronic package 失效
标题翻译：制作电子包装的方法
公开(公告)号：US6060341A
公开(公告)日：2000-05-09
申请号：US5538
申请日：1998-01-12
申请人： David James Alcoe , Frank Edward Andros
发明人： David James Alcoe , Frank Edward Andros
IPC分类号： H01L21/60 , H01L23/495 , H01L23/498 , H01L21/44
CPC分类号： H01L24/86 , H01L23/49811 , H01L23/4985 , H01L23/49524 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15787 , H01L2924/3011
摘要： An electronic package is made by electrically bonding groups of conductive leads to two circuitized members after aligning the leads with electrical conductors on the circuitized members. Retention members may be used to hold the leads in alignment relative to each other prior to bonding and then are removed. Removal may include tearing away the retention member in propinquity to notches in the leads.
摘要翻译：电子封装通过将引线与电路化元件上的电导体对准之后将导电引线的电导电接合到两个电路元件上而制成。保持构件可以用于在接合之前相对于彼此保持引线对准，然后被移除。拆除可能包括将保持构件撕裂到引线中的凹口。

2. 发明授权

US06654250B1 Low-stress compressive heatsink structure 有权
标题翻译：低应力压缩散热器结构
公开(公告)号：US06654250B1
公开(公告)日：2003-11-25
申请号：US10254886
申请日：2002-09-25
申请人： David James Alcoe
发明人： David James Alcoe
IPC分类号： H05K720
CPC分类号： H05K1/189 , H05K2201/10734 , H05K2201/2009
摘要： A structure and technique for forming an I/C chip module and circuit card construction is provided. An I/C chip module having a flexible substrate, with first and second opposite sides concave, results from the CTE mismatch between the I/C chip and substrate. The I/C chip module is mounted on a flexible circuit card by solderball connection. The curvature of the I/C chip module causes the circuit card to curve correspondingly. A heatsink in thermal contact with the I/C chip places pressure on the I/C chip module in a direction to decrease the curvature. A rigid backing member retains the circuit card, generating a curved space between the backing member and the circuit card. A leaf spring applies pressure to the I/C chip module against the backing member. A compliant member is interposed between the backing member and the circuit board filling a portion of the curved space therebetween.
摘要翻译：提供了用于形成I / C芯片模块和电路卡结构的结构和技术。具有柔性衬底的I / C芯片模块，其具有第一和第二相对侧凹陷，由I / C芯片和衬底之间的CTE不匹配产生。 I / C芯片模块通过焊球连接安装在柔性电路卡上。 I / C芯片模块的曲率使电路卡相应地曲线。与I / C芯片热接触的散热片沿着减小曲率的方向对I / C芯片模块施加压力。刚性背衬构件保持电路卡，在背衬构件和电路卡之间产生弯曲的空间。板簧对I / C芯片模块施加压力抵靠背衬构件。柔性构件插入在衬垫构件和电路板之间，填充其间的弯曲空间的一部分。

3. 发明授权

US6051982A Electronic component test apparatus with rotational probe and conductive spaced apart means 失效
标题翻译：具有旋转探针和导电间隔装置的电子部件测试装置
公开(公告)号：US6051982A
公开(公告)日：2000-04-18
申请号：US826962
申请日：1997-04-09
申请人： David James Alcoe , David Vincent Caletka
发明人： David James Alcoe , David Vincent Caletka
IPC分类号： G01R1/067 , G01R1/073 , G01R31/02
CPC分类号： G01R1/07314 , G01R1/06733 , G01R1/07392
摘要： A test apparatus including at least one probe member precisely aligned using two spaced apart means (e.g., thin layers) such that the probe can effectively engage a conductor (e.g., solder ball) on an electronic module (e.g., ball grid array package). A compressible member (e.g., elastomeric body) is used to bias the probe toward the conductor. Various probe cross-sectional configurations are also provided. As taught herein, the probe electrically contacts one of the spaced apart means, also conductive, to thus form a circuit which can extend externally of the apparatus (e.g., for connecting to appropriate testing equipment).
摘要翻译：一种测试装置，其包括使用两个间隔开的装置（例如薄层）精确对准的至少一个探针构件，使得探针可以有效地接合电子模块（例如，球栅阵列封装）上的导体（例如，焊球）。使用可压缩构件（例如，弹性体）将探针偏压到导体。还提供了各种探针横截面构造。如本文所教导的，探针电接触一个间隔开的装置，也是导电的，从而形成可延伸到设备外部（例如，用于连接到适当的测试设备）的电路。

4. 发明授权

US5947750A Elastomeric structure with multi-layered elastomer and constraining base 失效
标题翻译：具有多层弹性体和约束基体的弹性体结构
公开(公告)号：US5947750A
公开(公告)日：1999-09-07
申请号：US848949
申请日：1997-04-30
申请人： David James Alcoe , William Louis Brodsky , David Vincent Caletka
发明人： David James Alcoe , William Louis Brodsky , David Vincent Caletka
IPC分类号： H01R12/62 , H05K3/36 , H01R9/09
CPC分类号： H01R12/62 , H05K3/365
摘要： An elastomeric structure including two layers, the first having patterned openings therein and adjacent web members, the second including a patterned array of upstanding projections. The openings and projections may be of cylindrical, rectangular, or other configurations and are oriented in highly dense patterns. The elastomeric is positioned with and attached to a base member having a sidewall substantially as high as the corresponding external side surface of the elastomeric's first layer. The sidewall constrains the elastomeric during compression. The invention thereby substantially prevents lateral expansion of the elastomeric's side surface and lateral deflection of both layers, resulting in a uniform distribution of compressive forces on the upstanding projections.
摘要翻译：包括两层的弹性体结构，其中第一层具有图案化的开口和相邻的腹板构件，第二层包括直立突起的图案化阵列。开口和突起可以是圆柱形，矩形或其它构造，并且以高致密图案取向。弹性体被定位并且附接到具有基本上与弹性体的第一层的对应外侧表面一样高的侧壁的基底构件。侧壁在压缩过程中约束弹性体。因此，本发明基本上防止了弹性体的侧面的横向膨胀和两层的横向偏转，从而导致对直立突起的压缩力的均匀分布。

5. 发明授权

US5804984A Electronic component test apparatus with rotational probe 失效
标题翻译：带旋转探头的电子部件测试装置
公开(公告)号：US5804984A
公开(公告)日：1998-09-08
申请号：US691732
申请日：1996-08-02
申请人： David James Alcoe , David Vincent Caletka
发明人： David James Alcoe , David Vincent Caletka
IPC分类号： G01R1/067 , G01R1/073 , G01R31/02
CPC分类号： G01R1/06733 , G01R1/07314 , G01R1/07392
摘要： A test apparatus including at least one probe member precisely aligned using two spaced apart means (e.g., thin dielectric layers having copper thereon) such that the probe can effectively engage a conductor (e.g., solder ball) on an electronic module (e.g., ball grid array package). A compressible member (e.g., elastomeric body) is used to bias the probe toward the conductor. Various probe cross-sectional configurations are also provided.
摘要翻译：一种测试装置，其包括使用两个间隔开的装置（例如，其上具有铜的薄介电层）精确对准的至少一个探针构件，使得探针可以有效地接合电子模块（例如，球栅）上的导体（例如，焊球）阵列包）。使用可压缩构件（例如，弹性体）将探针偏压到导体。还提供了各种探针横截面构造。

6. 发明授权

US06245186B1 Electronic package with compressible heatsink structure 失效
标题翻译：具有可压缩散热器结构的电子封装
公开(公告)号：US06245186B1
公开(公告)日：2001-06-12
申请号：US09225192
申请日：1999-01-05
申请人： David James Alcoe , Sanjeev Balwant Sathe
发明人： David James Alcoe , Sanjeev Balwant Sathe
IPC分类号： B32B3100
CPC分类号： H01L23/3733 , H01L21/563 , H01L23/3677 , H01L23/4093 , H01L23/433 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/01019 , H01L2924/01322 , Y10T156/1089 , Y10T156/1093 , H01L2924/00
摘要： An electronic package wherein an electronic device (e.g., chip) on a circuitized substrate of the package is thermally coupled to a heatsink in a separable manner using a plurality of compressible, thermally conductive members (e.g., solder balls). These members are compressed and permanently deformed as part of the thermal coupling.
摘要翻译：电子封装，其中封装的电路化基板上的电子器件（例如，芯片）使用多个可压缩的导热构件（例如，焊球）以可分离的方式热耦合到散热器。这些构件被压缩并作为热耦合的一部分永久地变形。

7. 发明授权

US5863814A Electronic package with compressible heatsink structure 失效
标题翻译：具有可压缩散热器结构的电子封装
公开(公告)号：US5863814A
公开(公告)日：1999-01-26
申请号：US886281
申请日：1997-07-01
申请人： David James Alcoe , Sanjeev Balwant Sathe
发明人： David James Alcoe , Sanjeev Balwant Sathe
IPC分类号： H05K7/20 , H01L21/56 , H01L23/12 , H01L23/34 , H01L23/36 , H01L23/367 , H01L23/373 , H01L23/40 , H01L23/433 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L23/3733 , H01L21/563 , H01L23/3677 , H01L23/4093 , H01L23/433 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/01019 , H01L2924/01322 , Y10T156/1089 , Y10T156/1093
摘要： An electronic package wherein an electronic device (e.g., chip) on a circuitized substrate of the package is thermally coupled to a heatsink in a separable manner using a plurality of compressible, thermally conductive members (e.g., solder balls). These members are compressed and permanently deformed as part of the thermal coupling.
摘要翻译：电子封装，其中封装的电路化基板上的电子器件（例如，芯片）使用多个可压缩的导热构件（例如，焊球）以可分离的方式热耦合到散热器。这些构件被压缩并作为热耦合的一部分永久地变形。

8. 发明授权

US5760465A Electronic package with strain relief means 失效
标题翻译：带应变消除装置的电子封装
公开(公告)号：US5760465A
公开(公告)日：1998-06-02
申请号：US595108
申请日：1996-02-01
申请人： David James Alcoe , Steven Wayne Anderson , Yifan Guo , Eric Arthur Johnson
发明人： David James Alcoe , Steven Wayne Anderson , Yifan Guo , Eric Arthur Johnson
IPC分类号： H01L21/60 , H01L23/12 , H01L23/13 , H01L23/16 , H01L23/373 , H01L23/495 , H01L23/498
CPC分类号： H01L24/50 , H01L23/13 , H01L23/16 , H01L23/49572 , H01L23/49816 , H01L2224/2929 , H01L2224/293 , H01L2224/83851 , H01L2924/01004 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01082 , H01L2924/15787 , H01L2924/351
摘要： An electronic package which includes a flexible substrate, stiffener and chip. The chip is bonded to the substrate, which was secured to the stiffener. Strain relief means are utilized at various locations in the package to prevent problems (e.g., tape "wrinkling") associated with relatively large differences in coefficients of thermal expansion between the package's various elements.
摘要翻译：包括柔性基板，加强件和芯片的电子封装。芯片被粘合到衬底上，固定到加强件上。应变消除装置用于包装中的各个位置，以防止与包装件的各种元件之间的热膨胀系数相对较大差异相关的问题（例如带子“起皱”）。

9. 发明授权

US06740959B2 EMI shielding for semiconductor chip carriers 失效
标题翻译：半导体芯片载体的EMI屏蔽
公开(公告)号：US06740959B2
公开(公告)日：2004-05-25
申请号：US09921062
申请日：2001-08-01
申请人： David James Alcoe , Jeffrey Thomas Coffin , Michael Anthony Gaynes , Harvey Charles Hamel , Mario J. Interrante , Brenda Lee Peterson , Megan J. Shannon , William Edward Sablinski , Christopher Todd Spring , Randall Joseph Stutzman , Renee L. Weisman , Jeffrey Allen Zitz
发明人： David James Alcoe , Jeffrey Thomas Coffin , Michael Anthony Gaynes , Harvey Charles Hamel , Mario J. Interrante , Brenda Lee Peterson , Megan J. Shannon , William Edward Sablinski , Christopher Todd Spring , Randall Joseph Stutzman , Renee L. Weisman , Jeffrey Allen Zitz
IPC分类号： H01L23552
CPC分类号： H01L23/552 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/01087 , H01L2924/12044 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/16195 , H01L2924/3025 , H01L2924/00
摘要： Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.
摘要翻译：包括EMI屏蔽的电子封装，特别是包含嵌入其中具有接地带的半导体芯片 - 载体结构的半导体器件，其适于减少高速开关电子封装的输出和入射EMI发射。

10. 发明授权

US06255136B1 Method of making electronic package with compressible heatsink structure 失效
标题翻译：制造具有可压缩散热器结构的电子封装的方法
公开(公告)号：US06255136B1
公开(公告)日：2001-07-03
申请号：US09225191
申请日：1999-01-05
申请人： David James Alcoe , Sanjeev Balwant Sathe
发明人： David James Alcoe , Sanjeev Balwant Sathe
IPC分类号： H01L2144
CPC分类号： H01L23/3733 , H01L21/563 , H01L23/3677 , H01L23/4093 , H01L23/433 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/01019 , H01L2924/01322 , Y10T156/1089 , Y10T156/1093 , H01L2924/00
摘要： An electronic package wherein an electronic device (e.g., chip) on a circuitized substrate of the package is thermally coupled to a heatsink in a separable manner using a plurality of compressible, thermally conductive members (e.g., solder balls). These members are compressed and permanently deformed as part of the thermal coupling.
摘要翻译：电子封装，其中封装的电路化基板上的电子器件（例如，芯片）使用多个可压缩的导热构件（例如，焊球）以可分离的方式热耦合到散热器。这些构件被压缩并作为热耦合的一部分永久地变形。

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