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    • 4. 发明授权
    • Systems and methods for thermal management for telecommunications enclosures using heat pipes
    • 使用热管的电信机箱的热管理系统和方法
    • US08488312B2
    • 2013-07-16
    • US13026484
    • 2011-02-14
    • Michael J. NelsonKevin Thompson
    • Michael J. NelsonKevin Thompson
    • H05K7/20
    • H03F1/30H03F3/19H03F3/21H03F2200/447H03F2200/451H04W88/02H05K7/2039H05K7/20681
    • Systems and methods for thermal management for telecommunications enclosures are provided. In one embodiment, a method for thermal management for modular radio frequency (RF) electronics housed within an electronics enclosure comprises: distributing heat generated from an RF electronics component installed on a first thermal region of an electronics module base plate across the first thermal region using at least one primary heat pipe that laterally traverses the first thermal region; distributing heat generated from the RF electronics component to a second thermal region using at least one secondary heat pipe not parallel with the at least one primary heat pipe; conductively transferring heat across a thermal interface between the electronics module back-plate and a backplane of an electronics enclosure that houses the electronics module, wherein the backplane comprises a plurality heat sink fins aligned with the at least one primary heat pipe and the at least one secondary heat pipe.
    • 提供了电信机箱热管理系统和方法。 在一个实施例中,用于容纳在电子外壳内的模块化射频(RF)电子器件的热管理的方法包括:利用安装在电子模块基板的第一热区域上的RF电子元件产生的热跨越第一热区域分布的热量使用 横向穿过第一热区域的至少一个主热管; 使用不与所述至少一个主热管平行的至少一个次级热管将从RF电子部件产生的热量分配到第二热区域; 导电地传递热量通过电子模块背板和容纳电子模块的电子设备外壳的背板之间的热界面,其中该背板包括与该至少一个主热管对准的多个散热片和至少一个 二次热管。
    • 5. 发明申请
    • SYSTEMS AND METHODS FOR THERMAL MANAGEMENT FOR TELECOMMUNICATIONS ENCLOSURES USING HEAT PIPES
    • 使用热管的电信附件热管理系统和方法
    • US20120206881A1
    • 2012-08-16
    • US13026484
    • 2011-02-14
    • Michael J. NelsonKevin Thompson
    • Michael J. NelsonKevin Thompson
    • H05K7/20
    • H03F1/30H03F3/19H03F3/21H03F2200/447H03F2200/451H04W88/02H05K7/2039H05K7/20681
    • Systems and methods for thermal management for telecommunications enclosures are provided. In one embodiment, a method for thermal management for modular radio frequency (RF) electronics housed within an electronics enclosure comprises: distributing heat generated from an RF electronics component installed on a first thermal region of an electronics module base plate across the first thermal region using at least one primary heat pipe that laterally traverses the first thermal region; distributing heat generated from the RF electronics component to a second thermal region using at least one secondary heat pipe not parallel with the at least one primary heat pipe; conductively transferring heat across a thermal interface between the electronics module back-plate and a backplane of an electronics enclosure that houses the electronics module, wherein the backplane comprises a plurality heat sink fins aligned with the at least one primary heat pipe and the at least one secondary heat pipe.
    • 提供了电信机箱热管理系统和方法。 在一个实施例中,用于容纳在电子外壳内的模块化射频(RF)电子器件的热管理的方法包括:利用安装在电子模块基板的第一热区域上的RF电子元件产生的热跨越第一热区域分布的热量使用 横向穿过第一热区域的至少一个主热管; 使用不与所述至少一个主热管平行的至少一个次级热管将从RF电子部件产生的热量分配到第二热区域; 导电地传递热量通过电子模块背板和容纳电子模块的电子设备外壳的背板之间的热界面,其中该背板包括与该至少一个主热管对准的多个散热片和至少一个 二次热管。