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    • 7. 发明授权
    • Multiferroic antenna/sensor
    • 多功能天线/传感器
    • US08760157B2
    • 2014-06-24
    • US12561498
    • 2009-09-17
    • Robert J. MillerWilliam P. GerenStephen P. Hubbell
    • Robert J. MillerWilliam P. GerenStephen P. Hubbell
    • G01R33/02
    • G01R33/18H01Q1/32H01Q1/52H01Q17/00
    • A multiferroic antenna and sensor where the sensor includes a multiferroic stack of multiple connected multiferroic layer-pairs, each multiferroic layer-pair comprising an alternating layer of a magnetostrictive material and a piezoelectric material bonded together enabling a high signal sensitivity, a magnetic field of an incident signal causing mechanical strain in the magnetostrictive material layers that strains adjacent piezoelectric material layers producing an electrical voltage in each multiferroic layer-pair proportional to the incident signal. An output of the multiferroic stack comprises the electrical voltage amplified proportional to a total number of multiple connected multiferroic layer-pairs in the multiferroic stack.
    • 一种多铁性天线和传感器,其中传感器包括多层连接的多铁层对的多层叠层,每个多层层对包括磁致伸缩材料的交替层和结合在一起的压电材料,能够实现高信号灵敏度, 入射信号引起磁致伸缩材料层中的机械应变,使得相邻的压电材料层产生与入射信号成比例的每个多铁层对中的电压。 多层堆叠的输出包括与多层堆叠中的多个连接的多铁层对的总数成比例放大的电压。
    • 9. 发明授权
    • Method of manufacturing a finned semiconductor device structure
    • 制造翅片半导体器件结构的方法
    • US08466034B2
    • 2013-06-18
    • US12749220
    • 2010-03-29
    • Witold MaszaraRobert J. Miller
    • Witold MaszaraRobert J. Miller
    • H01L21/76
    • H01L29/66545H01L29/66795
    • A method of manufacturing a finned semiconductor device structure is provided. The method begins by providing a substrate having bulk semiconductor material. The method continues by forming a semiconductor fin structure from the bulk semiconductor material, depositing an insulating material overlying the semiconductor fin structure such that the insulating material fills space adjacent to the semiconductor fin structure, and planarizing the deposited insulating material and the semiconductor fin structure to create a flat surface. Thereafter, a replacement gate procedure is performed to form a gate structure transversely overlying the semiconductor fin structure.
    • 提供一种制造翅片半导体器件结构的方法。 该方法开始于提供具有体半导体材料的衬底。 该方法继续通过从体半导体材料形成半导体鳍结构,沉积覆盖半导体鳍结构的绝缘材料,使得绝缘材料填充与半导体鳍结构相邻的空间,并将沉积的绝缘材料和半导体鳍结构平坦化为 创建一个平坦的表面。 此后,执行替换门程序以形成横向覆盖半导体鳍结构的栅极结构。