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1. 发明授权

US5083007A Bonding metal electrical members with a frequency doubled pulsed laser beam 失效
标题翻译：用双倍脉冲激光束接合金属电气部件
公开(公告)号：US5083007A
公开(公告)日：1992-01-21
申请号：US561555
申请日：1990-08-01
申请人： Philip J. Spletter , Rama R. Goruganthu
发明人： Philip J. Spletter , Rama R. Goruganthu
IPC分类号： B23K26/06 , B23K26/067 , B23K26/32 , H01S3/093 , H01S3/109
CPC分类号： H01S3/109 , B23K26/0604 , B23K26/0613 , B23K26/0622 , B23K26/067 , H01S3/0931 , H01S3/2383
摘要： Metal electrical members bonded by coupling to at least one member a frequency doubled pulsed Nd:YAG laser comprising 533 and 1064 nm wavelengths is described. Frequency doubling is accomplished by directing a 1064 nm wavelength pulsed Nd:YAG laser at an intracavity nonlinear crystal such as potassium titanyl phosphate between a highly reflective mirror and a partially reflective mirror to produce frequency doubling. An infrared reflector outside the cavity can reduce the 1064 nm wavelength thereby increasing the percentage of 533 nm wavelength. Alternatively the laser beam can be split and the separate wavelengths directed to separate attenuators to allow the percentage of both 533 nm and 1064 nm wavelengths to be adjusted. A gold bump on an integrated circuit can be bonded to a gold plated copper TAB tape lead.
摘要翻译：描述了通过耦合到至少一个构件的包含533和1064nm波长的倍频脉冲Nd：YAG激光器的金属电气构件。通过将1064nm波长脉冲的Nd：YAG激光器引导在腔内非线性晶体（例如磷酸氢氧化钾）之间，在高反射镜和部分反射镜之间，以产生倍频来实现倍频。在腔外的红外反射器可以减少1064nm波长，从而增加波长为533nm的百分比。或者，激光束可以被分离，并且分离的波长被引导到分离的衰减器以允许调整533nm和1064nm波长的百分比。集成电路上的金凸块可以焊接到镀金铜TAB带引线上。

2. 发明授权

US5272309A Bonding metal members with multiple laser beams 失效
标题翻译：用多个激光束粘接金属部件
公开(公告)号：US5272309A
公开(公告)日：1993-12-21
申请号：US822273
申请日：1992-01-17
申请人： Rama R. Goruganthu , Philip J. Spletter
发明人： Rama R. Goruganthu , Philip J. Spletter
IPC分类号： B23K26/06 , B23K26/067 , B23K26/32 , H01S3/093 , H01S3/109 , B23K26/00
CPC分类号： H01S3/109 , B23K26/0604 , B23K26/0613 , B23K26/0622 , B23K26/067 , H01S3/0931 , H01S3/2383
摘要： A first laser beam and a second laser beam with a longer wavelength than the first laser beam are directed at a first metal member in contact with a second metal member. At the ambient temperature the first member has high absorption of energy from the first laser beam but low absorption of energy from the second laser beam. As the first member absorbs energy from the first laser beam the temperature of the first member increases and the reflectivity of the first member decreases so that the first member has high absorption of energy from the second laser beam. The first member then absorbs energy from the second laser beam, the temperature of the first member further increases and at least one of the members melts. After discontinuing the laser beams a solid bond forms between the members.
摘要翻译：具有比第一激光束长的波长的第一激光束和第二激光束被引导到与第二金属部件接触的第一金属部件。在环境温度下，第一构件具有来自第一激光束的高能量吸收，但是来自第二激光束的能量吸收低。当第一构件从第一激光束吸收能量时，第一构件的温度增加，并且第一构件的反射率减小，使得第一构件具有来自第二激光束的高能量吸收。第一构件然后从第二激光束吸收能量，第一构件的温度进一步增加，并且至少一个构件熔化。在停止激光束之后，在构件之间形成固体粘结。

3. 发明授权

US4845335A Laser Bonding apparatus and method 失效
标题翻译：激光焊接设备及方法
公开(公告)号：US4845335A
公开(公告)日：1989-07-04
申请号：US149449
申请日：1988-01-28
申请人： Daniel M. Andrews , Philip J. Spletter , Richard L. Simmons
发明人： Daniel M. Andrews , Philip J. Spletter , Richard L. Simmons
IPC分类号： B23K1/005 , H01L21/00 , H01L21/60 , H01L21/68
CPC分类号： H01L21/68 , B23K1/0056 , H01L21/67138 , H01L24/86 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/14
摘要： A method and apparatus of bonding two electrical members together uses a pulsed YAG laser. Various apparatus and methods may be used to hold the electrical members in contact under pressure to insure uniform bonding. Automation production equipment provides for the automatic bonding of the flat electrical leads of a TAB tape to the flat electrical bumps on a plurality of integrated circuit dies.

4. 发明授权

US08358816B2 Thinned finger sensor and associated methods 有权
公开(公告)号：US08358816B2
公开(公告)日：2013-01-22
申请号：US12424157
申请日：2009-04-15
申请人： Peter E. Sherlock , Philip J. Spletter
发明人： Peter E. Sherlock , Philip J. Spletter
IPC分类号： G06K9/00
CPC分类号： H01L29/84 , G06K9/00006 , G06K9/00013 , G06K9/00053 , H05K1/028 , H05K5/0247
摘要： An electronic device may include a housing with a connector member opening therein, electronic circuitry within the housing, and a finger sensor assembly carried by the housing. The finger assembly may include a thinned finger sensing integrated circuit (IC) secured to the housing that has a thickness less than 200 microns. The finger sensor assembly may also include a connector member extending through the connector member opening in the housing and coupling together the thinned finger sensing IC and the electronic circuitry. The thinned finger sensing IC may be adhesively secured to the housing, such as using a pressure sensitive adhesive, and the thinned finger sensing IC may conform to a non-planar surface.

5. 发明授权

US08085998B2 Finger sensor including enhanced ESD protection and associated methods 有权
标题翻译：手指传感器包括增强型ESD保护及相关方法
公开(公告)号：US08085998B2
公开(公告)日：2011-12-27
申请号：US11550690
申请日：2006-10-18
申请人： Dale R. Setlak , Matthew M. Salatino , Philip J. Spletter , Yang Rao
发明人： Dale R. Setlak , Matthew M. Salatino , Philip J. Spletter , Yang Rao
IPC分类号： G06K9/00
CPC分类号： G06K9/00053
摘要： A finger sensor may include a finger sensing integrated circuit (IC) having a finger sensing area and at least one bond pad adjacent thereto, and a flexible circuit coupled to the IC finger sensor. More particularly, the flexible circuit may include a flexible layer, and at least one conductive trace carried thereby and coupled to the at least one bond pad. The sensor may also include at least one Electrostatic Discharge (ESD) electrode carried by the flexible layer. The ESD electrode may be positioned adjacent a beveled edge, for example, of an IC carrier and thereby exposed through a small gap between an adjacent portion of a frame.
摘要翻译：手指传感器可以包括手指感测集成电路（IC），其具有手指感测区域和与其相邻的至少一个接合垫，以及耦合到IC手指传感器的柔性电路。更具体地，柔性电路可以包括柔性层，以及由此承载的至少一个导电迹线并耦合到至少一个接合焊盘。传感器还可以包括由柔性层承载的至少一个静电放电（ESD）电极。 ESD电极可以位于例如IC载体的倾斜边缘附近，并且由此暴露在框架的相邻部分之间的小间隙。

6. 发明授权

US5049718A Method of laser bonding for gold, gold coated and gold alloy coated electrical members 失效
标题翻译：金，金涂层和金合金涂层电气部件的激光焊接方法
公开(公告)号：US5049718A
公开(公告)日：1991-09-17
申请号：US558127
申请日：1990-07-25
申请人： Philip J. Spletter , Colin A. Mackay , Claire T. Galanakis , John C. Parker
发明人： Philip J. Spletter , Colin A. Mackay , Claire T. Galanakis , John C. Parker
IPC分类号： B23K26/18 , B23K26/32 , H01L21/60
CPC分类号： H01L24/86 , B23K26/18 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15747 , H01L2924/19041
摘要： A method is disclosed for laser bonding two highly reflective electrical members. The first electrical member is coated with a coating alloy containing the metal of the second electrical member and a coupling material that is well absorbent of laser energy at the laser beam wavelength, has a lower melting point than either of the electrical members, and has a low solubility in a solid bond alloy of the electrical members. The laser characteristics are selected so that as bonding occurs a bond alloy of the electrical members solidifies and a solidification front drives the molten coupling material away from the bond interface toward the exterior periphery of the bond, so that substantially all of the solidified bond interface and bond interface strength results from the bond alloy. Coating a copper lead with a coating alloy containing gold and a coupling material, and then contacting the coated copper lead with a gold bonding pad provides for gold-to-gold TAB tape laser bonding.
摘要翻译：公开了用于激光焊接两个高反射电气部件的方法。第一电气部件涂覆有包含第二电气部件的金属的涂层合金和在激光束波长处具有良好吸收激光能量的耦合材料，其熔点比任一个电气部件都低，并且具有在电气部件的固体接合合金中的溶解度低。选择激光特性，使得当电气部件的接合合金凝固时，固化前驱体将熔融的接合材料从接合界面驱动到接合的外周边，从而基本上所有的凝固的界面和键合界面强度来自于接合合金。用包含金和耦合材料的涂层合金涂覆铜导线，然后将涂覆的铜导线与金焊盘接触，提供金与金TAB带激光焊接。

7. 发明授权

US07894643B2 Finger sensor including flexible circuit and associated methods 有权
标题翻译：手指传感器包括灵活电路及相关方法
公开(公告)号：US07894643B2
公开(公告)日：2011-02-22
申请号：US11550669
申请日：2006-10-18
申请人： Dale R. Setlak , Matthew M. Salatino , Philip J. Spletter , Yang Rao
发明人： Dale R. Setlak , Matthew M. Salatino , Philip J. Spletter , Yang Rao
IPC分类号： G06K9/00 , G01R27/26
CPC分类号： G06K9/00053
摘要： A finger sensor may include a finger sensing integrated circuit (IC) having a finger sensing area and at least one bond pad adjacent thereto, and a flexible circuit coupled to the IC finger sensor. The flexible circuit may include a flexible layer covering both the finger sensing area and the at least one bond pad, and at least one conductive trace carried by the flexible layer and coupled to the at least one bond pad. The flexible layer may permit finger sensing therethrough. The flexible circuit may include at least one connector portion extending beyond the finger sensing area and the at least one bond pad. For example, the connector portion may include a tab connector portion and/or a ball grid array connector portion. A fill material, such as an epoxy, may be provided between the IC finger sensor and the flexible circuit.
摘要翻译：手指传感器可以包括手指感测集成电路（IC），其具有手指感测区域和与其相邻的至少一个接合垫，以及耦合到IC手指传感器的柔性电路。柔性电路可以包括覆盖手指感测区域和至少一个接合焊盘的柔性层以及由柔性层承载并耦合到至少一个接合焊盘的至少一个导电迹线。柔性层可以允许通过其中的手指感测。柔性电路可以包括延伸超过手指感测区域和至少一个接合焊盘的至少一个连接器部分。例如，连接器部分可以包括突片连接器部分和/或球栅阵列连接器部分。可以在IC手指传感器和柔性电路之间设置填充材料，例如环氧树脂。

8. 发明申请

US20090003664A1 FINGER SENSING WITH ENHANCED MOUNTING AND ASSOCIATED METHODS 有权
标题翻译：手指感知与增强安装和相关方法
公开(公告)号：US20090003664A1
公开(公告)日：2009-01-01
申请号：US12206183
申请日：2008-09-08
申请人： Dale R. Setlak , Matthew M. Salatino , Philip J. Spletter , Yang Rao
发明人： Dale R. Setlak , Matthew M. Salatino , Philip J. Spletter , Yang Rao
IPC分类号： G06K9/00
CPC分类号： G06K9/00053
摘要： A finger sensor may include a finger sensing integrated circuit (IC) having a finger sensing area, an IC carrier having a cavity receiving the finger sensing IC therein and having at least one beveled upper edge, and a frame surrounding at least a portion of an upper perimeter of the IC carrier and having at least one inclined surface corresponding to the at least one beveled upper edge of the IC carrier. The finger sensor may also include a biasing member for biasing the IC carrier into alignment within the frame. The biasing member may include at least one resilient body for biasing the IC carrier upward within the frame. In other embodiments, the finger sensor may include an IC carrier having a cavity receiving the finger sensing IC therein and having at least one laterally extending projection. The frame may surround at least a portion of an upper perimeter of the IC carrier and have at least one shoulder cooperating with the at least one laterally extending projection of the IC carrier to define at least one upward stop.
摘要翻译：手指传感器可以包括具有手指感测区域的手指感测集成电路（IC），具有在其中容纳手指感测IC的空腔的IC载体，并且具有至少一个倾斜的上边缘，以及围绕至少一部分 IC载体的上周边具有与IC载体的至少一个倾斜的上边缘对应的至少一个倾斜表面。手指传感器还可以包括用于将IC载体偏置在框架内对准的偏置构件。偏置构件可以包括用于在框架内向上偏压IC载体的至少一个弹性体。在其他实施例中，手指传感器可以包括具有在其中接收手指感测IC的空腔的IC载体，并具有至少一个横向延伸的突起。所述框架可围绕所述IC载体的上周边的至少一部分，并且具有与所述IC载体的所述至少一个侧向延伸突起配合的至少一个肩部，以限定至少一个向上止动件。

9. 发明申请

US20090257626A1 THINNED FINGER SENSOR AND ASSOCIATED METHODS 有权
标题翻译：薄膜手指传感器及相关方法
公开(公告)号：US20090257626A1
公开(公告)日：2009-10-15
申请号：US12424157
申请日：2009-04-15
申请人： Peter E. SHERLOCK , Philip J. Spletter
发明人： Peter E. SHERLOCK , Philip J. Spletter
IPC分类号： H01L31/00 , G06K9/00
CPC分类号： H01L29/84 , G06K9/00006 , G06K9/00013 , G06K9/00053 , H05K1/028 , H05K5/0247
摘要： An electronic device may include a housing with a connector member opening therein, electronic circuitry within the housing, and a finger sensor assembly carried by the housing. The finger assembly may include a thinned finger sensing integrated circuit (IC) secured to the housing that has a thickness less than 200 microns. The finger sensor assembly may also include a connector member extending through the connector member opening in the housing and coupling together the thinned finger sensing IC and the electronic circuitry. The thinned finger sensing IC may be adhesively secured to the housing, such as using a pressure sensitive adhesive, and the thinned finger sensing IC may conform to a non-planar surface.
摘要翻译：电子设备可以包括具有在其中打开的连接器构件的壳体，壳体内的电子电路以及由壳体承载的手指传感器组件。手指组件可以包括固定到壳体的薄化的手指感测集成电路（IC），其具有小于200微米的厚度。手指传感器组件还可以包括延伸穿过壳体中的连接器构件开口并将变薄的手指感测IC和电子电路耦合在一起的连接器构件。薄型手指感测IC可以例如使用压敏粘合剂粘合地固定到壳体，并且变薄的手指感测IC可以符合非平面表面。

10. 发明授权

US07599532B2 Finger sensing with enhanced mounting and associated methods 有权
标题翻译：手指感应与增强的安装和相关的方法
公开(公告)号：US07599532B2
公开(公告)日：2009-10-06
申请号：US12206183
申请日：2008-09-08
申请人： Dale R. Setlak , Matthew M. Salatino , Philip J. Spletter , Yang Rao
发明人： Dale R. Setlak , Matthew M. Salatino , Philip J. Spletter , Yang Rao
IPC分类号： H01L31/00
CPC分类号： G06K9/00053
摘要： A finger sensor may include a finger sensing integrated circuit (IC) having a finger sensing area, an IC carrier having a cavity receiving the finger sensing IC therein and having at least one beveled upper edge, and a frame surrounding at least a portion of an upper perimeter of the IC carrier and having at least one inclined surface corresponding to the at least one beveled upper edge of the IC carrier. The finger sensor may also include a biasing member for biasing the IC carrier into alignment within the frame. The biasing member may include at least one resilient body for biasing the IC carrier upward within the frame. In other embodiments, the finger sensor may include an IC carrier having a cavity receiving the finger sensing IC therein and having at least one laterally extending projection. The frame may surround at least a portion of an upper perimeter of the IC carrier and have at least one shoulder cooperating with the at least one laterally extending projection of the IC carrier to define at least one upward stop.
摘要翻译：手指传感器可以包括具有手指感测区域的手指感测集成电路（IC），具有在其中容纳手指感测IC的空腔的IC载体，并且具有至少一个倾斜的上边缘，以及围绕至少一部分 IC载体的上周边具有与IC载体的至少一个倾斜的上边缘对应的至少一个倾斜表面。手指传感器还可以包括用于将IC载体偏置在框架内对准的偏置构件。偏置构件可以包括用于在框架内向上偏压IC载体的至少一个弹性体。在其他实施例中，手指传感器可以包括具有在其中接收手指感测IC的空腔的IC载体，并具有至少一个横向延伸的突起。所述框架可围绕所述IC载体的上周边的至少一部分，并且具有与所述IC载体的所述至少一个侧向延伸突起配合的至少一个肩部，以限定至少一个向上止动件。

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