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1. 发明授权

US07167054B1 Reconfigurable power control for a mobile terminal 有权
标题翻译：移动终端的可重新配置的功率控制
公开(公告)号：US07167054B1
公开(公告)日：2007-01-23
申请号：US11002473
申请日：2004-12-02
申请人： David Dening , Craig Andrews , Michael R. Kay , Jackie Johnson , Ulrik Riis Madsen
发明人： David Dening , Craig Andrews , Michael R. Kay , Jackie Johnson , Ulrik Riis Madsen
IPC分类号： H03F3/04
CPC分类号： H03F1/0227 , H02M3/156 , H02M2001/0045 , H03F1/025 , H03F2200/372
摘要： Power control circuitry that is configurable as either a Low Dropout (LDO) voltage regulator or a switching DC—DC converter for controlling a variable supply voltage provided to a power amplifier of a mobile terminal is provided. The power control circuitry includes an output stage including first and second output transistors, an analog control system, and a digital control system. When in LDO voltage regulator mode, the analog control system provides an analog control signal to the first transistor based on an adjustable power control signal and a feedback signal indicative of the variable supply voltage, and the digital control system operates to disable the second output transistor. When in DC—DC converter mode, an output stage of the analog control system is disabled, and the digital control system provides binary control signals to the first and second transistors based on the adjustable power control signal and the feedback signal.
摘要翻译：提供了可配置为低压差（LDO）电压调节器或用于控制提供给移动终端的功率放大器的可变电源电压的开关DC-DC转换器的功率控制电路。功率控制电路包括包括第一和第二输出晶体管的输出级，模拟控制系统和数字控制系统。当处于LDO稳压器模式时，模拟控制系统基于可调节功率控制信号和指示可变电源电压的反馈信号向第一晶体管提供模拟控制信号，并且数字控制系统操作以禁用第二输出晶体管。当处于DC-DC转换器模式时，模拟控制系统的输出级被禁止，并且数字控制系统基于可调功率控制信号和反馈信号向第一和第二晶体管提供二进制控制信号。

2. 发明申请

US20110225803A1 CONFORMAL SHIELDING EMPLOYING SEGMENT BUILDUP 有权
标题翻译：符合条件的建筑施工
公开(公告)号：US20110225803A1
公开(公告)日：2011-09-22
申请号：US13117284
申请日：2011-05-27
申请人： David J. Hiner , Waite R. Warren, JR. , Donald Joseph Leahy , David Jandzinski , Thomas Scott Morris , David Halchin , Milind Shah , Mark Charles Held , Brian Howard Calhoun , Brian D. Sawyer , Ulrik Riis Madsen
发明人： David J. Hiner , Waite R. Warren, JR. , Donald Joseph Leahy , David Jandzinski , Thomas Scott Morris , David Halchin , Milind Shah , Mark Charles Held , Brian Howard Calhoun , Brian D. Sawyer , Ulrik Riis Madsen
IPC分类号： H05K13/00
CPC分类号： H01L23/552 , H01L24/97 , H01L25/0655 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01016 , H01L2924/01018 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0052 , H05K3/181 , H05K3/284 , H05K2203/0723 , Y10T29/49 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49146 , Y10T29/49153 , Y10T29/49155 , Y10T29/49204 , Y10T29/49789
摘要： A meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
摘要翻译：具有用于两个或更多个模块的电路的元模块形成在衬底上，衬底优选为层压衬底。最初在单个元模块上形成不同模块的电路。每个模块将具有其中形成电路的一个或多个组件区域。对于要屏蔽的每个部件区域，在基板上或基板上形成金属结构。然后在元模块上的所有模块上形成单体，例如包覆模体。然后，通过切割，钻孔或类似的操作将待屏蔽的每个部件区域的金属结构的至少一部分暴露通过主体。接下来，将电磁屏蔽材料施加到要被屏蔽并与金属结构的暴露部分接触的每个部件区域的主体的外表面上。

3. 发明申请

US20090002969A1 FIELD BARRIER STRUCTURES WITHIN A CONFORMAL SHIELD 审中-公开
标题翻译：在一个合格的屏障中的现场障碍物结构
公开(公告)号：US20090002969A1
公开(公告)日：2009-01-01
申请号：US11952484
申请日：2007-12-07
申请人： Ulrik Riis Madsen , Lars Sandahl Ubbesen
发明人： Ulrik Riis Madsen , Lars Sandahl Ubbesen
IPC分类号： H05K9/00
CPC分类号： H01L23/552 , H01L24/97 , H01L25/0655 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01016 , H01L2924/01018 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0052 , H05K3/181 , H05K3/284 , H05K2203/0723 , Y10T29/49 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49146 , Y10T29/49153 , Y10T29/49155 , Y10T29/49204 , Y10T29/49789
摘要： In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
摘要翻译：在一个实施例中，具有用于两个或更多个模块的电路的元模块形成在衬底上，衬底优选为层压衬底。最初在单个元模块上形成不同模块的电路。每个模块将具有其中形成电路的一个或多个组件区域。对于要屏蔽的每个部件区域，在基板上或基板上形成金属结构。然后在元模块上的所有模块上形成单体，例如包覆模体。然后，通过切割，钻孔或类似操作将待屏蔽的每个部件区域的金属结构的至少一部分暴露通过主体。接下来，将电磁屏蔽材料施加到要被屏蔽并与金属结构的暴露部分接触的每个部件区域的主体的外表面上。

4. 发明申请

US20100199492A1 CONFORMAL SHIELDING EMPLOYING SEGMENT BUILDUP 审中-公开
标题翻译：符合条件的建筑施工
公开(公告)号：US20100199492A1
公开(公告)日：2010-08-12
申请号：US12766347
申请日：2010-04-23
申请人： David J. Hiner , Waite R. Warren, JR. , Donald Joseph Leahy , David Jandzinski , Thomas Scott Morris , David Halchin , Milind Shah , Mark Charles Held , Brian Howard Calhoun , Brian D. Sawyer , Ulrik Riis Madsen
发明人： David J. Hiner , Waite R. Warren, JR. , Donald Joseph Leahy , David Jandzinski , Thomas Scott Morris , David Halchin , Milind Shah , Mark Charles Held , Brian Howard Calhoun , Brian D. Sawyer , Ulrik Riis Madsen
IPC分类号： H05K3/00
CPC分类号： H01L23/552 , H01L24/97 , H01L25/0655 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01016 , H01L2924/01018 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0052 , H05K3/181 , H05K3/284 , H05K2203/0723 , Y10T29/49 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49146 , Y10T29/49153 , Y10T29/49155 , Y10T29/49204 , Y10T29/49789
摘要： A meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
摘要翻译：具有用于两个或更多个模块的电路的元模块形成在衬底上，衬底优选为层压衬底。最初在单个元模块上形成不同模块的电路。每个模块将具有其中形成电路的一个或多个组件区域。对于要屏蔽的每个部件区域，在基板上或基板上形成金属结构。然后在元模块上的所有模块上形成单体，例如包覆模体。然后，通过切割，钻孔或类似操作将待屏蔽的每个部件区域的金属结构的至少一部分暴露通过主体。接下来，将电磁屏蔽材料施加到要被屏蔽并与金属结构的暴露部分接触的每个部件区域的主体的外表面上。

5. 发明授权

US07002391B1 Selectable input attenuation 有权
标题翻译：可选输入衰减
公开(公告)号：US07002391B1
公开(公告)日：2006-02-21
申请号：US10400819
申请日：2003-03-27
申请人： Ulrik Riis Madsen
发明人： Ulrik Riis Madsen
IPC分类号： H03L5/00
CPC分类号： H03G1/0088 , H03H7/24
摘要： Mobile terminal design is made simpler by providing an attenuation circuit having a selectable amount of attenuation within an integrated circuit. In one embodiment, a plurality of input pins are provided so as to connect to different points of the attenuation circuit. By selecting a particular input pin, a given amount of attenuation is available between the chosen input pin and the output pin. In a second embodiment, resistors within the attenuation circuit are selectively grounded to vary the amount of attenuation between the input pin and the output pin.
摘要翻译：通过在集成电路内提供具有可选择的衰减量的衰减电路，使移动终端设计变得更简单。在一个实施例中，提供多个输入引脚以便连接到衰减电路的不同点。通过选择特定的输入引脚，在所选择的输入引脚和输出引脚之间可以使用给定的衰减量。在第二实施例中，衰减电路内的电阻器被选择地接地以改变输入引脚和输出引脚之间的衰减量。

6. 发明授权

US06868260B2 Radio station with optimized impedance 失效
标题翻译：无线电台具有优化的阻抗
公开(公告)号：US06868260B2
公开(公告)日：2005-03-15
申请号：US09811879
申请日：2001-03-19
申请人： Ole Jagielski , Ulrik Riis Madsen
发明人： Ole Jagielski , Ulrik Riis Madsen
IPC分类号： H01Q13/08 , H01Q9/14 , H03G3/30 , H03H7/40 , H03H11/48 , H04B1/04 , H04K3/00
CPC分类号： H04B1/04 , H03H11/485
摘要： A radio station optimizes the impedance. An antenna of a transmitter of the radio station matches an output impedance of a power amplifier by adding an impedance with a variable reactance. A processor adjusts the variable reactance of the impedance according to an output signal of the power amplifier. The impedance with the variable reactance preferably includes either a plurality of inductors and capacitors, variable inductors and capacitors, or a plurality of microstrip lines. The processor calculates an optimum value for the variable reactance according to a measurement of the output signal of the power amplifier and stores those values for those measured values. In this way, a table is created, so that when the output signal is again measured the processor can use this table to determine which variable reactance will lead to impedance matching.
摘要翻译：电台优化阻抗。无线电站的发射机的天线通过添加具有可变电抗的阻抗来匹配功率放大器的输出阻抗。处理器根据功率放大器的输出信号调整阻抗的可变电抗。具有可变电抗的阻抗优选地包括多个电感器和电容器，可变电感器和电容器，或多个微带线。处理器根据功率放大器的输出信号的测量来计算可变电抗的最佳值，并存储那些测量值的值。以这种方式，创建表，使得当再次测量输出信号时，处理器可以使用该表来确定哪个可变电抗将导致阻抗匹配。

7. 发明授权

US08835226B2 Connection using conductive vias 有权
标题翻译：使用导电通孔连接
公开(公告)号：US08835226B2
公开(公告)日：2014-09-16
申请号：US13034787
申请日：2011-02-25
申请人： Thomas Scott Morris , Ulrik Riis Madsen , Donald Joseph Leahy
发明人： Thomas Scott Morris , Ulrik Riis Madsen , Donald Joseph Leahy
IPC分类号： H01L21/60 , H01L23/498 , H01L21/56 , H01L23/00 , H01L23/552
CPC分类号： H05K3/4038 , H01L21/561 , H01L23/49827 , H01L23/552 , H01L24/97 , H01L2924/1461 , H05K1/115 , H05K3/301 , H05K9/0024 , H05K2201/0715 , Y10T29/49165 , H01L2924/00
摘要： In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a conductive vertical interconnect access structure (vias) associated with each component area to be shielded is then exposed through the body by a cutting, drilling, or similar operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed conductive vias.
摘要翻译：在一个实施例中，具有用于两个或更多个模块的电路的元模块形成在衬底上，衬底优选为层压衬底。最初在单个元模块上形成不同模块的电路。每个模块将具有其中形成电路的一个或多个组件区域。对于要屏蔽的每个部件区域，在基板上或基板上形成金属结构。然后在元模块上的所有模块上形成单体，例如包覆模体。至少与要被屏蔽的每个组件区域相关联的导电垂直互连访问结构（通孔）然后通过切割，钻孔或类似操作通过身体暴露。接下来，将电磁屏蔽材料施加到待屏蔽的每个部件区域的主体的外表面并与暴露的导电通孔接触。

8. 发明申请

US20120217624A1 CONNECTION USING CONDUCTIVE VIAS 有权
标题翻译：使用导电VIAS的连接
公开(公告)号：US20120217624A1
公开(公告)日：2012-08-30
申请号：US13034787
申请日：2011-02-25
申请人： Thomas Scott Morris , Ulrik Riis Madsen , Donald Joseph Leahy
发明人： Thomas Scott Morris , Ulrik Riis Madsen , Donald Joseph Leahy
IPC分类号： H01L23/52 , H01L21/60
CPC分类号： H05K3/4038 , H01L21/561 , H01L23/49827 , H01L23/552 , H01L24/97 , H01L2924/1461 , H05K1/115 , H05K3/301 , H05K9/0024 , H05K2201/0715 , Y10T29/49165 , H01L2924/00
摘要： In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a conductive vertical interconnect access structure (vias) associated with each component area to be shielded is then exposed through the body by a cutting, drilling, or similar operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed conductive vias.
摘要翻译：在一个实施例中，具有用于两个或更多个模块的电路的元模块形成在衬底上，衬底优选为层压衬底。最初在单个元模块上形成不同模块的电路。每个模块将具有其中形成电路的一个或多个组件区域。对于要屏蔽的每个部件区域，在基板上或基板上形成金属结构。然后在元模块上的所有模块上形成单体，例如包覆模体。至少与要被屏蔽的每个组件区域相关联的导电垂直互连访问结构（通孔）然后通过切割，钻孔或类似操作通过身体暴露。接下来，将电磁屏蔽材料施加到待屏蔽的每个部件区域的主体的外表面并与暴露的导电通孔接触。

9. 发明申请

US20120170239A1 FIELD BARRIER STRUCTURES WITHIN A CONFORMAL SHIELD 失效
标题翻译：在一个合格的屏障中的现场障碍物结构
公开(公告)号：US20120170239A1
公开(公告)日：2012-07-05
申请号：US13415643
申请日：2012-03-08
申请人： Ulrik Riis Madsen , Lars Sandahl Ubbesen
发明人： Ulrik Riis Madsen , Lars Sandahl Ubbesen
IPC分类号： H05K1/18
CPC分类号： H01L23/552 , H01L24/97 , H01L25/0655 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01016 , H01L2924/01018 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0052 , H05K3/181 , H05K3/284 , H05K2203/0723 , Y10T29/49 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49146 , Y10T29/49153 , Y10T29/49155 , Y10T29/49204 , Y10T29/49789
摘要： In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
摘要翻译：在一个实施例中，具有用于两个或更多个模块的电路的元模块形成在衬底上，衬底优选为层压衬底。最初在单个元模块上形成不同模块的电路。每个模块将具有其中形成电路的一个或多个组件区域。对于要屏蔽的每个部件区域，在基板上或基板上形成金属结构。然后在元模块上的所有模块上形成单体，例如包覆模体。然后，通过切割，钻孔或类似操作将待屏蔽的每个部件区域的金属结构的至少一部分暴露通过主体。接下来，将电磁屏蔽材料施加到要被屏蔽并与金属结构的暴露部分接触的每个部件区域的主体的外表面上。

10. 发明申请

US20090000815A1 CONFORMAL SHIELDING EMPLOYING SEGMENT BUILDUP 审中-公开
标题翻译：符合条件的建筑施工
公开(公告)号：US20090000815A1
公开(公告)日：2009-01-01
申请号：US11952545
申请日：2007-12-07
申请人： David J. Hiner , Waite R. Warren, JR. , Donald Joseph Leahy , David Jandzinski , Thomas Scott Morris , David Halchin , Milind Shah , Mark Charles Held , Brian Howard Calhoun , Brian D. Sawyer , Ulrik Riis Madsen
发明人： David J. Hiner , Waite R. Warren, JR. , Donald Joseph Leahy , David Jandzinski , Thomas Scott Morris , David Halchin , Milind Shah , Mark Charles Held , Brian Howard Calhoun , Brian D. Sawyer , Ulrik Riis Madsen
IPC分类号： H05K9/00 , H05K3/10
CPC分类号： H01L23/552 , H01L24/97 , H01L25/0655 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01016 , H01L2924/01018 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0052 , H05K3/181 , H05K3/284 , H05K2203/0723 , Y10T29/49 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49146 , Y10T29/49153 , Y10T29/49155 , Y10T29/49204 , Y10T29/49789
摘要： In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
摘要翻译：在一个实施例中，具有用于两个或更多个模块的电路的元模块形成在衬底上，衬底优选为层压衬底。最初在单个元模块上形成不同模块的电路。每个模块将具有其中形成电路的一个或多个组件区域。对于要屏蔽的每个部件区域，在基板上或基板上形成金属结构。然后在元模块上的所有模块上形成单体，例如包覆模体。然后，通过切割，钻孔或类似操作将待屏蔽的每个部件区域的金属结构的至少一部分暴露通过主体。接下来，将电磁屏蔽材料施加到要被屏蔽并与金属结构的暴露部分接触的每个部件区域的主体的外表面上。

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