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1. 发明申请

US20090002969A1 FIELD BARRIER STRUCTURES WITHIN A CONFORMAL SHIELD 审中-公开
标题翻译：在一个合格的屏障中的现场障碍物结构
公开(公告)号：US20090002969A1
公开(公告)日：2009-01-01
申请号：US11952484
申请日：2007-12-07
申请人： Ulrik Riis Madsen , Lars Sandahl Ubbesen
发明人： Ulrik Riis Madsen , Lars Sandahl Ubbesen
IPC分类号： H05K9/00
CPC分类号： H01L23/552 , H01L24/97 , H01L25/0655 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01016 , H01L2924/01018 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0052 , H05K3/181 , H05K3/284 , H05K2203/0723 , Y10T29/49 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49146 , Y10T29/49153 , Y10T29/49155 , Y10T29/49204 , Y10T29/49789
摘要： In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
摘要翻译：在一个实施例中，具有用于两个或更多个模块的电路的元模块形成在衬底上，衬底优选为层压衬底。最初在单个元模块上形成不同模块的电路。每个模块将具有其中形成电路的一个或多个组件区域。对于要屏蔽的每个部件区域，在基板上或基板上形成金属结构。然后在元模块上的所有模块上形成单体，例如包覆模体。然后，通过切割，钻孔或类似操作将待屏蔽的每个部件区域的金属结构的至少一部分暴露通过主体。接下来，将电磁屏蔽材料施加到要被屏蔽并与金属结构的暴露部分接触的每个部件区域的主体的外表面上。

2. 发明授权

US08437714B1 Advanced load-switch circuit with zero phase rotation 有权
标题翻译：先进的负载开关电路，零相旋转
公开(公告)号：US08437714B1
公开(公告)日：2013-05-07
申请号：US12835793
申请日：2010-07-14
申请人： Lars Sandahl Ubbesen , Michael Nielsen
发明人： Lars Sandahl Ubbesen , Michael Nielsen
IPC分类号： H03C1/52
CPC分类号： H03H7/40
摘要： The present disclosure relates to the efficient transmission of voice and data signals using mobile terminals, and in particular to optimizing the power added efficiency (PAE) of a power amplifier (PA) by controlling the amplifier's load impedance over a range of radio frequency (RF) output power levels. A power amplifier having a first power level and at least a second power level is provided along with a first impedance matching network section with an output. A second impedance matching network section and at least a third impedance network section in communication with the output are selectably coupled to a load network by switches that are opened and close in response to various power levels of operation for the load switch circuit.
摘要翻译：本公开涉及使用移动终端有效地传输语音和数据信号，特别是通过在射频范围（RF）控制放大器的负载阻抗来优化功率放大器（PA）的功率附加效率（PAE））输出功率电平。具有第一功率电平和至少第二功率电平的功率放大器与具有输出的第一阻抗匹配网络部分一起提供。与输出通信的第二阻抗匹配网络部分和至少第三阻抗网络部分通过响应于负载开关电路的各种功率电平的开关而被切换地耦合到负载网络。

3. 发明申请

US20130027130A1 COLLECTOR BOOST 失效
标题翻译：收集器升压
公开(公告)号：US20130027130A1
公开(公告)日：2013-01-31
申请号：US13360934
申请日：2012-01-30
申请人： Lars Sandahl Ubbesen , Erik Pedersen , Søren Deleuran Laursen
发明人： Lars Sandahl Ubbesen , Erik Pedersen , Søren Deleuran Laursen
IPC分类号： H03G3/20
CPC分类号： H03G3/004 , H03G3/3047
摘要： Embodiments of power amplification devices are described with a power amplification circuit that has more than one amplifier stage and with at least a first voltage regulation circuit and a second voltage regulation circuit configured that provide regulated voltages to these amplifier stages. The power amplification device includes a threshold detection circuit to get better maximum output power performance while preserving power efficiency. The threshold detection circuit is configured to increase a first voltage adjustment gain of the first voltage regulation circuit when a regulated voltage level of a second voltage regulation circuit reaches a first threshold voltage level. In this manner, the first voltage adjustment gain can be initially set to be lower than the second voltage adjustment gain until the second voltage regulation circuit is close or has railed. The first voltage adjustment gain can then be increased to allow the first voltage regulation circuit to also rail.
摘要翻译：用功率放大电路描述功率放大器件的实施例，功率放大电路具有多于一个的放大器级，并且至少配置有第一调压电路和第二调压电路，该电压调节电路被配置为向这些放大器级提供调节电压。功率放大装置包括阈值检测电路，以在保持功率效率的同时获得更好的最大输出功率性能。阈值检测电路被配置为当第二电压调节电路的调节电压电平达到第一阈值电压电平时，增加第一电压调节电路的第一电压调整增益。以这种方式，第一电压调节增益可以被初始设置为低于第二电压调节增益，直到第二电压调节电路接近或有轨。然后可以增加第一电压调节增益，以允许第一调压电路也轨。

4. 发明授权

US08531240B2 Collector boost 失效
标题翻译：收藏家提升
公开(公告)号：US08531240B2
公开(公告)日：2013-09-10
申请号：US13360934
申请日：2012-01-30
申请人： Lars Sandahl Ubbesen , Erik Pedersen , Søren Deleuran Laursen
发明人： Lars Sandahl Ubbesen , Erik Pedersen , Søren Deleuran Laursen
IPC分类号： H03G9/00
CPC分类号： H03G3/004 , H03G3/3047
摘要： Embodiments of power amplification devices are described with a power amplification circuit that has more than one amplifier stage and with at least a first voltage regulation circuit and a second voltage regulation circuit configured that provide regulated voltages to these amplifier stages. The power amplification device includes a threshold detection circuit to get better maximum output power performance while preserving power efficiency. The threshold detection circuit is configured to increase a first voltage adjustment gain of the first voltage regulation circuit when a regulated voltage level of a second voltage regulation circuit reaches a first threshold voltage level. In this manner, the first voltage adjustment gain can be initially set to be lower than the second voltage adjustment gain until the second voltage regulation circuit is close or has railed. The first voltage adjustment gain can then be increased to allow the first voltage regulation circuit to also rail.
摘要翻译：用功率放大电路描述功率放大器件的实施例，功率放大电路具有多于一个的放大器级，并且至少配置有第一调压电路和第二调压电路，该电压调节电路被配置为向这些放大器级提供调节电压。功率放大装置包括阈值检测电路，以在保持功率效率的同时获得更好的最大输出功率性能。阈值检测电路被配置为当第二电压调节电路的调节电压电平达到第一阈值电压电平时，增加第一电压调节电路的第一电压调整增益。以这种方式，第一电压调节增益可以被初始设置为低于第二电压调节增益，直到第二电压调节电路接近或有轨。然后可以增加第一电压调节增益，以允许第一调压电路也轨。

5. 发明申请

US20120170239A1 FIELD BARRIER STRUCTURES WITHIN A CONFORMAL SHIELD 失效
标题翻译：在一个合格的屏障中的现场障碍物结构
公开(公告)号：US20120170239A1
公开(公告)日：2012-07-05
申请号：US13415643
申请日：2012-03-08
申请人： Ulrik Riis Madsen , Lars Sandahl Ubbesen
发明人： Ulrik Riis Madsen , Lars Sandahl Ubbesen
IPC分类号： H05K1/18
CPC分类号： H01L23/552 , H01L24/97 , H01L25/0655 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01016 , H01L2924/01018 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0052 , H05K3/181 , H05K3/284 , H05K2203/0723 , Y10T29/49 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49146 , Y10T29/49153 , Y10T29/49155 , Y10T29/49204 , Y10T29/49789
摘要： In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
摘要翻译：在一个实施例中，具有用于两个或更多个模块的电路的元模块形成在衬底上，衬底优选为层压衬底。最初在单个元模块上形成不同模块的电路。每个模块将具有其中形成电路的一个或多个组件区域。对于要屏蔽的每个部件区域，在基板上或基板上形成金属结构。然后在元模块上的所有模块上形成单体，例如包覆模体。然后，通过切割，钻孔或类似操作将待屏蔽的每个部件区域的金属结构的至少一部分暴露通过主体。接下来，将电磁屏蔽材料施加到要被屏蔽并与金属结构的暴露部分接触的每个部件区域的主体的外表面上。

6. 发明授权

US08614899B2 Field barrier structures within a conformal shield 失效
标题翻译：保形罩内的场屏障结构
公开(公告)号：US08614899B2
公开(公告)日：2013-12-24
申请号：US13415643
申请日：2012-03-08
申请人： Ulrik Riis Madsen , Lars Sandahl Ubbesen
发明人： Ulrik Riis Madsen , Lars Sandahl Ubbesen
IPC分类号： H05K1/18
CPC分类号： H01L23/552 , H01L24/97 , H01L25/0655 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01016 , H01L2924/01018 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1815 , H01L2924/3025 , H05K1/0218 , H05K3/0052 , H05K3/181 , H05K3/284 , H05K2203/0723 , Y10T29/49 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49146 , Y10T29/49153 , Y10T29/49155 , Y10T29/49204 , Y10T29/49789
摘要： In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
摘要翻译：在一个实施例中，具有用于两个或更多个模块的电路的元模块形成在衬底上，衬底优选为层压衬底。最初在单个元模块上形成不同模块的电路。每个模块将具有其中形成电路的一个或多个组件区域。对于要屏蔽的每个部件区域，在基板上或基板上形成金属结构。然后在元模块上的所有模块上形成单体，例如包覆模体。然后，通过切割，钻孔或类似操作将待屏蔽的每个部件区域的金属结构的至少一部分暴露通过主体。接下来，将电磁屏蔽材料施加到要被屏蔽并与金属结构的暴露部分接触的每个部件区域的主体的外表面上。

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