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1. 发明授权

US06000603A Patterned array of metal balls and methods of making 失效
标题翻译：金属球的图案阵列和制作方法
公开(公告)号：US06000603A
公开(公告)日：1999-12-14
申请号：US862804
申请日：1997-05-23
申请人： David C. Koskenmaki , Randolph D. Schueller , Robert P. McCollam
发明人： David C. Koskenmaki , Randolph D. Schueller , Robert P. McCollam
IPC分类号： H01L21/60 , B23K35/12 , H01L21/48 , H01L21/68 , H05K3/04 , H05K3/34 , B21D39/00 , B23K31/02
CPC分类号： H01L21/6835 , H01L21/4814 , H01L21/4853 , H05K3/3478 , H01L2224/11003 , H01L2224/1111 , H01L2224/16 , H01L2924/01004 , H01L2924/01025 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H05K2201/10734 , H05K2203/0113 , H05K2203/0156 , H05K2203/033 , H05K2203/0338 , H05K2203/0405 , H05K2203/043 , H05K3/041
摘要： The present invention relates to a method for making an array of metal balls. The method includes the step of generating a first pattern on a metal foil which includes a plurality of foil projections. The method also includes the step of generating a second pattern on a carrier substrate. The second pattern includes a plurality of carrier recesses that are arranged and configured to correspond with the foil projections of the first pattern. The method further includes the steps of placing the metal foil and the carrier substrate together such that the foil projections of the metal foil fit within the carrier recesses of the carrier substrate, and melting the metal foil such that the foil projections form metal balls positioned within the carrier recesses of the carrier substrate. The invention also relates to metal ball arrays constructed via the above method.
摘要翻译：本发明涉及一种制造金属球阵列的方法。该方法包括在包括多个箔突起的金属箔上产生第一图案的步骤。该方法还包括在载体基板上产生第二图案的步骤。第二图案包括多个载体凹部，其布置和构造成与第一图案的箔片突起相对应。该方法还包括以下步骤：将金属箔和载体衬底放置在一起，使得金属箔的箔突起配合在载体衬底的载体凹槽内，并熔化金属箔，使得箔突起形成位于载体基板的载体凹部。本发明还涉及通过上述方法构造的金属球阵列。

2. 发明授权

US06840834B2 Package structure for mounting a field emitting device in an electron gun 失效
标题翻译：用于在电子枪中安装场致发射器件的封装结构
公开(公告)号：US06840834B2
公开(公告)日：2005-01-11
申请号：US10269172
申请日：2002-10-11
申请人： Randolph D. Schueller , Kent R. Kalar , Anthony A. Kloba
发明人： Randolph D. Schueller , Kent R. Kalar , Anthony A. Kloba
IPC分类号： H01J9/18 , H01J3/02 , H01J29/04 , H01J29/48 , H01J9/12
CPC分类号： H01J3/021 , H01J29/481 , H01J29/485 , H01J2201/304
摘要： Apparatus and method are provided for a package structure that enables mounting of a field-emitting cathode into an electron gun. A non-conducting substrate has the cathode attached and the cathode is electrically connected to a pin through the substrate. Other pins are electrically connected to electrodes integral with the cathode. Three cathodes may be mounted on a die flag region to form an electron gun suitable for color CRTs. Accurate alignment of an emitter array to the apertures in the electron gun and other electrodes such as a focusing lens is achieved. The single package design may be used for many gun sizes. Assembly and attachment of the emitter array to the electron gun during construction of the gun can lower cost of construction.
摘要翻译：提供了一种能够将场发射阴极安装到电子枪中的封装结构的装置和方法。非导电衬底具有阴极，并且阴极通过衬底与引脚电连接。其他引脚电连接到与阴极集成的电极。三个阴极可以安装在管芯标记区域上以形成适用于彩色CRT的电子枪。实现了发射器阵列与电子枪和其它电极（例如聚焦透镜）中的孔的准确对准。单个包装设计可用于许多喷枪尺寸。在施工期间将发射器阵列组装和附接到电子枪可以降低施工成本。

3. 发明授权

US06396141B2 Tape ball grid array with interconnected ground plane 失效
标题翻译：带有互连地平面的带状球栅阵列
公开(公告)号：US06396141B2
公开(公告)日：2002-05-28
申请号：US09754482
申请日：2001-01-04
申请人： Randolph D. Schueller , Donald K. Larson
发明人： Randolph D. Schueller , Donald K. Larson
IPC分类号： H01L2310
CPC分类号： H05K3/4038 , H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/49109 , H01L2224/85399 , H01L2924/00014 , H01L2924/01057 , H01L2924/01078 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/30107 , H05K1/0393 , H05K1/114 , H05K3/0061 , H05K3/4084 , H05K2201/0305 , H05K2201/0394 , H05K2201/09472 , H05K2201/09827 , H05K2203/041 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012 , H01L2224/45099
摘要： A flexible circuit system includes a flexible dielectric layer having a first conductive layer on a first side and a second conductive layer on a second side. A non-conductive, closed end passage extends through the dielectric layer from the first side to the second side. The first conductive layer is adjacent an open end of the passage at the first side, and the second conductive layer forms the closed end of the passage at the second side. A stiffener member is attached to the second conductive layer. A solder ball is connected to provide a conductive path between the first conductive layer and the second conductive layer.
摘要翻译：柔性电路系统包括柔性介电层，其具有第一侧上的第一导电层和第二侧上的第二导电层。非导电闭合端通道从第一侧延伸穿过电介质层到第二侧。第一导电层在第一侧邻近通道的开口端，第二导电层在第二侧形成通道的封闭端。加强件附接到第二导电层。连接焊球以在第一导电层和第二导电层之间提供导电路径。

4. 发明授权

US5866949A Chip scale ball grid array for integrated circuit packaging 失效
标题翻译：芯片级球栅阵列用于集成电路封装
公开(公告)号：US5866949A
公开(公告)日：1999-02-02
申请号：US947042
申请日：1997-10-08
申请人： Randolph D. Schueller
发明人： Randolph D. Schueller
IPC分类号： H01L23/12 , H01L21/60 , H01L23/31 , H01L23/32 , H01L23/498 , H01L23/48
CPC分类号： H01L24/32 , H01L23/3121 , H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L24/49 , H01L24/97 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48237 , H01L2224/4824 , H01L2224/49109 , H01L2224/50 , H01L2224/73215 , H01L2224/73265 , H01L2224/97 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/00015 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01061 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , H01L2924/15184 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/351
摘要： A chip scale ball grid array for integrated circuit packaging having a nonpolymer layer or support structure positioned between a semiconductor die and a substrate. The nonpolymer support structure acts to increase circuit reliability by reducing thermal stress effects and/or by reducing or eliminating formation of voids in an integrated circuit package. A nonpolymer support structure may be a material, such as copper foil, having sufficient rigidity to allow processing of chip scale package in strip format.
摘要翻译：一种用于集成电路封装的芯片级球栅阵列，其具有位于半导体管芯和衬底之间的非聚合物层或支撑结构。非聚合物支持结构通过降低热应力效应和/或通过减少或消除集成电路封装中的空隙的形成来增加电路可靠性。非聚合物支持结构可以是具有足够的刚度以允许以条形格式处理芯片级封装的诸如铜箔的材料。

5. 发明授权

US5585162A Ground plane routing 失效
标题翻译：接地平面路由
公开(公告)号：US5585162A
公开(公告)日：1996-12-17
申请号：US491120
申请日：1995-06-16
申请人： Randolph D. Schueller
发明人： Randolph D. Schueller
IPC分类号： H05K3/34 , H01L21/60 , H01L23/12 , H05K1/00 , H05K1/02 , H05K1/11 , H05K3/28 , H05K3/36 , B32B9/00
CPC分类号： H05K3/363 , H05K1/112 , H05K1/0201 , H05K1/0218 , H05K1/0393 , H05K2201/0394 , H05K2201/062 , H05K2201/0715 , H05K2201/09472 , H05K2201/09509 , H05K2201/10681 , H05K2201/10734 , H05K2203/041 , H05K3/28 , Y10S428/901 , Y10T428/24273 , Y10T428/24917
摘要： A flexible circuit construction allows solder balls to be mass reflow attached to the ground plane of a double-sided flexible circuit by providing a first via which is separate from the remainder of the ground plane, but which is electrically connected to the ground plane through a second via at a distance from the first via by a circuit trace on the side of the flexible circuit opposite the ground plane.
摘要翻译：灵活的电路结构允许焊球通过提供与接地平面的其余部分分开的第一通孔而连接到双面柔性电路的接地平面上，而通过第一通孔与接地平面电连接第二通过与柔性电路的与接地平面相对的一侧上的电路迹线与第一通路相距一定距离。

6. 发明授权

US06664721B1 Gated electron field emitter having an interlayer 有权
标题翻译：具有中间层的门电子场发射体
公开(公告)号：US06664721B1
公开(公告)日：2003-12-16
申请号：US09684107
申请日：2000-10-06
申请人： Keith D. Jamison , Donald E. Patterson , Charlie Hong , Randolph D. Schueller , David F. Hebert , Richard L. Woodin
发明人： Keith D. Jamison , Donald E. Patterson , Charlie Hong , Randolph D. Schueller , David F. Hebert , Richard L. Woodin
IPC分类号： H01J102
CPC分类号： H01J9/025 , H01J3/022
摘要： A field emitter (10) having improved electron emission properties is provided. Electron-emitting microtip protrusions (14) in an emitter layer (12) are separated from a dielectric layer (18) by an interlayer (16) that prevents substantial mixing of the dielectric (16) and the emitter layer (12) during growth of the dielectric layer (18). A conductive gate electrode layer (20) is deposited on the dielectric layer (18). For carbon-based emitters, aluminum is one of several suitable interlayers between the carbon layer and a silicon dioxide dielectric layer.
摘要翻译：提供了具有改善的电子发射特性的场致发射体（10）。在发射极层（12）中的电子发射微尖端突起（14）通过中间层（16）与电介质层（18）分离，其阻止了电介质（16）和发射极层（12）在生长期间的实质性混合介电层（18）。导电栅电极层（20）沉积在电介质层（18）上。对于碳基发射体，铝是碳层和二氧化硅介电层之间的几种合适的中间层之一。

7. 发明授权

US06507118B1 Multi-metal layer circuit 失效
标题翻译：多金属层电路
公开(公告)号：US06507118B1
公开(公告)日：2003-01-14
申请号：US09617530
申请日：2000-07-14
申请人： Randolph D. Schueller
发明人： Randolph D. Schueller
IPC分类号： H01L2348
CPC分类号： H01L23/49827 , H01L23/49833 , H01L2224/05573 , H01L2224/16237 , H01L2224/45144 , H01L2924/00014 , H01L2924/01079 , H01L2924/15311 , Y10T29/49165 , H01L2924/00 , H01L2224/05599
摘要： A printed circuit assembly includes an interposer circuit having a flexible dielectric core with an array of contact members attached thereto. Each contact member includes a first interconnect surface accessible from a first side of the dielectric core and a second interconnect surface accessible from a second side of the dielectric core. A conductive element is attached to the first interconnect surface of each contact member. A flip chip semiconductor die includes an array of bond pads on a mounting surface thereof. Each bonding pad of the semiconductor die is substantially aligned with a respective one of the first interconnect surfaces of the interposer circuit. Each bonding pad is electrically connected to the corresponding conductive element. The electronic device defines a perimeter edge that circumscribes the array of bonding pads and the array of contact members of the interposer circuit. A solder ball is attached to the second interconnect surface of each contact member. A printed circuit substrate includes an array of solder ball pads on a surface thereof. Each one of the solder ball pads is substantially aligned with a respective one of the second interconnect surfaces. Each one of the solder ball pads is electrically connected to the corresponding solder ball.
摘要翻译：印刷电路组件包括插入器电路，该插入器电路具有与其连接的接触构件阵列的柔性介质芯。每个接触构件包括可从电介质芯的第一侧接近的第一互连表面和可从电介质芯的第二侧接近的第二互连表面。导电元件附接到每个接触构件的第一互连表面。倒装芯片半导体管芯包括在其安装表面上的接合焊盘的阵列。半导体管芯的每个焊盘基本上与插入器电路的第一互连表面中的相应一个对准。每个接合焊盘电连接到相应的导电元件。电子设备限定外接接合焊盘阵列和插入器电路的接触部件阵列的周边边缘。焊球连接到每个接触构件的第二互连表面。印刷电路基板包括其表面上的焊球垫阵列。每个焊球垫基本上与第二互连表面中的相应一个对准。每个焊球垫与相应的焊球电连接。

8. 发明授权

US5663530A Wire bond tape ball grid array package 失效
标题翻译：导线胶带球栅阵列封装
公开(公告)号：US5663530A
公开(公告)日：1997-09-02
申请号：US509779
申请日：1995-08-01
申请人： Randolph D. Schueller , Anthony R. Plepys , Howard E. Evans
发明人： Randolph D. Schueller , Anthony R. Plepys , Howard E. Evans
IPC分类号： H01L23/12 , H01L23/13 , H01L23/31 , H01L23/495 , H01L23/498 , H05K1/02
CPC分类号： H01L23/49572 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L24/49 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48233 , H01L2224/49175 , H01L2224/73265 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/0102 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/0105 , H01L2924/01055 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/18301 , H01L2924/30107
摘要： A tape ball grid array package reverses the usual attachment of flexible circuitry to a stiffener so that the circuit traces face the stiffener rather than away from the stiffener as is conventional. This construction allows the elimination of a previously necessary solder mask and so reduces the cost to produce the package.
摘要翻译：磁带栅格阵列封装将柔性电路的通常连接反转到加强件，使得电路迹线面向加强件而不是如常规那样远离加强件。这种结构允许消除先前所需的焊接掩模，因此降低了生产封装的成本。

9. 发明申请

US20090236129A1 METHODS FOR REDUCING CORROSION ON PRINTED CIRCUIT BOARDS 审中-公开
标题翻译：印刷电路板上减少腐蚀的方法
公开(公告)号：US20090236129A1
公开(公告)日：2009-09-24
申请号：US12051583
申请日：2008-03-19
申请人： Randolph D. Schueller , Thad C. McMillan, JR.
发明人： Randolph D. Schueller , Thad C. McMillan, JR.
IPC分类号： B05D5/12 , G03F7/20 , H05K1/09
CPC分类号： H05K3/244 , H05K3/3452 , H05K3/42 , H05K2201/099 , H05K2203/073
摘要： A method for processing a printed circuit board (PCB) wherein the method includes providing a substrate in contact with a metal surface, contacting the metal surface with an immersion silver solution thereby producing an immersion silver layer upon the metal surface, and thereafter, providing a solder mask in contact with the metal surface and the immersion silver layer.
摘要翻译：一种用于处理印刷电路板（PCB）的方法，其中所述方法包括提供与金属表面接触的基板，使金属表面与浸银溶液接触，从而在金属表面上产生浸银层，然后提供焊接掩模与金属表面和浸入银层接触。

10. 发明授权

US06911770B2 Apparatus with a cap and cover assembly, an electron gun with a cap assembly, and a method of using a tube 失效
标题翻译：具有盖和盖组件的装置，具有盖组件的电子枪以及使用管的方法
公开(公告)号：US06911770B2
公开(公告)日：2005-06-28
申请号：US09683683
申请日：2002-02-01
申请人： Randolph D. Schueller , Duane T. Smith
发明人： Randolph D. Schueller , Duane T. Smith
IPC分类号： H01J3/38 , H01J9/00 , H01J29/86 , H01J29/48
CPC分类号： H01J3/38 , H01J9/00 , H01J29/86 , H01J2209/26
摘要： A cap can comprise an aperture, and an attenuator may block the aperture during at least one point in time. In one embodiment, the attenuator can include a cover that may be displaced by a spring. In another embodiment, such as an electron gun, may comprise a support cap with an aperture, a displaceable cover that may cover the aperture, and a spring. A material attached to the spring and acting as a fuse may release the spring and expose the aperture after an electrical current blows the “fuse”. In yet another embodiment, a method for using a tube may comprise evacuating the tube while a cover covers an aperture in the support cap of a electron gun that is at least partially in the tube and moving the cover to expose the aperture after the tube is sealed.
摘要翻译：盖可以包括孔，并且衰减器可以在至少一个时间点期间阻挡孔。在一个实施例中，衰减器可以包括可以被弹簧置换的盖。在另一个实施例中，例如电子枪，可以包括具有孔的支撑帽，可覆盖孔的位移盖和弹簧。附着在弹簧上作为保险丝的材料可能在电流吹动“保险丝”之后释放弹簧并露出孔。在另一个实施例中，使用管的方法可以包括抽空管，同时盖覆盖至少部分在管中的电子枪的支撑帽中的孔，并且在管是管之后移动盖以暴露孔密封。

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