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1. 发明授权

US07273804B2 Internally reinforced bond pads 失效
标题翻译：内部加固焊接垫
公开(公告)号：US07273804B2
公开(公告)日：2007-09-25
申请号：US11030496
申请日：2005-01-06
申请人： David Angell , Frederic Beaulieu , Takashi Hisada , Adreanne Kelly , Samuel Roy McKnight , Hiromitsu Miyai , Kevin Shawn Petrarca , Wolfgang Sauter , Richard Paul Volant , Caitlin W. Weinstein
发明人： David Angell , Frederic Beaulieu , Takashi Hisada , Adreanne Kelly , Samuel Roy McKnight , Hiromitsu Miyai , Kevin Shawn Petrarca , Wolfgang Sauter , Richard Paul Volant , Caitlin W. Weinstein
IPC分类号： H01L21/44 , H01L21/4763 , H01L31/00 , H01L23/48
CPC分类号： H01L24/05 , H01L24/03 , H01L2224/05073 , H01L2224/05181 , H01L2224/05184 , H01L2224/05187 , H01L2224/05556 , H01L2224/05558 , H01L2224/05624 , H01L2224/45144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01082 , H01L2924/04953 , H01L2924/05042 , H01L2924/14 , H01L2924/3025 , H01L2924/04941 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a reinforced bond pad structure having nonplanar dielectric structures and a metallic bond layer conformally formed over the nonplanar dielectric structures. The nonplanar dielectric structures are substantially reproduced in the metallic bond layer so as to form nonplanar metallic structures. Surrounding each of the nonplanar metallic structures is a ring of dielectric material which provides a hard stop during probing of the bond pad so as to limit the amount of bond pad that can be removed during probing.
摘要翻译：公开了一种具有非平面电介质结构和在非平面电介质结构上共形形成的金属接合层的增强接合焊盘结构。非平面电介质结构基本上在金属接合层中再现，从而形成非平面金属结构。围绕非平面金属结构的每一个是介电材料环，其在接合焊盘探测期间提供硬停止，以限制在探测期间可以去除的接合焊盘的量。

2. 发明授权

US06864578B2 Internally reinforced bond pads 有权
公开(公告)号：US06864578B2
公开(公告)日：2005-03-08
申请号：US10249381
申请日：2003-04-03
申请人： David Angell , Frederic Beaulieu , Takashi Hisada , Adreanne Kelly , Samuel Roy McKnight , Hiromitsu Miyai , Kevin Shawn Petrarca , Wolfgang Sauter , Richard Paul Volant , Caitlin W. Weinstein
发明人： David Angell , Frederic Beaulieu , Takashi Hisada , Adreanne Kelly , Samuel Roy McKnight , Hiromitsu Miyai , Kevin Shawn Petrarca , Wolfgang Sauter , Richard Paul Volant , Caitlin W. Weinstein
IPC分类号： H01L23/485 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/05 , H01L24/03 , H01L2224/05073 , H01L2224/05181 , H01L2224/05184 , H01L2224/05187 , H01L2224/05556 , H01L2224/05558 , H01L2224/05624 , H01L2224/45144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01082 , H01L2924/04953 , H01L2924/05042 , H01L2924/14 , H01L2924/3025 , H01L2924/04941 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a reinforced bond pad structure having nonplanar dielectric structures and a metallic bond layer conformally formed over the nonplanar dielectric structures. The nonplanar dielectric structures are substantially reproduced in the metallic bond layer so as to form nonplanar metallic structures. Surrounding each of the nonplanar metallic structures is a ring of dielectric material which provides a hard stop during probing of the bond pad so as to limit the amount of bond pad that can be removed during probing.

3. 发明申请

US20050121803A1 Internally reinforced bond pads 失效
标题翻译：内部加固焊接垫
公开(公告)号：US20050121803A1
公开(公告)日：2005-06-09
申请号：US11030496
申请日：2005-01-06
申请人： David Angell , Frederic Beaulieu , Takashi Hisada , Adreanne Kelly , Samuel McKnight , Hiromitsu Miyai , Kevin Petrarca , Wolfgang Sauter , Richard Volant , Caitlin Weinstein
发明人： David Angell , Frederic Beaulieu , Takashi Hisada , Adreanne Kelly , Samuel McKnight , Hiromitsu Miyai , Kevin Petrarca , Wolfgang Sauter , Richard Volant , Caitlin Weinstein
IPC分类号： H01L23/485 , H01L21/44 , H01L23/48 , H01L29/76 , H01L31/062
CPC分类号： H01L24/05 , H01L24/03 , H01L2224/05073 , H01L2224/05181 , H01L2224/05184 , H01L2224/05187 , H01L2224/05556 , H01L2224/05558 , H01L2224/05624 , H01L2224/45144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01082 , H01L2924/04953 , H01L2924/05042 , H01L2924/14 , H01L2924/3025 , H01L2924/04941 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a reinforced bond pad structure having nonplanar dielectric structures and a metallic bond layer conformally formed over the nonplanar dielectric structures. The nonplanar dielectric structures are substantially reproduced in the metallic bond layer so as to form nonplanar metallic structures. Surrounding each of the nonplanar metallic structures is a ring of dielectric material which provides a hard stop during probing of the bond pad so as to limit the amount of bond pad that can be removed during probing.
摘要翻译：公开了一种具有非平面电介质结构和在非平面电介质结构上共形形成的金属接合层的增强接合焊盘结构。非平面电介质结构基本上在金属接合层中再现，从而形成非平面金属结构。围绕非平面金属结构的每一个是介电材料环，其在接合焊盘探测期间提供硬停止，以限制在探测期间可以去除的接合焊盘的量。

4. 发明申请

US20120187562A1 Semiconductor Package and Method for Fabricating the Same 有权
标题翻译：半导体封装及其制造方法
公开(公告)号：US20120187562A1
公开(公告)日：2012-07-26
申请号：US13436039
申请日：2012-03-30
申请人： Takashi Hisada , Katsuyuki Yonehara
发明人： Takashi Hisada , Katsuyuki Yonehara
IPC分类号： H01L23/498
CPC分类号： H01L23/49833 , H01L23/3128 , H01L23/49811 , H01L23/49822 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/34 , H01L24/36 , H01L24/37 , H01L24/39 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/91 , H01L2224/0401 , H01L2224/04042 , H01L2224/05555 , H01L2224/05556 , H01L2224/05644 , H01L2224/06136 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/29298 , H01L2224/32225 , H01L2224/32245 , H01L2224/37011 , H01L2224/371 , H01L2224/37147 , H01L2224/3754 , H01L2224/40095 , H01L2224/40225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/48644 , H01L2224/49109 , H01L2224/49171 , H01L2224/73215 , H01L2224/73221 , H01L2224/73265 , H01L2224/83191 , H01L2224/838 , H01L2224/84203 , H01L2224/84801 , H01L2224/8485 , H01L2224/85191 , H01L2224/92247 , H01L2924/0001 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/1517 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2924/00011 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： A semiconductor package includes a wiring substrate, a semiconductor chip, and a conductor plate in order to reduce a voltage drop at the central portion of a chip caused by wiring resistance from a peripheral connection pad disposed on the periphery of the chip. Central electrode pads for use in ground/power-supply are disposed on the central portion of the chip. The conductor plate for use in ground/power-supply is disposed on the chip such that an insulating layer is disposed therebetween. The central electrode pads on the chip and the conductor plate are connected together by wire bonding through an opening formed in the insulating layer and the conductor plate. An extraction portion of the conductor plate is connected to a power-supply wiring pad on the wiring substrate. Preferably, the conductor plate is composed of a multilayer structure, and each conductor plate is used in power-supply wiring or ground wiring.
摘要翻译：半导体封装包括布线基板，半导体芯片和导体板，以便减少由设置在芯片周围的外围连接焊盘引起的布线电阻引起的芯片中心部分的电压降。用于接地/供电的中央电极焊盘设置在芯片的中心部分。用于接地/供电的导体板设置在芯片上，使得绝缘层位于它们之间。芯片和导体板上的中心电极焊盘通过形成在绝缘层和导体板中的开口进行引线接合而连接在一起。导体板的提取部分连接到布线基板上的电源布线焊盘。优选地，导体板由多层结构构成，并且每个导体板用于电源布线或接地布线。

5. 发明授权

US07791209B2 Method of underfill air vent for flipchip BGA 失效
标题翻译：用于倒装芯片BGA的底部填充气孔的方法
公开(公告)号：US07791209B2
公开(公告)日：2010-09-07
申请号：US12046772
申请日：2008-03-12
申请人： Takashi Hisada , Sayaka Nishi
发明人： Takashi Hisada , Sayaka Nishi
IPC分类号： H01L23/48
CPC分类号： H01L21/563 , H01L24/27 , H01L24/743 , H01L2224/16225 , H01L2224/16237 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/15151 , Y10T29/49171 , Y10T29/49172 , H01L2924/00
摘要： This invention relates to ejecting an underfill resin at multiple semiconductor die edges such that vacuum suction provided at a laminate through hole located beneath a stage enables spread of underfill resin from each edge simultaneously for quicker spread and reduction of voids. The excess underfill resin intentionally suctioned through the through hole air vent on the underside of the laminate is attracted to re-usable tape. The attracted underfill resin is cleaned from a rotating head mechanism by a cleaning pad positioned beneath a lower surface of the head.
摘要翻译：本发明涉及在多个半导体管芯边缘处喷射底部填充树脂，使得设置在位于载物台下方的层压通孔处的真空吸附能够同时从每个边缘扩散底部填充树脂，从而更快地扩散和减少空隙。有意地通过层压板下侧的通孔排气孔抽吸的多余的底部填充树脂被吸引到可重复使用的带子上。吸引的底部填充树脂通过位于头部下表面下方的清洁垫从旋转头机构清洁。

6. 发明申请

US20090019810A1 Wall structure 有权
标题翻译：墙体结构
公开(公告)号：US20090019810A1
公开(公告)日：2009-01-22
申请号：US11791667
申请日：2005-11-24
申请人： Takashi Hisada , Norihide Imagawa , Hideki Ogura
发明人： Takashi Hisada , Norihide Imagawa , Hideki Ogura
IPC分类号： E04B1/98 , E04B2/56
CPC分类号： E04H9/14 , E06B3/5409 , Y02A50/14
摘要： An inner area of a framing or framework is divided into a plurality of openings by metal frame bars arranged in a lattice pattern. Particular openings are closed by surface glass panes fitted therein, and the remaining openings by metal plates fitted therein. Spacers 10 softer than the surface glass panes and frame bars and capable of transmitting external forces through the frame bars and surface glass panes are mounted in the openings, between end surfaces extending along sides of the surface glass panes and the frame bars. The spacers not adhering to the surface glass panes are spaced from corners of the surface glass panes.
摘要翻译：框架或框架的内部区域由以格子图案排列的金属框架条分成多个开口。特定的开口由安装在其中的表面玻璃板封闭，其余的开口由安装在其中的金属板封闭。比表面玻璃板和框架条更柔软的间隔件10能够通过框架杆和表面玻璃板传递外力，在沿着表面玻璃板和框架杆的侧面延伸的端面之间的开口中安装。不附着在表面玻璃板上的间隔件与表面玻璃板的角部间隔开。

7. 发明授权

US07832158B2 Wall structure 有权
标题翻译：墙体结构
公开(公告)号：US07832158B2
公开(公告)日：2010-11-16
申请号：US11791667
申请日：2005-11-24
申请人： Takashi Hisada , Norihide Imagawa , Hideki Ogura
发明人： Takashi Hisada , Norihide Imagawa , Hideki Ogura
IPC分类号： E06B3/68
CPC分类号： E04H9/14 , E06B3/5409 , Y02A50/14
摘要： An inner area of a framing or framework is divided into a plurality of openings by metal frame bars arranged in a lattice pattern. Particular openings are closed by surface glass panes fitted therein, and the remaining openings by metal plates fitted therein. Spacers 10 softer than the surface glass panes and frame bars and capable of transmitting external forces through the frame bars and surface glass panes are mounted in the openings, between end surfaces extending along sides of the surface glass panes and the frame bars. The spacers not adhering to the surface glass panes are spaced from corners of the surface glass panes.
摘要翻译：框架或框架的内部区域由以格子图案排列的金属框架条分成多个开口。特定的开口由安装在其中的表面玻璃板封闭，其余的开口由安装在其中的金属板封闭。比表面玻璃板和框架条更柔软的间隔件10能够通过框架杆和表面玻璃板传递外力，在沿着表面玻璃板和框架杆的侧面延伸的端面之间的开口中安装。不附着在表面玻璃板上的间隔件与表面玻璃板的角部间隔开。

8. 发明授权

US07489519B1 Power and ground ring snake pattern to prevent delamination between the gold plated ring and mold resin for wirebond PBGA 失效
标题翻译：电源和接地环蛇形图案，以防止镀金环和引线接合PBGA的模制树脂之间的分层
公开(公告)号：US07489519B1
公开(公告)日：2009-02-10
申请号：US12103510
申请日：2008-04-15
申请人： Sayaka Nishi , Takashi Hisada , Yasushi Takeoka
发明人： Sayaka Nishi , Takashi Hisada , Yasushi Takeoka
IPC分类号： H01R9/00
CPC分类号： H01L23/49838 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45144 , H01L2224/48091 , H01L2224/48235 , H01L2224/49171 , H01L2224/49175 , H01L2924/01006 , H01L2924/01014 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/15174 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An exemplary ball grid array package for a semiconductor device includes an integrated circuit on a substrate, and a first bus on the substrate, the first bus including first portions that extend substantially parallel to the integrated circuit, interleaved with second portions that extend substantially toward the integrated circuit, each second portion having an end contiguous with a first portion and another end contiguous with a another first portion. A first set of wires connects the first bus with a first plurality of nodes on the integrated circuit. The package also includes a second bus and a second set of wires.
摘要翻译：用于半导体器件的示例性球栅阵列封装包括在衬底上的集成电路和在衬底上的第一总线，第一总线包括基本上平行于集成电路延伸的第一部分，与第二部分交错，第二部分基本上朝向集成电路，每个第二部分具有与第一部分相邻的端部，而另一端部与另一个第一部分相邻。第一组导线将第一总线与集成电路上的第一多个节点连接。该包装还包括第二总线和第二组电线。

9. 发明申请

US20090229513A1 Underfill Air Vent for Flipchip BGA 审中-公开
标题翻译：底片填充空气孔用于倒装芯片BGA
公开(公告)号：US20090229513A1
公开(公告)日：2009-09-17
申请号：US12187453
申请日：2008-08-07
申请人： Takashi Hisada , Sayaka Nishi
发明人： Takashi Hisada , Sayaka Nishi
IPC分类号： C23C14/00
CPC分类号： H01L21/563 , H01L24/27 , H01L24/743 , H01L2224/16225 , H01L2224/16237 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/15151 , Y10T29/49171 , Y10T29/49172 , H01L2924/00
摘要： The invention relates to a system for assembling a flip chip assembly. An underfill resin is dispensed at multiple semiconductor die edges such that vacuum suction provided at a substrate through hole located beneath a stage enables spread of underfill resin from each edge simultaneously for quicker spread and reduction of voids. The excess underfill resin suctioned through the through hole on the underside of the semiconductor die is attracted to reusable tape. The attracted underfill resin is cleaned from a rotating head mechanism by a cleaning pad positioned beneath a lower surface of the head.
摘要翻译：本发明涉及一种用于组装倒装芯片组件的系统。在多个半导体管芯边缘处分配底部填充树脂，使得设置在位于工作台下方的衬底通孔处的真空吸附能够同时从每个边缘扩散底部填充树脂，从而更快地扩散和减少空隙。通过半导体管芯的下侧的通孔吸引的多余的底部填充树脂被吸引到可重复使用的带。吸引的底部填充树脂通过位于头部下表面下方的清洁垫从旋转头机构清洁。

10. 发明申请

US20090230566A1 Method of underfill air vent for flipchip BGA 失效
标题翻译：用于倒装芯片BGA的底部填充气孔的方法
公开(公告)号：US20090230566A1
公开(公告)日：2009-09-17
申请号：US12046772
申请日：2008-03-12
申请人： Takashi Hisada , Sayaka Nishi
发明人： Takashi Hisada , Sayaka Nishi
IPC分类号： H01L23/52
CPC分类号： H01L21/563 , H01L24/27 , H01L24/743 , H01L2224/16225 , H01L2224/16237 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/15151 , Y10T29/49171 , Y10T29/49172 , H01L2924/00
摘要： This invention relates to ejecting an underfill resin at multiple semiconductor die edges such that vacuum suction provided at a laminate through hole located beneath a stage enables spread of underfill resin from each edge simultaneously for quicker spread and reduction of voids. The excess underfill resin intentionally suctioned through the through hole air vent on the underside of the laminate is attracted to re-usable tape. The attracted underfill resin is cleaned from a rotating head mechanism by a cleaning pad positioned beneath a lower surface of the head.
摘要翻译：本发明涉及在多个半导体管芯边缘处喷射底部填充树脂，使得设置在位于载物台下方的层压通孔处的真空吸附能够同时从每个边缘扩散底部填充树脂，从而更快地扩散和减少空隙。有意地通过层压板下侧的通孔排气孔抽吸的多余的底部填充树脂被吸引到可重复使用的带子上。吸引的底部填充树脂通过位于头部下表面下方的清洁垫从旋转头机构清洁。

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