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1. 发明授权

US5158912A Integral heatsink semiconductor package 失效
标题翻译：整体散热片半导体封装
公开(公告)号：US5158912A
公开(公告)日：1992-10-27
申请号：US682771
申请日：1991-04-09
申请人： Dave Kellerman , Robert J. Hannemann , Stanley J. Czerepak , Robert J. Simcoe
发明人： Dave Kellerman , Robert J. Hannemann , Stanley J. Czerepak , Robert J. Simcoe
IPC分类号： H01L23/34 , H01L21/48 , H01L21/50 , H01L23/373
CPC分类号： H01L21/50 , H01L21/4867 , H01L23/3731 , H01L2224/48091 , H01L2224/48227 , H01L24/48 , H01L2924/00014 , H01L2924/01014 , H01L2924/09701 , H01L2924/10253 , H01L2924/15312 , H01L2924/16195 , Y10T29/49163
摘要： An injection molded aluminum nitride heatsink forms the substrate of an integral heatsink semiconductor package in which a semiconductor chip is attached directly to the integrated heatsink forming an intimate thermal relationship between the heat generating source and the heat dissipating means. In a first embodiment, a planar surface of the heatsink component provides the substrate for the attachment of a semiconductor chip and a multilayer housing formed from a plurality of layers of dielectric glass ceramic lamina and conductive circuit layers. The multilayer housing is formed on top of the heatsink substrate creating a recessed cavity in which the semiconductor die sits and is attached directly to the heatsink. The semiconductor chip is attached to the circuit layers of the housing through any of the known electrical connection methods, such as wirebonding or tab tape. A cover plate is mounted over the cavity. In a second embodiment a recessed cavity with a planar surface is formed directly in the heatsink and the semiconductor chip is mounted directly to the surface within the cavity. A plurality of tab leads are connected to the semiconductor and a cover plate is mounted over the cavity sealing the semiconductor and its electrical connections inside.
摘要翻译：注射成型的氮化铝散热器形成整体散热半导体封装的基板，其中半导体芯片直接附接到集成散热器，从而在发热源和散热装置之间形成紧密的热关系。在第一实施例中，散热器部件的平坦表面提供用于连接半导体芯片的基板和由多层电介质玻璃陶瓷层和导电电路层形成的多层壳体。多层壳体形成在散热衬底的顶部上，形成凹形空腔，其中半导体管芯位于其中并直接连接到散热器。半导体芯片通过任何已知的电连接方法（例如引线键合或标签带）附接到壳体的电路层。盖板安装在空腔上。在第二实施例中，具有平坦表面的凹腔直接形成在散热器中，半导体芯片直接安装在空腔内的表面上。多个突片引线连接到半导体，并且盖板安装在空腔上，密封半导体及其内部的电连接。

2. 发明授权

US4914741A Tape automated bonding semiconductor package 失效
标题翻译：胶带自动键合半导体封装
公开(公告)号：US4914741A
公开(公告)日：1990-04-03
申请号：US59051
申请日：1987-06-08
申请人： Kenneth M. Brown , Robert J. Hannemann , Stephen P. Hansen
发明人： Kenneth M. Brown , Robert J. Hannemann , Stephen P. Hansen
IPC分类号： H01L23/04 , H01L21/60 , H01L23/498
CPC分类号： H01L24/86 , H01L23/4985 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/10253 , H01L2924/13091 , H01L2924/14
摘要： A semiconductor package for protecting a semiconductor chip such as a Very Large Scale Integration chip and connecting it to an electrical circuit is disclosed. The chip is bonded to a section of Tape Automated Bonding, (TAB), tape which contains a number of leads thereover, each lead has an inner lead section bonded to the chip and an outer lead section that extends beyond the outer perimeter of the tape, for connecting to the circuit. The chip is enclosed in a housing which subtends an area slightly larger than the chip itself. The inner lead sections project from the TAB tape into the housing and are bonded to the chip. A metal layer under the TAB tape is connected to a number of the leads. After the semiconductor package of this invention is assembled, the outer leads are attached to the associated circuit so as to connect the chip to the circuit. The metal layer serves as a reference plane so the leads connected thereto supply a voltage that does not very to sub-circuits on the chip.

3. 发明授权

US4833567A Integral heat pipe module 失效
标题翻译：一体式热管模块
公开(公告)号：US4833567A
公开(公告)日：1989-05-23
申请号：US107890
申请日：1987-10-09
申请人： Elric Saaski , Robert J. Hannemann , Leslie R. Fox
发明人： Elric Saaski , Robert J. Hannemann , Leslie R. Fox
IPC分类号： F28D15/04 , H01L23/427
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/046 , H01L2224/16 , H01L2224/73204 , H01L2224/73253
摘要： An integral heat pipe for transferring heat away from electronic components is disclosed. The heat pipe comprises at least one electronic component mounted to a substrate. A condenser cap is fastened over the substrate to define a sealed pipe chamber around the electronic component. The top of the condenser cap facing the component is a condenser surface and is provided with a number of parallel fluted sections. Each fluted section has parallel vertical sidewalls and a semi-circular top section. A multi-layered fiberous, porous, wick is located between the condenser surface flutes and the top of the electrical component. The top of the component may be provided with a number of parallel grooves exposed to the wick. The pipe chamber is filled with a two-phase working fluid. The heat generated by the electrical component causes the liquid fraction of the working fluid adjacent the component to evaporate. The vapor travels to the fluted condensing surface. The latent heat of vaporization is removed from the vapor so it recondenses and returns to the bottom of the module to repeat the heat transfer cycle. The wick's capillary pumping action keeps the fluid distributed over the top surface of the electronic component. The grooved top surface of the electronic component exposed to the wick cause an inverted liquid meniscus to be formed over the component. This causes the liquid adjacent the top of the component to readily evaporate.
摘要翻译：公开了一种用于将热量从电子部件传出的整体式热管。热管包括安装到基底的至少一个电子部件。冷凝器盖紧固在基板上以限定电子部件周围的密封管室。冷凝器盖的面向组件的顶部是冷凝器表面，并且设置有多个平行的槽纹部分。每个带槽部分具有平行的垂直侧壁和半圆顶部。多层纤维，多孔芯位于冷凝器表面槽纹和电气部件的顶部之间。组件的顶部可以设置有暴露于灯芯的多个平行凹槽。管腔充满两相工作流体。由电气部件产生的热量使得与部件相邻的工作流体的液体部分蒸发。蒸气传播到有槽的冷凝表面。蒸发的潜热从蒸气中除去，使其再次发生并返回到模块的底部以重复传热循环。油绳的毛细管抽吸动作使流体分布在电子部件的顶表面上。暴露于芯的电子部件的带槽的顶表面将导致在组件上形成反向的液体弯液面。这使得邻近组件顶部的液体容易蒸发。

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