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1. 发明申请

US20140034715A1 VACUUM REFLOW VOIDING REWORK SYSTEM 有权
标题翻译：真空反射灭火系统
公开(公告)号：US20140034715A1
公开(公告)日：2014-02-06
申请号：US13564568
申请日：2012-08-01
申请人： Dason Cheung , Murad Kurwa , Richard Loi
发明人： Dason Cheung , Murad Kurwa , Richard Loi
IPC分类号： B23K31/02 , B23K3/04 , B23K3/08
CPC分类号： B23K3/08 , B23K1/0016 , B23K1/002 , B23K1/008 , B23K1/012 , B23K1/018 , B23K3/04 , B23K3/087 , H01L31/18 , H01L31/188 , Y02E10/50
摘要： A solar cell module comprises a solar cell soldered to a mounting element, such as a ceramic substrate. The solder bond can comprise a void. A method of reducing a solder void comprises reflowing the solder using a vacuum source and a heat source in a sealed chamber. The chamber is formed, at least in part, by a cowling into which the solar cell module is mounted. A system for reducing voids in a solder bond comprises a heat source and a vacuum source coupled to the sealed chamber into which a solar cell module is placed. The system can optionally include a control system that automates the execution of methods of reducing solder voids. The system can further include a pressure source to aid in reducing the solder void and reflowing the solder after the void is reduced.
摘要翻译：太阳能电池模块包括焊接到诸如陶瓷衬底的安装元件的太阳能电池。焊接结合可以包括空隙。减少焊料空隙的方法包括使用密封室中的真空源和热源回流焊料。该室至少部分地由安装太阳能电池模块的整流罩形成。用于减少焊料接合中的空隙的系统包括耦合到密封室的热源和真空源，太阳能电池模块放置在该密封室中。该系统可以可选地包括一个自动执行减少焊料空隙的方法的控制系统。该系统还可以包括压力源，以帮助减少焊料空隙并且在空隙减小之后回流焊料。

2. 发明授权

US09123860B2 Vacuum reflow voiding rework system 有权
标题翻译：真空回流排空返修系统
公开(公告)号：US09123860B2
公开(公告)日：2015-09-01
申请号：US13564568
申请日：2012-08-01
申请人： Dason Cheung , Murad Kurwa , Richard Loi
发明人： Dason Cheung , Murad Kurwa , Richard Loi
IPC分类号： B23K31/02 , H01L31/18 , B23K3/04 , B23K1/018 , B23K1/008 , B23K1/00 , B23K3/08
CPC分类号： B23K3/08 , B23K1/0016 , B23K1/002 , B23K1/008 , B23K1/012 , B23K1/018 , B23K3/04 , B23K3/087 , H01L31/18 , H01L31/188 , Y02E10/50
摘要： A solar cell module comprises a solar cell soldered to a mounting element, such as a ceramic substrate. The solder bond can comprise a void. A method of reducing a solder void comprises reflowing the solder using a vacuum source and a heat source in a sealed chamber. The chamber is formed, at least in part, by a cowling into which the solar cell module is mounted. A system for reducing voids in a solder bond comprises a heat source and a vacuum source coupled to the sealed chamber into which a solar cell module is placed. The system can optionally include a control system that automates the execution of methods of reducing solder voids. The system can further include a pressure source to aid in reducing the solder void and reflowing the solder after the void is reduced.
摘要翻译：太阳能电池模块包括焊接到诸如陶瓷衬底的安装元件的太阳能电池。焊接结合可以包括空隙。减少焊料空隙的方法包括使用密封室中的真空源和热源回流焊料。该室至少部分地由安装太阳能电池模块的整流罩形成。用于减少焊料接合中的空隙的系统包括耦合到密封室的热源和真空源，太阳能电池模块放置在该密封室中。该系统可以可选地包括控制系统，其自动执行减少焊料空隙的方法。该系统还可以包括压力源，以帮助减少焊料空隙并且在空隙减小之后回流焊料。

3. 发明申请

US20140034716A1 HOT BAR SOLDERING 有权
标题翻译：热棒焊接
公开(公告)号：US20140034716A1
公开(公告)日：2014-02-06
申请号：US13564542
申请日：2012-08-01
申请人： Dason Cheung , Murad Kurwa , Richard Loi , Mario Lopez Ruiz
发明人： Dason Cheung , Murad Kurwa , Richard Loi , Mario Lopez Ruiz
IPC分类号： B23K31/02 , B23K3/04
CPC分类号： H01L31/048 , B23K1/0016 , B23K1/002 , B23K1/0053 , B23K1/008 , B23K1/012 , B23K1/018 , B23K1/08 , B23K1/20 , B23K3/04 , B23K3/047 , B23K3/0471 , B23K3/08 , B23K2101/38 , H01L31/0547 , H01L2924/0002 , Y02E10/52 , H01L2924/0001
摘要： A solar cell module comprises a solar cell die that is soldered to a substrate. The substrate comprises one or more power contacts. A power conductor is soldered to a power contact, thereby electrically coupling the power conductor to the solar cell die. A pre-heat module heats a first side of the substrate at a first area to a first temperature for a first duration. Then, a solder heat source solders a power conductor to a power contact at a second area of the substrate at a second temperature for a second duration. The resulting solder connection at the power conductor is less prone to cold-solder defects. The temperature of the pre-heat module is controlled to promote curing of an RTV sealant used in the manufacture of the solar cell module. The temperature of the solder heat source is controlled to avoid burning and degrading of the RTV sealant.
摘要翻译：太阳能电池模块包括焊接到基板的太阳能电池模具。衬底包括一个或多个电源触点。电力导体焊接到电源触点，从而将电力导体电耦合到太阳能电池模具。预热模块将第一区域的衬底的第一侧加热至第一温度持续第一时间。然后，焊接热源在第二温度下将功率导体焊接到衬底的第二区域处的功率接触持续第二持续时间。在电源导体处产生的焊接连接不太容易发生冷焊缺陷。控制预热模块的温度以促进用于制造太阳能电池模块的RTV密封剂的固化。控制焊料热源的温度以避免RTV密封胶的燃烧和降解。

4. 发明授权

US09252309B2 Hot bar soldering 有权
公开(公告)号：US09252309B2
公开(公告)日：2016-02-02
申请号：US13564542
申请日：2012-08-01
申请人： Dason Cheung , Murad Kurwa , Richard Loi , Mario Lopez Ruiz
发明人： Dason Cheung , Murad Kurwa , Richard Loi , Mario Lopez Ruiz
IPC分类号： B23K1/00 , B23K1/008 , B23K1/012 , H01L31/048 , B23K1/20 , B23K3/047 , H01L31/054
CPC分类号： H01L31/048 , B23K1/0016 , B23K1/002 , B23K1/0053 , B23K1/008 , B23K1/012 , B23K1/018 , B23K1/08 , B23K1/20 , B23K3/04 , B23K3/047 , B23K3/0471 , B23K3/08 , B23K2101/38 , H01L31/0547 , H01L2924/0002 , Y02E10/52 , H01L2924/0001
摘要： A solar cell module comprises a solar cell die that is soldered to a substrate. The substrate comprises one or more power contacts. A power conductor is soldered to a power contact, thereby electrically coupling the power conductor to the solar cell die. A pre-heat module heats a first side of the substrate at a first area to a first temperature for a first duration. Then, a solder heat source solders a power conductor to a power contact at a second area of the substrate at a second temperature for a second duration. The resulting solder connection at the power conductor is less prone to cold-solder defects. The temperature of the pre-heat module is controlled to promote curing of an RTV sealant used in the manufacture of the solar cell module. The temperature of the solder heat source is controlled to avoid burning and degrading of the RTV sealant.

5. 发明授权

US08113411B2 Universal radio frequency shield removal 有权
标题翻译：通用射频屏蔽去除
公开(公告)号：US08113411B2
公开(公告)日：2012-02-14
申请号：US12750450
申请日：2010-03-30
申请人： Dason Cheung , Simon Medina Sotelo , Enrique Avelar , Omar Garcia Lopez
发明人： Dason Cheung , Simon Medina Sotelo , Enrique Avelar , Omar Garcia Lopez
IPC分类号： B23K1/018 , B23K37/04
CPC分类号： B23K1/018
摘要： Apparatus and methods for removing components soldered to a printed circuit board (PCB). Embodiments presented generally include a contact plate having a component specific platform offset from the contact plate body. The offset platform may be substantially identical in size and shape as the component to be removed. Accordingly, contact between a heated platform and component may allow for conductive heating to occur based on contact with the component. Thus, forced air or convective heating of the component does not occur such that solder joint defects in adjacent components may be prevented. A vacuum retention port may be provided at an interface of the platform and component when in contact. The vacuum retention port may allow the freed component to be removed from the PCB using vacuum to hold the freed component to the platform. Also, apparatus for automation of a process according to the forgoing are presented.
摘要翻译：用于去除焊接到印刷电路板（PCB）上的部件的装置和方法。所呈现的实施例通常包括具有偏离接触板主体的部件特定平台的接触板。偏移平台的尺寸和形状可以与待移除的部件基本相同。因此，加热的平台和部件之间的接触可以允许基于与部件的接触而发生导电加热。因此，不会发生部件的强制空气或对流加热，从而可以防止相邻部件中的焊点缺陷。当接触时，可以在平台和部件的界面处设置真空保持口。真空保持端口可以允许使用真空将释放的部件从PCB上移除以将释放的部件保持在平台上。另外，提出了根据上述的方法的自动化装置。

6. 发明授权

US08627997B2 Universal radio frequency shield removal 失效
标题翻译：通用射频屏蔽去除
公开(公告)号：US08627997B2
公开(公告)日：2014-01-14
申请号：US13356385
申请日：2012-01-23
申请人： Dason Cheung , Simon Medina Sotelo , Enrique Avelar , Omar Garcia Lopez
发明人： Dason Cheung , Simon Medina Sotelo , Enrique Avelar , Omar Garcia Lopez
IPC分类号： B23K1/018
CPC分类号： B23K1/018
摘要： Apparatus and methods for removing components soldered to a printed circuit board (PCB). Embodiments presented generally include a contact plate having a component specific platform offset from the contact plate body. The offset platform may be substantially identical in size and shape as the component to be removed. Accordingly, contact between a heated platform and component may allow for conductive heating to occur based on contact with the component. Thus, forced air or convective heating of the component does not occur such that solder joint defects in adjacent components may be prevented. A vacuum retention port may be provided at an interface of the platform and component when in contact. The vacuum retention port may allow the freed component to be removed from the PCB using vacuum to hold the freed component to the platform. Also, apparatus for automation of a process according to the forgoing are presented.
摘要翻译：用于去除焊接到印刷电路板（PCB）上的部件的装置和方法。所呈现的实施例通常包括具有偏离接触板主体的部件特定平台的接触板。偏移平台的尺寸和形状可以与待移除的部件基本相同。因此，加热的平台和部件之间的接触可以允许基于与部件的接触而发生导电加热。因此，不会发生部件的强制空气或对流加热，从而可以防止相邻部件中的焊点缺陷。当接触时，可以在平台和部件的界面处设置真空保持口。真空保持端口可以允许使用真空将释放的部件从PCB上移除以将释放的部件保持在平台上。另外，提出了根据上述的方法的自动化装置。

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