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1. 发明授权

US08607444B2 Method for forming a housing of an electronic device 有权
标题翻译：电子设备外壳形成方法
公开(公告)号：US08607444B2
公开(公告)日：2013-12-17
申请号：US12895822
申请日：2010-09-30
申请人： Daniel W. Jarvis , Stephen Paul Zadesky , Pinida Jan Moolsintong , Tang Yew Tan
发明人： Daniel W. Jarvis , Stephen Paul Zadesky , Pinida Jan Moolsintong , Tang Yew Tan
IPC分类号： H05K3/36
CPC分类号： H05K5/0208 , B32B37/16 , H05K5/0017 , H05K5/02 , Y10T29/49126 , Y10T29/49128 , Y10T29/49158
摘要： Improved techniques for forming an electronic device housing in which an outer housing member can be assembled with one or more other housing members of the electronic device are disclosed. The one or more other housing members can together with a thin substrate layer (or thin substrate) form a frame to which the outer housing member can be secured. The thin substrate layer facilitates molding of the one or more other housing members adjacent to the outer housing member. In one embodiment, the outer housing member can be made of glass and the one or more other housing members can be made of a polymer, such as plastic. The substrate layer can, for example, be formed of a polymer or a metal. The resulting electronic device housing can be thin yet be sufficiently strong to be suitable for use in electronic devices, such as portable electronic devices.
摘要翻译：公开了用于形成电子设备外壳的改进技术，其中外壳构件可以与电子设备的一个或多个其它外壳构件组装。一个或多个其它壳体构件可以与薄的衬底层（或薄衬底）一起形成框架，外壳构件可以固定到框架上。薄的衬底层有助于模制与外部壳体构件相邻的一个或多个其它壳体构件。在一个实施例中，外部壳体构件可以由玻璃制成，并且一个或多个其它壳体构件可以由诸如塑料的聚合物制成。衬底层可以例如由聚合物或金属形成。所得到的电子器件外壳可以是薄的，但足够坚固以适合用于诸如便携式电子设备的电子设备中。

2. 发明申请

US20110215685A1 Insert Molded Device Housings for Portable Electronic Devices 有权
标题翻译：插入便携式电子设备的成型设备外壳
公开(公告)号：US20110215685A1
公开(公告)日：2011-09-08
申请号：US12895822
申请日：2010-09-30
申请人： Daniel W. Jarvis , Stephen Paul Zadesky , Pinida Jan Moolsintong , Tang Tew Tan
发明人： Daniel W. Jarvis , Stephen Paul Zadesky , Pinida Jan Moolsintong , Tang Tew Tan
IPC分类号： H05K5/02 , B32B37/16
CPC分类号： H05K5/0208 , B32B37/16 , H05K5/0017 , H05K5/02 , Y10T29/49126 , Y10T29/49128 , Y10T29/49158
摘要： Improved techniques for forming an electronic device housing in which an outer housing member can be assembled with one or more other housing members of the electronic device are disclosed. The one or more other housing members can together with a thin substrate layer (or thin substrate) form a frame to which the outer housing member can be secured. The thin substrate layer facilitates molding of the one or more other housing members adjacent to the outer housing member. In one embodiment, the outer housing member can be made of glass and the one or more other housing members can be made of a polymer, such as plastic. The substrate layer can, for example, be formed of a polymer or a metal. The resulting electronic device housing can be thin yet be sufficiently strong to be suitable for use in electronic devices, such as portable electronic devices.
摘要翻译：公开了用于形成电子设备外壳的改进技术，其中外壳构件可以与电子设备的一个或多个其它外壳构件组装。一个或多个其它壳体构件可以与薄的衬底层（或薄衬底）一起形成框架，外壳构件可以固定到框架上。薄的衬底层有助于模制与外部壳体构件相邻的一个或多个其它壳体构件。在一个实施例中，外部壳体构件可以由玻璃制成，并且一个或多个其它壳体构件可以由诸如塑料的聚合物制成。衬底层可以例如由聚合物或金属形成。所得到的电子器件外壳可以是薄的，但足够坚固以适合用于诸如便携式电子设备的电子设备中。

5. 发明授权

US08912480B2 Light sensor systems for electronic devices 有权
标题翻译：用于电子设备的光传感器系统
公开(公告)号：US08912480B2
公开(公告)日：2014-12-16
申请号：US13222387
申请日：2011-08-31
申请人： Benjamin J. Pope , Kelvin Kwong , Richard P. Howarth , Richard Hung Minh Dinh , Tang Yew Tan , Richard Ruh , Matt Waldon , Daniel W. Jarvis , Brian R. Land , Steven P. Hotelling
发明人： Benjamin J. Pope , Kelvin Kwong , Richard P. Howarth , Richard Hung Minh Dinh , Tang Yew Tan , Richard Ruh , Matt Waldon , Daniel W. Jarvis , Brian R. Land , Steven P. Hotelling
IPC分类号： G01J1/02 , H04M1/02 , G01J1/42 , G01J1/04
CPC分类号： G01J1/0233 , G01J1/0407 , G01J1/0422 , G01J1/0425 , G01J1/0474 , G01J1/0488 , G01J1/4204 , H04M1/026 , H04M2250/12
摘要： The underside of an inactive portion of a display cover layer in an electronic device may be covered with an opaque masking material. Openings in the opaque masking material may be form ambient light sensor and proximity sensor windows. An ambient light sensor window may be filled with a material that transmits at least some visible light. A proximity sensor window may be filled with a material that transmits more infrared light relative to visible light than the material in the ambient light sensor window. The materials in the ambient light sensor window and proximity sensor window may include one or more layers of ink, patterns of holes, layers of material that are shared with the opaque masking layer, and materials that are black, white, or other colors. A light guide structure may be used to route light received from a sensor window to an associated sensor.
摘要翻译：电子设备中的显示覆盖层的不活动部分的下侧可以用不透明的掩模材料覆盖。不透明掩模材料中的开口可以形成环境光传感器和接近传感器窗口。环境光传感器窗口可以填充有透射至少一些可见光的材料。接近传感器窗口可以填充相对于可见光透射比环境光传感器窗口中的材料更多的红外光的材料。环境光传感器窗口和接近传感器窗口中的材料可以包括与不透明掩模层共享的一层或多层墨水，孔图案，材料层，以及黑色，白色或其它颜色的材料。光导结构可以用于将从传感器窗口接收的光路由到相关传感器。

6. 发明申请

US20110255850A1 ELECTRONIC SUBASSEMBLIES FOR ELECTRONIC DEVICES 审中-公开
标题翻译：用于电子设备的电子底座
公开(公告)号：US20110255850A1
公开(公告)日：2011-10-20
申请号：US12794601
申请日：2010-06-04
申请人： Richard Hung Minh Dinh , Tang Yew Tan , Jason Sloey , Shayan Malek , Scott Myers , Dennis R. Pyper , Douglas P. Kidd , Ronald W. Dimpflmaier , Andrew B. Just , Trent Weber , Daniel W. Jarvis
发明人： Richard Hung Minh Dinh , Tang Yew Tan , Jason Sloey , Shayan Malek , Scott Myers , Dennis R. Pyper , Douglas P. Kidd , Ronald W. Dimpflmaier , Andrew B. Just , Trent Weber , Daniel W. Jarvis
IPC分类号： G03B15/03 , H01R13/648 , H05K9/00 , H01R13/516
CPC分类号： H05K9/0024 , B32B17/061 , B41F17/00 , G03B15/03 , G06F1/1626 , G06F1/1656 , H01L23/24 , H01L23/296 , H01L23/3737 , H01L23/552 , H01L23/66 , H01L2223/6644 , H01M2/026 , H01M2/0292 , H01M2220/30 , H03F3/195 , H03F3/213 , H03F2200/451 , H04M1/0277 , H05K1/0203 , H05K1/0215 , H05K1/181 , H05K1/189 , H05K3/341 , H05K3/3447 , H05K3/363 , H05K2201/0116 , H05K2201/0162 , H05K2201/056 , H05K2201/10106 , H05K2201/10121 , H05K2201/10371 , H05K2201/10409 , H05K2201/2009 , H05K2203/1316 , Y02P70/613 , Y10T29/4911
摘要： Electronic devices may be provided that include mechanical and electronic components. Connectors may be used to interconnect printed circuits and devices mounted to printed circuits. Printed circuits may include rigid printed circuit boards and flexible printed circuit boards. Heat sinks and other thermally conductive structures may be used to remove excess component heat. Structures may also be provided in an electronic device to detect moisture. Integrated circuits and other circuitry may be mounted on a printed circuit board under a radio-frequency shielding can.
摘要翻译：可以提供包括机械和电子部件的电子设备。连接器可用于连接安装到印刷电路的印刷电路和器件。印刷电路可以包括刚性印刷电路板和柔性印刷电路板。散热片和其他导热结构可用于去除多余的部件热量。也可以在电子设备中提供结构以检测湿气。集成电路和其他电路可以安装在射频屏蔽罐下的印刷电路板上。

7. 发明授权

US09131135B2 Electronic device flash shutter 有权
标题翻译：电子装置闪光快门
公开(公告)号：US09131135B2
公开(公告)日：2015-09-08
申请号：US12481558
申请日：2009-06-09
申请人： Daniel W. Jarvis , Richard P. Howarth , David Tupman , Richard H. Tsai
发明人： Daniel W. Jarvis , Richard P. Howarth , David Tupman , Richard H. Tsai
IPC分类号： H04N5/225
CPC分类号： H04N5/2254 , H04N5/2256 , H04N5/2257
摘要： An electronic device may have a camera module for acquiring still and video digital images of a subject. A light source such as a light-emitting diode may serve as a flash for the camera module. A shutter may be mounted above the light-emitting diode. When the light-emitting diode is not being used to produce a flash of light for illuminating the subject, the shutter may be closed to block the light-emitting diode from view by a user. During image acquisition operations in which it is desired to illuminate the subject, the shutter may be opened to allow light from the light-emitting diode to exit the electronic device. The electronic device may have a touch screen display with an active region and an inactive region. The camera module and light source may be mounted under a portion of the inactive region of the display. The shutter may include a filter structure.
摘要翻译：电子设备可以具有用于获取被摄体的静止和视频数字图像的照相机模块。诸如发光二极管的光源可以用作相机模块的闪光灯。遮光板可以安装在发光二极管的上方。当发光二极管不被用于产生用于照亮被摄体的闪光时，可以关闭快门以阻止用户观察发光二极管。在期望照亮被摄体的图像获取操作期间，可以打开快门以允许来自发光二极管的光离开电子设备。电子设备可以具有具有活动区域和非活动区域的触摸屏显示。相机模块和光源可以安装在显示器的非活动区域的一部分下方。快门可以包括过滤器结构。

8. 发明授权

US08879266B2 Thin multi-layered structures providing rigidity and conductivity 有权
标题翻译：薄的多层结构提供刚性和导电性
公开(公告)号：US08879266B2
公开(公告)日：2014-11-04
申请号：US13480458
申请日：2012-05-24
申请人： Daniel W. Jarvis , Richard Hung Minh Dinh
发明人： Daniel W. Jarvis , Richard Hung Minh Dinh
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , G06F1/182 , H05K1/0207 , H05K3/30 , H05K2201/0338
摘要： Electronic devices having a multi-layer structure that provides enhanced conductivity (thermal and/or electrical conductivity) are disclosed. The multi-layer structure can have a plurality of adjacent layers. At least one layer can primarily provide structural rigidity, and at least another layer can primarily provide enhanced conductivity. The layer of high conductivity can serve to provide the electronic device with greater ability to disperse generated heat and/or to provide an accessible voltage potential (e.g., ground plane). Advantageously, the multi-layer structure can provide enhanced conductivity using an otherwise required structural component and without necessitating an increase in thickness.
摘要翻译：公开了具有提供增强的导电性（热和/或导电性）的多层结构的电子器件。多层结构可以具有多个相邻的层。至少一层可以主要提供结构刚性，并且至少另一层可主要提供增强的导电性。高导电性层可用于为电子器件提供更大的分散产生的热量和/或提供可接近的电压电位（例如接地平面）的能力。有利地，多层结构可以使用另外需要的结构部件提供增强的导电性，而不需要增加厚度。

9. 发明申请

US20130314875A1 THIN MULTI-LAYERED STRUCTURES PROVIDING RIGIDITY AND CONDUCTIVITY 有权
标题翻译：提供刚性和电导率的多层结构
公开(公告)号：US20130314875A1
公开(公告)日：2013-11-28
申请号：US13480458
申请日：2012-05-24
申请人： Daniel W. Jarvis , Richard Hung Minh Dinh
发明人： Daniel W. Jarvis , Richard Hung Minh Dinh
IPC分类号： H05K7/20 , H05K3/30
CPC分类号： G06F1/20 , G06F1/182 , H05K1/0207 , H05K3/30 , H05K2201/0338
摘要： Electronic devices having a multi-layer structure that provides enhanced conductivity (thermal and/or electrical conductivity) are disclosed. The multi-layer structure can have a plurality of adjacent layers. At least one layer can primarily provide structural rigidity, and at least another layer can primarily provide enhanced conductivity. The layer of high conductivity can serve to provide the electronic device with greater ability to disperse generated heat and/or to provide an accessible voltage potential (e.g., ground plane). Advantageously, the multi-layer structure can provide enhanced conductivity using an otherwise required structural component and without necessitating an increase in thickness.
摘要翻译：公开了具有提供增强的导电性（热和/或导电性）的多层结构的电子器件。多层结构可以具有多个相邻的层。至少一层可以主要提供结构刚性，并且至少另一层可主要提供增强的导电性。高导电性层可用于为电子器件提供更大的分散产生的热量和/或提供可接近的电压电位（例如接地平面）的能力。有利地，多层结构可以使用另外需要的结构部件提供增强的导电性，而不需要增加厚度。

10. 发明申请

US20100273530A1 PORTABLE ELECTRONIC DEVICE 有权
标题翻译：便携式电子设备
公开(公告)号：US20100273530A1
公开(公告)日：2010-10-28
申请号：US12429157
申请日：2009-04-23
申请人： Daniel W. Jarvis , Adam D. Mittleman , Ming Xu , Ching Yu John Tam
发明人： Daniel W. Jarvis , Adam D. Mittleman , Ming Xu , Ching Yu John Tam
IPC分类号： H04B1/38 , G01J1/00 , G06F3/041 , F16F1/18
CPC分类号： F21V33/0052 , F16F1/027 , F16F1/185 , G01J1/4204 , G02B6/0081 , G06F1/1626 , G06F1/1637 , G06F1/1671 , G06F1/1684 , G06F1/169
摘要： Portable electronic devices are provided. A device may include cover glass with a light mask. The light mask may be microperforated to allow light to pass through the light mask. The microperforations may allow light to pass through the light mask. The devices may include sensors and light emitters that receive and transmit light through the microperforations. The devices may include a variable cantilever spring as part of a button assembly. The spring may be flattened against itself without exceeding its elastic limit. The devices may include display modules. The display module may include structures that block light from leaking out of the module. The structures may include opaque tapes, opaque enclosures for the display module, and other suitable structures.
摘要翻译：提供便携式电子设备。装置可以包括具有光罩的玻璃罩。光罩可以是微穿孔的，以允许光穿过光罩。微穿孔可以允许光穿过光罩。这些装置可以包括传感器和发光器，其通过微穿孔接收和透射光。装置可以包括作为按钮组件的一部分的可变悬臂弹簧。弹簧可以在不超过其弹性极限的情况下自身平坦化。设备可以包括显示模块。显示模块可以包括阻挡光从模块中泄漏的结构。结构可以包括不透明带，用于显示模块的不透明外壳以及其它合适的结构。

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