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    • 2. 发明申请
    • Starved source diffusion for avalanche photodiode
    • 用于雪崩光电二极管的饥饿源扩散
    • US20060081874A1
    • 2006-04-20
    • US10966491
    • 2004-10-15
    • Daniel FrancisRashit NabievRichard RatowskyDavid YoungSunil ThomasRoman Dimitrov
    • Daniel FrancisRashit NabievRichard RatowskyDavid YoungSunil ThomasRoman Dimitrov
    • H01L31/109
    • H01L31/107H01L31/03529H01L31/18Y02E10/50
    • Starved source diffusion methods for forming avalanche photodiodes (APDs) are provided for controlling the edge effect. The edge effect is controlled by reducing edge gain near the edges of an APD active region. This is accomplished by creating a sloped diffusion front near the edges of the active region. The sloped diffusion front is advantageously formed in a single doping step by using a patterned mask during doping. The patterned mask reduces the depth to which dopants diffuse in areas where it only partly covers the underlying layer. By covering more of the underlying layer nearer the edge and progressively less towards the center, the sloped diffusion front is formed. The shallower diffusion depth near the edge reduces the edge gain, and therefore the edge effect. As a result, an APD to fiber misalignment is less likely, and possibility of edge breakdown is greatly reduced.
    • 用于形成雪崩光电二极管(APD)的饥饿源扩散方法用于控制边缘效应。 边缘效应通过减少APD有效区域边缘附近的边缘增益来控制。 这是通过在活动区域​​的边缘附近创建倾斜的扩散前端来实现的。 倾斜的扩散前端有利地通过在掺杂期间使用图案化掩模在单个掺杂步骤中形成。 图案化掩模减少掺杂剂在其仅部分覆盖下层的区域中扩散的深度。 通过覆盖更靠近边缘的下层,并逐渐向中心倾斜,形成倾斜的扩散前沿。 靠近边缘的较浅的扩散深度降低了边缘增益,因此降低了边缘效应。 结果,APD对光纤的未对准不太可能,并且边缘击穿的可能性大大降低。
    • 10. 发明授权
    • Flip-chip assembly of protected micromechanical devices
    • 保护微机械装置的倒装芯片组装
    • US06507082B2
    • 2003-01-14
    • US09779001
    • 2001-02-08
    • Sunil Thomas
    • Sunil Thomas
    • H01L2984
    • A43B3/0026B81B2201/042B81C1/00317B81C1/00793B81C2203/035H01L2224/13H01L2224/45144H01L2924/15311H01L2924/00
    • A low-cost ceramic package, in land-grid array or ball-grid array configuration, for micromechanical components is fabricated by coating the whole integrated circuits wafer with a protective material, selectively etching the coating for solder ball attachment, singulating the chips, flip-chip assembling a chip onto the opening of a ceramic substrate, underfilling the gaps between the solder joints with a polymeric encapsulant, removing the protective material form the components, and attaching a lid to the substrate for sealing the package. It is an aspect of the present invention to be applicable to a variety of different semiconductor micromechanical devices, for instance actuators, motors, sensors, spatial light modulators, and deformable mirror devices. In all applications, the invention achieves technical advantages as well as significant cost reduction and yield increase.
    • 通过用保护材料涂覆整个集成电路晶片来制造用于微机电部件的陆地电网阵列或球栅阵列配置的低成本陶瓷封装,选择性地蚀刻用于焊球附着的涂层,切割芯片,翻转 将芯片组装到陶瓷基板的开口上,用聚合物密封剂填充焊料接头之间的间隙,从组件中除去保护材料,并将盖子附着到基板上以密封封装。 本发明的一个方面可应用于各种不同的半导体微机械装置,例如致动器,马达,传感器,空间光调制器和可变形反射镜装置。 在所有应用中,本发明实现了技术优点以及显着的成本降低和产量增加。