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    • 1. 发明授权
    • Si/Au/Ni alloyed ohmic contact to n-GaAs and fabricating process therefor
    • Si / Au / Ni合金欧姆接触到n-GaAs并制造工艺
    • US5063174A
    • 1991-11-05
    • US585015
    • 1990-09-18
    • Dana M. BeyeaKathleen Meehan
    • Dana M. BeyeaKathleen Meehan
    • H01L21/28H01L21/285
    • H01L21/28H01L21/28575Y10S148/02Y10S438/98
    • An improved alloyed ohmic contact to n-type GaAs is provided utilizing a Si-based metallization of Si/Au/Ni and exhibiting low contact resistivity and high thermal stability. An improved process for fabricating the inventive contact is also provided comprising the step of first depositing the Si film on the GaAs substrate, thereby simplifying the fabrication of monolithically integrated devices, particularly advanced electro-optic devices, by incorporating self-aligned Si-based contacts in the process. A further improvement is provided in the use of a lift-off-defined Si layer as a reactive-ion etch mask to serve as the self-aligned contact in the process, thereby eliminating a critical photolithographic step of aligning the contact metallization.
    • 使用Si / Au / Ni的Si基金属化并且具有低接触电阻率和高热稳定性来提供与n型GaAs的改进的合金欧姆接触。 还提供了用于制造本发明接触的改进方法,其包括首先在GaAs衬底上沉积Si膜的步骤,从而通过结合自对准的Si基触点来简化单片集成器件,特别是先进的电光器件的制造 正在进行中。 在使用剥离定义的Si层作为反应离子蚀刻掩模的过程中提供了进一步的改进,以用作该过程中的自对准接触,从而消除了对准接触金属化的临界光刻步骤。