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1. 发明申请

US20050167277A1 Method of electroplating a substance over a semiconductor substrate 有权
公开(公告)号：US20050167277A1
公开(公告)日：2005-08-04
申请号：US11053794
申请日：2005-02-08
申请人： Dale Collins , Richard Lane , Rita Klein
发明人： Dale Collins , Richard Lane , Rita Klein
IPC分类号： C25D7/12 , H01L21/02 , H01L21/288 , H01L21/8242 , H01L27/108 , C25D5/02
CPC分类号： H01L27/10852 , H01L21/2885 , H01L27/10808 , H01L27/10817 , H01L28/60 , H01L28/90 , Y10S257/906
摘要： The invention includes methods of electrochemically treating semiconductor substrates. The invention includes a method of electroplating a substance. A substrate having defined first and second regions is provided. The first and second regions can be defined by a single mask, and accordingly can be considered to be self-aligned relative to one another. A first electrically conductive material is formed over the first region, and a second electrically conductive material is formed over the second region. The first and second electrically conductive materials are exposed to an electrolytic solution while providing electrical current to the first and second electrically conductive materials. A desired substance is selectively electroplated onto the first electrically conductive material during the exposing of the first and second electrically conductive materials to the electrolytic solution. The invention also includes methods of forming capacitor constructions.

2. 发明申请

US20050139480A1 Methods of electrochemically treating semiconductor substrates 有权
公开(公告)号：US20050139480A1
公开(公告)日：2005-06-30
申请号：US11053778
申请日：2005-02-08
申请人： Dale Collins , Richard Lane , Rita Klein
发明人： Dale Collins , Richard Lane , Rita Klein
IPC分类号： C25D7/12 , H01L21/02 , H01L21/288 , H01L21/8242 , H01L27/108 , C25D5/02 , C25D3/38
CPC分类号： H01L27/10852 , H01L21/2885 , H01L27/10808 , H01L27/10817 , H01L28/60 , H01L28/90 , Y10S257/906
摘要： The invention includes methods of electrochemically treating semiconductor substrates. The invention includes a method of electroplating a substance. A substrate having defined first and second regions is provided. The first and second regions can be defined by a single mask, and accordingly can be considered to be self-aligned relative to one another. A first electrically conductive material is formed over the first region, and a second electrically conductive material is formed over the second region. The first and second electrically conductive materials are exposed to an electrolytic solution while providing electrical current to the first and second electrically conductive materials. A desired substance is selectively electroplated onto the first electrically conductive material during the exposing of the first and second electrically conductive materials to the electrolytic solution. The invention also includes methods of forming capacitor constructions.

3. 发明申请

US20050167280A1 Method of forming a metal-containing layer over selected regions of a semiconductor substrate 有权
标题翻译：在半导体衬底的选定区域上形成含金属层的方法
公开(公告)号：US20050167280A1
公开(公告)日：2005-08-04
申请号：US11054130
申请日：2005-02-08
申请人： Dale Collins , Richard Lane , Rita Klein
发明人： Dale Collins , Richard Lane , Rita Klein
IPC分类号： C25D7/12 , H01L21/02 , H01L21/288 , H01L21/8242 , H01L27/108 , C25D5/02
CPC分类号： H01L27/10852 , H01L21/2885 , H01L27/10808 , H01L27/10817 , H01L28/60 , H01L28/90 , Y10S257/906
摘要： The invention includes methods of electrochemically treating semiconductor substrates. The invention includes a method of electroplating a substance. A substrate having defined first and second regions is provided. The first and second regions can be defined by a single mask, and accordingly can be considered to be self-aligned relative to one another. A first electrically conductive material is formed over the first region, and a second electrically conductive material is formed over the second region. The first and second electrically conductive materials are exposed to an electrolytic solution while providing electrical current to the first and second electrically conductive materials. A desired substance is selectively electroplated onto the first electrically conductive material during the exposing of the first and second electrically conductive materials to the electrolytic solution. The invention also includes methods of forming capacitor constructions.
摘要翻译：本发明包括电化学处理半导体衬底的方法。本发明包括电镀物质的方法。提供了具有限定的第一和第二区域的基板。第一和第二区域可以由单个掩模限定，因此可以被认为是相对于彼此自对准的。在第一区域上形成第一导电材料，并且在第二区域上形成第二导电材料。第一和第二导电材料暴露于电解溶液，同时向第一和第二导电材料提供电流。在将第一和第二导电材料暴露于电解液期间，期望的物质选择性地电镀到第一导电材料上。本发明还包括形成电容器结构的方法。

4. 发明申请

US20050139481A1 Method of electroplating a substance over a semiconductor substrate 有权
标题翻译：在半导体衬底上电镀物质的方法
公开(公告)号：US20050139481A1
公开(公告)日：2005-06-30
申请号：US11053781
申请日：2005-02-08
申请人： Dale Collins , Richard Lane , Rita Klein
发明人： Dale Collins , Richard Lane , Rita Klein
IPC分类号： C25D7/12 , H01L21/02 , H01L21/288 , H01L21/8242 , H01L27/108 , C25D5/02 , H05B3/08
CPC分类号： H01L27/10852 , H01L21/2885 , H01L27/10808 , H01L27/10817 , H01L28/60 , H01L28/90 , Y10S257/906
摘要： The invention includes methods of electrochemically treating semiconductor substrates. The invention includes a method of electroplating a substance. A substrate having defined first and second regions is provided. The first and second regions can be defined by a single mask, and accordingly can be considered to be self-aligned relative to one another. A first electrically conductive material is formed over the first region, and a second electrically conductive material is formed over the second region. The first and second electrically conductive materials are exposed to an electrolytic solution while providing electrical current to the first and second electrically conductive materials. A desired substance is selectively electroplated onto the first electrically conductive material during the exposing of the first and second electrically conductive materials to the electrolytic solution. The invention also includes methods of forming capacitor constructions.
摘要翻译：本发明包括电化学处理半导体衬底的方法。本发明包括电镀物质的方法。提供了具有限定的第一和第二区域的基板。第一和第二区域可以由单个掩模限定，因此可以被认为是相对于彼此自对准的。在第一区域上形成第一导电材料，并且在第二区域上形成第二导电材料。第一和第二导电材料暴露于电解溶液，同时向第一和第二导电材料提供电流。在将第一和第二导电材料暴露于电解液期间，期望的物质选择性地电镀到第一导电材料上。本发明还包括形成电容器结构的方法。

5. 发明申请

US20050139479A1 Method of forming a mass over a semiconductor substrate 有权
标题翻译：在半导体衬底上形成质量的方法
公开(公告)号：US20050139479A1
公开(公告)日：2005-06-30
申请号：US11053765
申请日：2005-02-08
申请人： Dale Collins , Richard Lane , Rita Klein
发明人： Dale Collins , Richard Lane , Rita Klein
IPC分类号： C25D7/12 , H01L21/02 , H01L21/288 , H01L21/8242 , H01L27/108 , C25D5/02 , C25D3/38
CPC分类号： H01L27/10852 , H01L21/2885 , H01L27/10808 , H01L27/10817 , H01L28/60 , H01L28/90 , Y10S257/906
摘要： The invention includes methods of electrochemically treating semiconductor substrates. The invention includes a method of electroplating a substance. A substrate having defined first and second regions is provided. The first and second regions can be defined by a single mask, and accordingly can be considered to be self-aligned relative to one another. A first electrically conductive material is formed over the first region, and a second electrically conductive material is formed over the second region. The first and second electrically conductive materials are exposed to an electrolytic solution while providing electrical current to the first and second electrically conductive materials. A desired substance is selectively electroplated onto the first electrically conductive material during the exposing of the first and second electrically conductive materials to the electrolytic solution. The invention also includes methods of forming capacitor constructions.
摘要翻译：本发明包括电化学处理半导体衬底的方法。本发明包括电镀物质的方法。提供了具有限定的第一和第二区域的基板。第一和第二区域可以由单个掩模限定，因此可以被认为是相对于彼此自对准的。在第一区域上形成第一导电材料，并且在第二区域上形成第二导电材料。第一和第二导电材料暴露于电解溶液，同时向第一和第二导电材料提供电流。在将第一和第二导电材料暴露于电解液期间，期望的物质选择性地电镀到第一导电材料上。本发明还包括形成电容器结构的方法。

6. 发明申请

US20050167279A1 Methods of electrochemically treating semiconductor substrates 有权
标题翻译：电化学处理半导体衬底的方法
公开(公告)号：US20050167279A1
公开(公告)日：2005-08-04
申请号：US11053817
申请日：2005-02-08
申请人： Dale Collins , Richard Lane , Rita Klein
发明人： Dale Collins , Richard Lane , Rita Klein
IPC分类号： C25D7/12 , H01L21/02 , H01L21/288 , H01L21/8242 , H01L27/108 , C25D5/02
CPC分类号： H01L27/10852 , H01L21/2885 , H01L27/10808 , H01L27/10817 , H01L28/60 , H01L28/90 , Y10S257/906
摘要： The invention includes methods of electrochemically treating semiconductor substrates. The invention includes a method of electroplating a substance. A substrate having defined first and second regions is provided. The first and second regions can be defined by a single mask, and accordingly can be considered to be self-aligned relative to one another. A first electrically conductive material is formed over the first region, and a second electrically conductive material is formed over the second region. The first and second electrically conductive materials are exposed to an electrolytic solution while providing electrical current to the first and second electrically conductive materials. A desired substance is selectively electroplated onto the first electrically conductive material during the exposing of the first and second electrically conductive materials to the electrolytic solution. The invention also includes methods of forming capacitor constructions.
摘要翻译：本发明包括电化学处理半导体衬底的方法。本发明包括电镀物质的方法。提供了具有限定的第一和第二区域的基板。第一和第二区域可以由单个掩模限定，因此可以被认为是相对于彼此自对准的。在第一区域上形成第一导电材料，并且在第二区域上形成第二导电材料。第一和第二导电材料暴露于电解溶液，同时向第一和第二导电材料提供电流。在将第一和第二导电材料暴露于电解液期间，期望的物质选择性地电镀到第一导电材料上。本发明还包括形成电容器结构的方法。

7. 发明申请

US20050167278A1 Methods of forming capacitor constructions 有权
标题翻译：形成电容器结构的方法
公开(公告)号：US20050167278A1
公开(公告)日：2005-08-04
申请号：US11053816
申请日：2005-02-08
申请人： Dale Collins , Richard Lane , Rita Klein
发明人： Dale Collins , Richard Lane , Rita Klein
IPC分类号： C25D7/12 , H01L21/02 , H01L21/288 , H01L21/8242 , H01L27/108 , C25D5/02
CPC分类号： H01L27/10852 , H01L21/2885 , H01L27/10808 , H01L27/10817 , H01L28/60 , H01L28/90 , Y10S257/906
摘要： The invention includes methods of electrochemically treating semiconductor substrates. The invention includes a method of electroplating a substance. A substrate having defined first and second regions is provided. The first and second regions can be defined by a single mask, and accordingly can be considered to be self-aligned relative to one another. A first electrically conductive material is formed over the first region, and a second electrically conductive material is formed over the second region. The first and second electrically conductive materials are exposed to an electrolytic solution while providing electrical current to the first and second electrically conductive materials. A desired substance is selectively electroplated onto the first electrically conductive material during the exposing of the first and second electrically conductive materials to the electrolytic solution. The invention also includes methods of forming capacitor constructions.
摘要翻译：本发明包括电化学处理半导体衬底的方法。本发明包括电镀物质的方法。提供了具有限定的第一和第二区域的基板。第一和第二区域可以由单个掩模限定，因此可以被认为是相对于彼此自对准的。在第一区域上形成第一导电材料，并且在第二区域上形成第二导电材料。第一和第二导电材料暴露于电解溶液，同时向第一和第二导电材料提供电流。在将第一和第二导电材料暴露于电解液期间，期望的物质选择性地电镀到第一导电材料上。本发明还包括形成电容器结构的方法。

8. 发明授权

US10096066B2 User-defined algorithm electronic trading 有权
公开(公告)号：US10096066B2
公开(公告)日：2018-10-09
申请号：US12905709
申请日：2010-10-15
申请人： Richard Lane , Michael Unetich
发明人： Richard Lane , Michael Unetich
IPC分类号： G06Q40/04 , G06Q40/00 , G06F3/0484
摘要： Certain embodiments reduce the risks of traditionally programmed algorithms such as syntax errors, unclear logic, and the need for a non-trader programmer to develop the algorithm as specified by a trader by reducing or eliminating the writing of programming code by a user. Certain embodiments provide building block buttons and an algorithm area to define an algorithm. Certain embodiments provide live evaluation of an expression as the algorithm is being defined. Certain embodiments provide a design canvas area and blocks for designing an algorithm. Certain embodiments provide live feedback for blocks as the algorithm is being designed. Certain embodiments provide for initiating placement of an order to be managed by a selected user-defined trading algorithm from a value axis and for displaying working orders being managed by different user-defined trading algorithms on the value axis. Certain embodiments provide a ranking tool.

9. 发明申请

US20100312716A1 System and Method for Conditional Modification of Buy and Sell Orders in Electronic Trading Exchange 审中-公开
标题翻译：电子交易所买卖订单条件修改的制度与方法
公开(公告)号：US20100312716A1
公开(公告)日：2010-12-09
申请号：US12479907
申请日：2009-06-08
申请人： Richard Lane , Michael Unetich
发明人： Richard Lane , Michael Unetich
IPC分类号： G06Q40/00 , G06F15/16
CPC分类号： G06Q40/04 , G06Q40/06
摘要： A system and method for automatically modifying buy and sell orders in an electronic trading exchange is described. The trader system includes a user device for submitting trader buy and sell orders and conditional quantities, and a trading application which receives the trader buy and sell orders and conditional quantities and communicates these to a host exchange system. For each conditional quantity associated with a trader buy order, the trading application monitors an inside ask quantity associated with the identified desired tradable object of that trader buy order such that if the associated inside ask quantity becomes less than the conditional quantity, then the trading application modifies the trader buy order to increase the desired buy price by a predetermined user-defined increment or to the inside ask price associated with the identified desired tradable object and communicates the modified buy order to the host exchange system. Similar operation occurs for a trader sell order, with the desired inside sell price being decreased if an associated inside bid quantity becomes less than the corresponding conditional quantity.
摘要翻译：描述了在电子交易交易所中自动修改买卖订单的系统和方法。交易者系统包括用于提交交易者买卖订单和条件数量的用户设备，以及接收交易者买卖指令和条件数量并将其传送到主机交换系统的交易应用程序。对于与交易者购买订单相关联的每个条件数量，交易应用程序监视与所述交易者购买订单的所识别的期望交易对象相关联的内部询问数量，使得如果相关联的内部询问数量变得小于条件数量，则交易应用修改交易者购买订单以通过预定的用户定义的增量或与所识别的期望交易对象相关联的内部询问价格来增加期望的购买价格，并将修改的购买订单传送到主机交换系统。如果相关的内部投标数量小于相应的条件数量，则对于交易者卖出订单进行类似的操作，其中期望的内部卖出价格被降低。

10. 发明申请

US20100139707A1 WASHABLE FILMIC LAMINATES 审中-公开
标题翻译：可洗膜电影
公开(公告)号：US20100139707A1
公开(公告)日：2010-06-10
申请号：US12555126
申请日：2009-09-08
申请人： Lykele Jan Boonstra , Willem Marinus Stevels , Richard Lane , Gert-Jan van Ruler , Diana Wattel-Beenhouwer , Jacobus Gillis de Hullu , Hakan Saxen
发明人： Lykele Jan Boonstra , Willem Marinus Stevels , Richard Lane , Gert-Jan van Ruler , Diana Wattel-Beenhouwer , Jacobus Gillis de Hullu , Hakan Saxen
IPC分类号： B08B3/00
CPC分类号： B32B27/40 , B32B7/12 , B32B25/06 , B32B25/08 , B32B25/12 , B32B25/14 , B32B25/18 , B32B27/08 , B32B27/10 , B32B27/18 , B32B27/283 , B32B27/285 , B32B27/302 , B32B27/306 , B32B27/308 , B32B27/32 , B32B27/34 , B32B27/36 , B32B27/365 , B32B2255/10 , B32B2255/12 , B32B2255/26 , B32B2270/00 , B32B2274/00 , B32B2307/518 , B32B2307/73 , B32B2307/75 , B32B2405/00 , B32B2519/00 , C09J7/29 , C09J2201/36 , C09J2203/334 , C09J2453/00
摘要： A process for removing a washable PSA laminate from a substrate is provided. The process comprises contacting the washable PSA laminate with water and optionally, a base, at a temperature sufficient to remove the washable PSA laminate from the substrate; wherein the washable PSA laminate comprises at least one facestock layer, at least one adhesive base layer, and at least one tackifier layer; wherein the facestock layer comprises at least one facestock material; wherein the adhesive base layer comprises at least one adhesive base polymer; wherein the tackifier layer comprises at least one tackifier and optionally at least one adhesive base polymer; wherein the tackifier layer is applied to the adhesive base layer side of the washable PSA laminate. Specifically, a process is provided for removing a washable PSA laminate from a bottle comprising contacting the washable PSA laminate with water and optionally, a base, at a temperature sufficient to remove the washable PSA laminate from the bottle.
摘要翻译：提供了从基材上除去可洗涤PSA层压体的方法。该方法包括在足以从基材上除去可洗涤的PSA层压体的温度下使可洗涤的PSA层压材料与水和任选的碱接触; 其中所述可洗涤PSA层压体包含至少一个面材层，至少一个粘合剂基层和至少一个增粘剂层; 其中所述面材层包括至少一个面材料; 其中所述粘合剂基层包含至少一种粘合剂基础聚合物; 其中所述增粘剂层包含至少一种增粘剂和任选的至少一种粘合剂基础聚合物; 其中所述增粘剂层施加到所述可洗涤PSA层压体的粘合剂基层侧。具体地，提供了用于从瓶中除去可洗涤的PSA层压体的方法，包括使可洗涤的PSA层压材料与水和任选的碱在足以从瓶中除去可洗涤的PSA层压体的温度下接触。

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