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1. 发明授权

US09006296B2 Metal nanoparticle dispersion usable for ejection in the form of fine droplets to be applied in the layered shape 有权
标题翻译：金属纳米粒子分散体可用于以层状形式施加的微小液滴形式的喷射
公开(公告)号：US09006296B2
公开(公告)日：2015-04-14
申请号：US10571507
申请日：2004-09-10
申请人： Daisuke Itoh , Akihito Izumitani , Noriaki Hata , Yorishige Matsuba , Kazuhiro Murata , Hiroshi Yokoyama
发明人： Daisuke Itoh , Akihito Izumitani , Noriaki Hata , Yorishige Matsuba , Kazuhiro Murata , Hiroshi Yokoyama
IPC分类号： B05D1/12 , C09D5/24 , C09D11/52 , C09D17/00 , H01B1/00 , H01B1/02 , H01B1/22 , H05K1/09 , H05K3/12 , B22F9/00
CPC分类号： H05K3/125 , C09D5/24 , C09D17/006 , H01B1/02 , H01B1/22 , H05K2201/0257 , H05K2203/013
摘要： According to the present invention, a metal nanoparticle dispersion suitable to multiple layered coating by jetting in the form of fine droplets is prepared by dispersing metal nanoparticles having an average particle size of 1 to 100 nm in a dispersion solvent having a boiling point of 80° C. or higher in such a manner that the volume percentage of the dispersion solvent is selected in the range of 55 to 80% by volume and the fluid viscosity (20° C.) of the dispersion is chosen in the range of 2 mPa·s to 30 mPa·s, and then when the dispersion is discharged in the form of fine droplets by inkjet method or the like, the dispersion is concentrated by evaporation of the dispersion solvent in the droplets in the course of flight, coming to be a viscous dispersion which can be applicable to multi-layered coating.
摘要翻译：根据本发明，通过将平均粒度为1〜100nm的金属纳米粒子分散在沸点为80℃的分散溶剂中，制备适合于通过以细小液滴的形式喷射的多层涂层的金属纳米粒子分散体 C以上，分散溶剂的体积百分比在55〜80体积％的范围内选择，分散体的流体粘度（20℃）选择在2mPa·s〜 s至30mPa·s，然后当通过喷墨法等将分散体以微小液滴的形式排出时，通过在飞行中蒸发分散溶剂在液滴中浓缩分散体，成为粘性分散体，可应用于多层涂料。

2. 发明申请

US20070098883A1 Metal nanoparticle dispersion usable for ejection in the form of fine droplets to be applied in the layered shape 有权
标题翻译：金属纳米粒子分散体可用于以层状形式施加的微小液滴形式的喷射
公开(公告)号：US20070098883A1
公开(公告)日：2007-05-03
申请号：US10571507
申请日：2004-09-10
申请人： Daisuke Itoh , Akihito Izumitani , Noriaki Hata , Yorishige Matsuba , Kazuhiro Murata , Hiroshi Yokoyama
发明人： Daisuke Itoh , Akihito Izumitani , Noriaki Hata , Yorishige Matsuba , Kazuhiro Murata , Hiroshi Yokoyama
IPC分类号： B05D1/12
CPC分类号： H05K3/125 , C09D5/24 , C09D17/006 , H01B1/02 , H01B1/22 , H05K2201/0257 , H05K2203/013
摘要： The present invention provides a dispersion usable for forming an electroconductive layer having an extremely fine pattern and a high thickness/minimum width ratio in the cross-section, and which has a high fluidity enabling application of inkjet to draw a fine pattern at high accuracy and contains only metal nanoparticles as a conductive medium. According to the present invention, a metal nanoparticle dispersion suitable to multiple layered coating by jetting in the form of fine droplets is prepared by dispersing metal nanoparticles having an average particle size of 1 to 100 nm in a dispersion solvent having a boiling point of 80° C. or higher in such a manner that the volume percentage of the dispersion solvent is selected in the range of 55 to 80% by volume and the fluid viscosity (20° C.) of the dispersion is chosen in the range of 2 mPa·s to 30 mPa·s, and then when the dispersion is discharged in the form of fine droplets by inkjet method or the like, the dispersion is concentrated by evaporation of the dispersion solvent in the droplets in the course of flight, coming to be a viscous dispersion which can be applicable to multi-layered coating.
摘要翻译：本发明提供了一种可用于形成横截面具有极细图案和高厚度/最小宽度比的导电层的分散体，并且具有高流动性，能够应用喷墨以高精度绘制精细图案，仅含有金属纳米粒子作为导电介质。根据本发明，通过将平均粒度为1〜100nm的金属纳米粒子分散在沸点为80℃的分散溶剂中，制备适用于多层涂层的金属纳米粒子分散体， C以上，分散溶剂的体积百分比在55〜80体积％的范围内选择，分散体的流体粘度（20℃）选择在2mPa的范围内。 s至30mPa.s，然后当通过喷墨法等以微细液滴的形式将分散体排出时，通过在飞行中蒸发分散溶剂在液滴中浓缩分散体，成为粘性分散体，可应用于多层涂料。

3. 发明申请

US20060210705A1 Method for forming fine copper particle sintered product type of electric conductor having fine shape, method for forming fine copper wiring and thin copper film using said method 有权
标题翻译：形成细铜颗粒烧结产品的方法，具有精细形状的导电体形成方法，使用所述方法形成细铜布线和薄铜膜的方法
公开(公告)号：US20060210705A1
公开(公告)日：2006-09-21
申请号：US10556871
申请日：2004-05-13
申请人： Daisuke Itoh , Akihito Izumitani , Noriaki Hata , Yorishige Matsuba
发明人： Daisuke Itoh , Akihito Izumitani , Noriaki Hata , Yorishige Matsuba
IPC分类号： C23C26/00 , B05D3/02
CPC分类号： H05K3/1283 , H01B1/22 , H05K3/102 , H05K3/105 , H05K2201/0257 , H05K2203/0315 , H05K2203/1131 , H05K2203/1157 , H05K2203/122
摘要： The present invention provides a process for forming a copper fine particle sintered product type of a fine-shaped electric conductor showing superior electroconductivity, which comprises steps of drawing a fine pattern with the use of a dispersion containing the copper fine particles having a surface oxide film layer, conducting a treatment for reducing the copper fine particles with the surface oxide film layer or copper oxide fine particles included in the pattern at a comparatively low temperature, and baking the resultant copper fine particles. Specifically, the process carries out the processes of; applying a dispersion containing the copper fine particles having the surface oxide film layer thereon or the copper oxide fine particles with an average particle diameter of 10 μm or smaller onto a substrate; and then performing a series of the heat treatment steps of heating the particles in the coated layer at temperature of 350° C. or lower under an atmosphere containing a vapor and a gas of a compound having reducibility to reduce the oxide film by a reduction reaction which used the compound having reducibility as a reducing agent, subsequently repeating a heat treatment combining an oxidizing treatment of a short time with a re-reducing treatment, and sintering the resultant copper fine particles with each other to form a layer of the sintered product.
摘要翻译：本发明提供一种形成具有优异导电性的细微型导电体的铜微粒烧结体型的方法，该方法包括以下步骤：利用含有表面氧化膜的铜微粒的分散体在比较低的温度下进行包含在图案中的表面氧化膜层或氧化铜微粒的铜微粒的还原处理，并烘烤得到的铜微粒。具体来说，该过程执行过程; 将其上具有表面氧化膜层的铜微粒或平均粒径为10μm以下的氧化铜微粒分散在基板上; 然后进行一系列的热处理步骤，在含有还原性的化合物的气体和气体的气氛下，在350℃或更低的温度下加热涂层中的颗粒，以通过还原反应来还原氧化膜其使用具有还原性的化合物作为还原剂，随后重复进行短时间的氧化处理与再还原处理的热处理，并将所得铜微粒彼此烧结以形成烧结产品层。

4. 发明授权

US07820232B2 Method for forming fine copper particle sintered product type of electric conductor having fine shape, and process for forming copper fine wiring and thin copper film by applying said method 有权
标题翻译：用于形成细铜粒微粒烧结产品的细形状导体的方法以及通过应用所述方法形成铜精细布线和薄铜膜的工艺
公开(公告)号：US07820232B2
公开(公告)日：2010-10-26
申请号：US10556871
申请日：2004-05-13
申请人： Daisuke Itoh , Akihito Izumitani , Noriaki Hata , Yorishige Matsuba
发明人： Daisuke Itoh , Akihito Izumitani , Noriaki Hata , Yorishige Matsuba
IPC分类号： C23C26/00 , B05D3/02
CPC分类号： H05K3/1283 , H01B1/22 , H05K3/102 , H05K3/105 , H05K2201/0257 , H05K2203/0315 , H05K2203/1131 , H05K2203/1157 , H05K2203/122
摘要： The present invention provides a process for forming a copper fine particle sintered product type of a fine-shaped electric conductor showing superior electroconductivity, which comprises steps of drawing a fine pattern with the use of a dispersion containing the copper fine particles having a surface oxide film layer, conducting a treatment for reducing the copper fine particles with the surface oxide film layer or copper oxide fine particles included in the pattern at a comparatively low temperature, and baking the resultant copper fine particles. Specifically, the process carries out the processes of; applying a dispersion containing the copper fine particles having the surface oxide film layer thereon or the copper oxide fine particles with an average particle diameter of 10 μm or smaller onto a substrate; and then performing a series of the heat treatment steps of heating the particles in the coated layer at temperature of 350° C. or lower under an atmosphere containing a vapor and a gas of a compound having reducibility to reduce the oxide film by a reduction reaction which used the compound having reducibility as a reducing agent, subsequently repeating a heat treatment combining an oxidizing treatment of a short time with a re-reducing treatment, and sintering the resultant copper fine particles with each other to form a layer of the sintered product.
摘要翻译：本发明提供一种形成具有优异导电性的细微型导电体的铜微粒烧结体型的方法，该方法包括以下步骤：利用含有表面氧化膜的铜微粒的分散体在比较低的温度下进行包含在图案中的表面氧化膜层或氧化铜微粒的铜微粒的还原处理，并烘烤得到的铜微粒。具体来说，该过程执行过程; 将其上具有表面氧化膜层的铜微粒或平均粒径为10μm以下的氧化铜微粒分散在基板上; 然后进行一系列的热处理步骤，在含有还原性的化合物的气体和气体的气氛下，在350℃或更低的温度下加热涂层中的颗粒，以通过还原反应来还原氧化膜其使用具有还原性的化合物作为还原剂，随后重复进行短时间的氧化处理与再还原处理的热处理，并将所得铜微粒彼此烧结以形成烧结产品层。

5. 发明授权

US08758475B2 Fine metal particles and fine metal oxide particles in dry powder form, and use thereof 有权
标题翻译：精细金属颗粒和干粉形式的金属氧化物微粒，及其用途
公开(公告)号：US08758475B2
公开(公告)日：2014-06-24
申请号：US10595440
申请日：2004-10-20
申请人： Daisuke Itoh , Masayuki Ueda , Noriaki Hata , Yorishige Matsuba
发明人： Daisuke Itoh , Masayuki Ueda , Noriaki Hata , Yorishige Matsuba
IPC分类号： B22F1/00 , B22F1/02 , C22C1/05
CPC分类号： B22F1/02 , B22F1/0003 , B22F1/0018 , B22F1/0062 , B22F2998/00 , B82Y30/00 , C01P2004/64 , C01P2006/10 , C04B35/6264 , C04B35/628 , C04B35/62805 , C04B35/62884 , C04B35/632 , C04B2235/40 , C04B2235/407 , C04B2235/5454 , C09C1/62 , C09C1/627 , H05K3/1266 , H05K3/1283 , H05K2203/1131 , H05K2203/1157 , H05K2203/122 , B22F1/0022
摘要： The present invention provides a process for simply and easily producing fine metal particles or fine metal oxide particles in the form of a dry powder which can be used as extremely fine particles in a good dispersion state without causing coagulation for a long time even if not stored in a dispersion solvent. Fine metal particles or fine metal oxide particles in the form of a dry powder are prepared using a dispersion in which fine metal particles or fine oxide metal particles having a surface oxidation film are dispersed in an organic solvent in a stable state, while once covering the particle surface with covering agent molecules containing, at a terminal, a functional group having an oxygen atom, a nitrogen atom, or a sulfur atom as a group capable of forming a coordinative bond with metal, and by removing the dispersion solvent, washing and removing excess covering agent molecules with a polar solvent without damaging the covering agent molecule layer covering the fine particle surface, finally evaporating the polar solvent used for washing and drying.
摘要翻译：本发明提供简单容易地制造干粉末形式的细金属颗粒或金属微细氧化物颗粒的方法，其可以作为非常细的颗粒使用，其分散状态良好，即使不存在也不会长期凝结在分散溶剂中。使用具有表面氧化膜的金属微粒或细氧化物金属粒子分散在有机溶剂中的分散体，以稳定的状态分散在干粉末中的金属微粒或细金属氧化物粒子，一次覆盖在具有含有氧原子，氮原子或硫原子的官能团的末端具有与金属形成配位键的基团的覆盖剂分子的粒子表面，除去分散溶剂，洗涤除去过量的覆盖剂分子与极性溶剂，而不损害覆盖细颗粒表面的覆盖剂分子层，最后蒸发用于洗涤和干燥的极性溶剂。

6. 发明申请

US20070051927A1 Fine metal particles and fine metal oxide particles in dry powder form, and use thereof 有权
标题翻译：精细金属颗粒和干粉形式的金属氧化物微粒，及其用途
公开(公告)号：US20070051927A1
公开(公告)日：2007-03-08
申请号：US10595440
申请日：2004-10-20
申请人： Daisuke Itoh , Masayuki Ueda , Noriaki Hata , Yorishige Matsuba
发明人： Daisuke Itoh , Masayuki Ueda , Noriaki Hata , Yorishige Matsuba
IPC分类号： H01B1/12
CPC分类号： B22F1/02 , B22F1/0003 , B22F1/0018 , B22F1/0062 , B22F2998/00 , B82Y30/00 , C01P2004/64 , C01P2006/10 , C04B35/6264 , C04B35/628 , C04B35/62805 , C04B35/62884 , C04B35/632 , C04B2235/40 , C04B2235/407 , C04B2235/5454 , C09C1/62 , C09C1/627 , H05K3/1266 , H05K3/1283 , H05K2203/1131 , H05K2203/1157 , H05K2203/122 , B22F1/0022
摘要： The present invention provides a process for simply and easily producing fine metal particles or fine metal oxide particles in the form of a dry powder which can be used as extremely fine particles in a good dispersion state without causing coagulation for a long time even if not stored in a dispersion solvent. Fine metal particles or fine metal oxide particles in the form of a dry powder are prepared using a dispersion in which fine metal particles or fine oxide metal particles having a surface oxidation film are dispersed in an organic solvent in a stable state, while once covering the particle surface with covering agent molecules containing, at a terminal, a functional group having an oxygen atom, a nitrogen atom, or a sulfur atom as a group capable of forming a coordinative bond with metal, and by removing the dispersion solvent, washing and removing excess covering agent molecules with a polar solvent without damaging the covering agent molecule layer covering the fine particle surface, finally evaporating the polar solvent used for washing and drying.
摘要翻译：本发明提供简单容易地制造干粉末形式的细金属颗粒或金属微细氧化物颗粒的方法，其可以作为非常细的颗粒使用，其分散状态良好，即使不存在也不会长期凝结在分散溶剂中。使用具有表面氧化膜的金属微粒或细氧化物金属粒子分散在有机溶剂中的分散体，以稳定的状态分散在干粉末中的金属微粒或细金属氧化物粒子，一次覆盖在具有含有氧原子，氮原子或硫原子的官能团的末端具有与金属形成配位键的基团的覆盖剂分子的粒子表面，除去分散溶剂，洗涤除去过量的覆盖剂分子与极性溶剂，而不损害覆盖细颗粒表面的覆盖剂分子层，最后蒸发用于洗涤和干燥的极性溶剂。

7. 发明申请

US20080105853A1 Conductive Metal Paste 有权
标题翻译：导电金属膏
公开(公告)号：US20080105853A1
公开(公告)日：2008-05-08
申请号：US11571249
申请日：2004-06-23
申请人： Masayuki Ueda , Hiroshi Saito , Kazuo Hosoya , Noriaki Hata , Yorishige Matsuba
发明人： Masayuki Ueda , Hiroshi Saito , Kazuo Hosoya , Noriaki Hata , Yorishige Matsuba
IPC分类号： H01B1/02
CPC分类号： H01B1/22 , C08K5/17 , C08K9/04 , Y10S977/773 , Y10T428/29
摘要： The present invention provides a conductive metal paste, available for fabrication of a metal fine particle sintered product layer, which has excellent adhesion to a surface of an underlying substrate such as a glass substrate and also has good conductivity. The conductive metal paste according to the present invention contains, per 100 parts by mass of the metal fine particles whose average particle size is 1 to 100 nm, 10 to 60 parts by mass in total of one or more compounds which are used in a coating molecular layer on a surface of a metal fine particle and which have a group capable of coordinate bonding to a metal element contained in the metal fine particles via a lone pair held by a nitrogen, oxygen, or sulfur atom, and also contains one or more metal compounds which are reduced by heating up to 250° C. or higher to be able to precipitate a metal atom such that a total amount of metals contained in the metal compound is within a range from 0.3 to 7 parts by mass, and further, 100 to 500 parts by mass of an amine-based solvent capable of dissolving the metal compounds blended per 10 parts by mass in total of metals in the metal compounds, wherein all of these components are uniformly dissolved and dispersed in an organic solvent used as a dispersion solvent for the metal fine particles.
摘要翻译：本发明提供一种可用于制造金属微粒烧结产品层的导电金属膏，其对诸如玻璃基底的基底的表面具有优异的粘附性，并且还具有良好的导电性。根据本发明的导电性金属糊剂，相对于平均粒径为1〜100nm的金属微粒100质量份，含有10质量份以上的涂料中使用的1种以上的化合物分子层，并且具有能够通过由氮，氧或硫原子保持的孤立对而与金属微粒中所含的金属元素配位的基团，并且还含有一个或多个金属化合物通过加热至250℃以上而还原，能够沉淀金属原子，使金属化合物中所含金属的总量在0.3〜7质量份的范围内，将金属化合物中的金属总量相对于10质量份共混的能够溶解金属化合物的胺类溶剂100〜500质量份，其中所有这些成分均匀地溶解并分散在有机溶剂中作为金属微粒的分散溶剂。

8. 发明授权

US08021580B2 Conductive metal paste 有权
标题翻译：导电金属膏
公开(公告)号：US08021580B2
公开(公告)日：2011-09-20
申请号：US11571249
申请日：2004-06-23
申请人： Masayuki Ueda , Hiroshi Saito , Kazuo Hosoya , Noriaki Hata , Yorishige Matsuba
发明人： Masayuki Ueda , Hiroshi Saito , Kazuo Hosoya , Noriaki Hata , Yorishige Matsuba
IPC分类号： H01B1/02
CPC分类号： H01B1/22 , C08K5/17 , C08K9/04 , Y10S977/773 , Y10T428/29
摘要： The present invention provides a conductive metal paste, available for fabrication of a metal fine particle sintered product layer, which has excellent adhesion to a surface of an underlying substrate such as a glass substrate and also has good conductivity. The conductive metal paste according to the present invention contains, per 100 parts by mass of the metal fine particles whose average particle size is 1 to 100 nm, 10 to 60 parts by mass in total of one or more compounds which are used in a coating molecular layer on a surface of a metal fine particle and which have a group capable of coordinate bonding to a metal element contained in the metal fine particles via a lone pair held by a nitrogen, oxygen, or sulfur atom, and also contains one or more metal compounds which are reduced by heating up to 250° C. or higher to be able to precipitate a metal atom such that a total amount of metals contained in the metal compound is within a range from 0.3 to 7 parts by mass, and further, 100 to 500 parts by mass of an amine-based solvent capable of dissolving the metal compounds blended per 10 parts by mass in total of metals in the metal compounds, wherein all of these components are uniformly dissolved and dispersed in an organic solvent used as a dispersion solvent for the metal fine particles.
摘要翻译：本发明提供一种可用于制造金属微粒烧结产品层的导电金属膏，其对诸如玻璃基底的基底的表面具有优异的粘附性，并且还具有良好的导电性。根据本发明的导电性金属糊剂，相对于平均粒径为1〜100nm的金属微粒100质量份，含有10质量份以上的涂料中使用的1种以上的化合物分子层，并且具有能够通过由氮，氧或硫原子保持的孤立对而与金属微粒中所含的金属元素配位的基团，并且还含有一个或多个金属化合物通过加热至250℃以上而还原，能够沉淀金属原子，使金属化合物中所含金属的总量在0.3〜7质量份的范围内，将金属化合物中的金属总量相对于10质量份共混的能够溶解金属化合物的胺类溶剂100〜500质量份，其中所有这些成分均匀地溶解并分散在有机溶剂中作为金属微粒的分散溶剂。

9. 发明授权

US07262511B2 Conductive adhesive agent with ultrafine particles 有权
标题翻译：具有超细颗粒的导电粘合剂
公开(公告)号：US07262511B2
公开(公告)日：2007-08-28
申请号：US11206223
申请日：2005-08-18
申请人： Katsuhisa Osako , Naoto Shioi , Daisuke Itoh , Hideyuki Gotoh , Yorishige Matsuba , Kazuki Tateyama , Yasunari Ukita , Masao Segawa , Takuo Kikuchi
发明人： Katsuhisa Osako , Naoto Shioi , Daisuke Itoh , Hideyuki Gotoh , Yorishige Matsuba , Kazuki Tateyama , Yasunari Ukita , Masao Segawa , Takuo Kikuchi
IPC分类号： H01L23/48 , H01L21/00 , H01B1/02
CPC分类号： H01L24/29 , H01L23/3107 , H01L24/73 , H01L24/83 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29313 , H01L2224/29318 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29369 , H01L2224/29384 , H01L2224/32245 , H01L2224/45144 , H01L2224/48095 , H01L2224/48247 , H01L2224/73265 , H01L2224/83192 , H01L2224/83439 , H01L2224/838 , H01L2224/92247 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01016 , H01L2924/01018 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/10253 , H01L2924/12044 , H01L2924/15747 , H01L2924/181 , H05K3/321 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： The present invention provides a conductive adhesive agent capable of being diluted with a solvent to give good coating workability and allowing formation of a conductive joint excellent in both thermal conductivity and electrical conductivity by inhibiting a gas generated when a binder resin is heat-cured after attachment of a part. The conductive adhesive agent according to the present invention is a conductive adhesive agent wherein, based on 100 parts by weight of silver powder having an average particle diameter of micrometers, which is used for a conductive medium, e.g. as a main component, 1 to 10 parts by weight of silver fine particles having an average particle diameter of nanometers is used in combination therewith and 5 to 15 parts by weight of thermosetting resin as a binder resin component and 10 parts or less by weight of solvent for adjustment of a fluid viscosity are blended therein as essential components, and by selection of such a blending ratio, generation of a gas component during heating and curing of the thermosetting resin to prevent formation of voids, and at the same time, fabrication of a conductive joint excellent in thermal conductivity and electrical conductivity is achieved.
摘要翻译：本发明提供一种能够用溶剂稀释以提供良好的涂布加工性的导电粘合剂，并且通过抑制粘合剂树脂在附着后热固化时产生的气体，可以形成导热性和导电性两者优异的导电接头的一部分。根据本发明的导电粘合剂是导电粘合剂，其中基于100重量份的平均粒径为微米的银粉，其用于导电介质，例如，作为主要成分，使用1〜10重量份平均粒径为纳米的银微粒，并配合5〜15重量份作为粘结剂树脂成分的热固性树脂，10重量份以下的作为主要成分配合调节流体粘度的溶剂，通过选择这样的配合比例，在热固性树脂的加热固化期间产生气体成分以防止形成空隙，同时制造实现了导热性和导电性优异的导电接头。

10. 发明申请

US20060038304A1 Conductive adhesive agent and process for manufacturing article using the conductive adhesive agent 有权
标题翻译：导电粘合剂及使用导电粘合剂制造制品的方法
公开(公告)号：US20060038304A1
公开(公告)日：2006-02-23
申请号：US11206223
申请日：2005-08-18
申请人： Katsuhisa Osako , Naoto Shioi , Daisuke Itoh , Hideyuki Gotoh , Yorishige Matsuba , Kazuki Tateyama , Yasunari Ukita , Masao Segawa , Takuo Kikuchi
发明人： Katsuhisa Osako , Naoto Shioi , Daisuke Itoh , Hideyuki Gotoh , Yorishige Matsuba , Kazuki Tateyama , Yasunari Ukita , Masao Segawa , Takuo Kikuchi
IPC分类号： H01L23/29
CPC分类号： H01L24/29 , H01L23/3107 , H01L24/73 , H01L24/83 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29313 , H01L2224/29318 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29369 , H01L2224/29384 , H01L2224/32245 , H01L2224/45144 , H01L2224/48095 , H01L2224/48247 , H01L2224/73265 , H01L2224/83192 , H01L2224/83439 , H01L2224/838 , H01L2224/92247 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01016 , H01L2924/01018 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/10253 , H01L2924/12044 , H01L2924/15747 , H01L2924/181 , H05K3/321 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： The present invention provides a conductive adhesive agent capable of being diluted with a solvent to give good coating workability and allowing formation of a conductive joint excellent in both thermal conductivity and electrical conductivity by inhibiting a gas generated when a binder resin is heat-cured after attachment of a part. The conductive adhesive agent according to the present invention is a conductive adhesive agent wherein, based on 100 parts by weight of silver powder having an average particle diameter of micrometers, which is used for a conductive medium, e.g. as a main component, 1 to 10 parts by weight of silver fine particles having an average particle diameter of nanometers is used in combination therewith and 5 to 15 parts by weight of thermosetting resin as a binder resin component and 10 parts or less by weight of solvent for adjustment of a fluid viscosity are blended therein as essential components, and by selection of such a blending ratio, generation of a gas component during heating and curing of the thermosetting resin to prevent formation of voids, and at the same time, fabrication of a conductive joint excellent in thermal conductivity and electrical conductivity is achieved.
摘要翻译：本发明提供一种能够用溶剂稀释以提供良好的涂布加工性的导电粘合剂，并且通过抑制粘合剂树脂在附着后热固化时产生的气体，可以形成导热性和导电性两者优异的导电接头的一部分。根据本发明的导电粘合剂是导电粘合剂，其中基于100重量份的平均粒径为微米的银粉，其用于导电介质，例如，作为主要成分，使用1〜10重量份平均粒径为纳米的银微粒，并配合5〜15重量份作为粘结剂树脂成分的热固性树脂，10重量份以下的作为主要成分配合调节流体粘度的溶剂，通过选择这样的配合比例，在热固性树脂的加热固化期间产生气体成分以防止形成空隙，同时制造实现了导热性和导电性优异的导电接头。

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