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1. 发明授权

US4112690A Method and construction of underground tank well 失效
标题翻译：地下水箱的方法与施工
公开(公告)号：US4112690A
公开(公告)日：1978-09-12
申请号：US741679
申请日：1976-11-15
申请人： Kazuo Hosoya , Munetaka Kubota
发明人： Kazuo Hosoya , Munetaka Kubota
IPC分类号： E02D31/10 , B65G5/00 , E02D31/02
CPC分类号： E02D31/10
摘要： Subjacent and lateral supporting soil for an underground tank is stabilized wherein a tank embedded therein is secured against flotation irrespective of the water table level of the surrounding soil. The lateral supporting soil is encased within a well and the subjacent soil is hardened to minimize seepage of water into the soil adjacent to the tank. Means are also provided to remove excess water from the confines of the well thereby minimizing flotation pressure on the tank.

2. 发明授权

US08021580B2 Conductive metal paste 有权
标题翻译：导电金属膏
公开(公告)号：US08021580B2
公开(公告)日：2011-09-20
申请号：US11571249
申请日：2004-06-23
申请人： Masayuki Ueda , Hiroshi Saito , Kazuo Hosoya , Noriaki Hata , Yorishige Matsuba
发明人： Masayuki Ueda , Hiroshi Saito , Kazuo Hosoya , Noriaki Hata , Yorishige Matsuba
IPC分类号： H01B1/02
CPC分类号： H01B1/22 , C08K5/17 , C08K9/04 , Y10S977/773 , Y10T428/29
摘要： The present invention provides a conductive metal paste, available for fabrication of a metal fine particle sintered product layer, which has excellent adhesion to a surface of an underlying substrate such as a glass substrate and also has good conductivity. The conductive metal paste according to the present invention contains, per 100 parts by mass of the metal fine particles whose average particle size is 1 to 100 nm, 10 to 60 parts by mass in total of one or more compounds which are used in a coating molecular layer on a surface of a metal fine particle and which have a group capable of coordinate bonding to a metal element contained in the metal fine particles via a lone pair held by a nitrogen, oxygen, or sulfur atom, and also contains one or more metal compounds which are reduced by heating up to 250° C. or higher to be able to precipitate a metal atom such that a total amount of metals contained in the metal compound is within a range from 0.3 to 7 parts by mass, and further, 100 to 500 parts by mass of an amine-based solvent capable of dissolving the metal compounds blended per 10 parts by mass in total of metals in the metal compounds, wherein all of these components are uniformly dissolved and dispersed in an organic solvent used as a dispersion solvent for the metal fine particles.
摘要翻译：本发明提供一种可用于制造金属微粒烧结产品层的导电金属膏，其对诸如玻璃基底的基底的表面具有优异的粘附性，并且还具有良好的导电性。根据本发明的导电性金属糊剂，相对于平均粒径为1〜100nm的金属微粒100质量份，含有10质量份以上的涂料中使用的1种以上的化合物分子层，并且具有能够通过由氮，氧或硫原子保持的孤立对而与金属微粒中所含的金属元素配位的基团，并且还含有一个或多个金属化合物通过加热至250℃以上而还原，能够沉淀金属原子，使金属化合物中所含金属的总量在0.3〜7质量份的范围内，将金属化合物中的金属总量相对于10质量份共混的能够溶解金属化合物的胺类溶剂100〜500质量份，其中所有这些成分均匀地溶解并分散在有机溶剂中作为金属微粒的分散溶剂。

3. 发明申请

US20080105853A1 Conductive Metal Paste 有权
标题翻译：导电金属膏
公开(公告)号：US20080105853A1
公开(公告)日：2008-05-08
申请号：US11571249
申请日：2004-06-23
申请人： Masayuki Ueda , Hiroshi Saito , Kazuo Hosoya , Noriaki Hata , Yorishige Matsuba
发明人： Masayuki Ueda , Hiroshi Saito , Kazuo Hosoya , Noriaki Hata , Yorishige Matsuba
IPC分类号： H01B1/02
CPC分类号： H01B1/22 , C08K5/17 , C08K9/04 , Y10S977/773 , Y10T428/29
摘要： The present invention provides a conductive metal paste, available for fabrication of a metal fine particle sintered product layer, which has excellent adhesion to a surface of an underlying substrate such as a glass substrate and also has good conductivity. The conductive metal paste according to the present invention contains, per 100 parts by mass of the metal fine particles whose average particle size is 1 to 100 nm, 10 to 60 parts by mass in total of one or more compounds which are used in a coating molecular layer on a surface of a metal fine particle and which have a group capable of coordinate bonding to a metal element contained in the metal fine particles via a lone pair held by a nitrogen, oxygen, or sulfur atom, and also contains one or more metal compounds which are reduced by heating up to 250° C. or higher to be able to precipitate a metal atom such that a total amount of metals contained in the metal compound is within a range from 0.3 to 7 parts by mass, and further, 100 to 500 parts by mass of an amine-based solvent capable of dissolving the metal compounds blended per 10 parts by mass in total of metals in the metal compounds, wherein all of these components are uniformly dissolved and dispersed in an organic solvent used as a dispersion solvent for the metal fine particles.
摘要翻译：本发明提供一种可用于制造金属微粒烧结产品层的导电金属膏，其对诸如玻璃基底的基底的表面具有优异的粘附性，并且还具有良好的导电性。根据本发明的导电性金属糊剂，相对于平均粒径为1〜100nm的金属微粒100质量份，含有10质量份以上的涂料中使用的1种以上的化合物分子层，并且具有能够通过由氮，氧或硫原子保持的孤立对而与金属微粒中所含的金属元素配位的基团，并且还含有一个或多个金属化合物通过加热至250℃以上而还原，能够沉淀金属原子，使金属化合物中所含金属的总量在0.3〜7质量份的范围内，将金属化合物中的金属总量相对于10质量份共混的能够溶解金属化合物的胺类溶剂100〜500质量份，其中所有这些成分均匀地溶解并分散在有机溶剂中作为金属微粒的分散溶剂。

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