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1. 发明授权

US08629004B2 Method of manufacturing semiconductor modules and semiconductor module 有权
标题翻译：制造半导体模块和半导体模块的方法
公开(公告)号：US08629004B2
公开(公告)日：2014-01-14
申请号：US13173334
申请日：2011-06-30
申请人： Daisuke Harada , Hiroshi Ishiyama , Takahisa Kaneko , Yoshikazu Suzuki
发明人： Daisuke Harada , Hiroshi Ishiyama , Takahisa Kaneko , Yoshikazu Suzuki
IPC分类号： H01L21/66 , H01L21/00
CPC分类号： H01L23/4334 , H01L23/3107 , H01L23/3672 , H01L23/42 , H01L23/49562 , H01L23/49568 , H01L24/30 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/30181 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73215 , H01L2224/73265 , H01L2924/00014 , H01L2924/1203 , H01L2924/1305 , H01L2924/13054 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor module having an integrated structure is manufactured by mounting a semiconductor chip on the side of a surface of a cooling plate via an insulating material, and by molding the semiconductor chip and the cooling plate by a resin-molded member. This method includes the steps of: (a) forming a sprayed insulating film as the insulating material on a surface of the cooling plate; (b) forming a sprayed conductive film on a face of the sprayed insulating film opposite to a face where the cooling plate is provided; (c) checking whether the sprayed conductive film is insulated from the cooling plate by using the sprayed conductive film and the cooling plate as electrodes and applying voltage therebetween; and (d) mounting the semiconductor chip on the upper side of the sprayed conductive film when the sprayed conductive film is insulated, and then resin-molding the semiconductor chip and the cooling plate.
摘要翻译：具有一体结构的半导体模块通过绝缘材料将半导体芯片安装在冷却板表面的一侧，并通过树脂模制部件模制半导体芯片和冷却板来制造。该方法包括以下步骤：（a）在冷却板的表面上形成作为绝缘材料的喷涂绝缘膜; （b）在与设置有冷却板的面相反的喷涂绝缘膜的表面上形成喷涂的导电膜; （c）通过使用喷涂的导电膜和冷却板作为电极并在其间施加电压来检查喷涂的导电膜是否与冷却板绝缘; 以及（d）当喷涂的导电膜绝缘时，将半导体芯片安装在喷涂导电膜的上侧，然后树脂成型半导体芯片和冷却板。

2. 发明申请

US20090251858A1 Electric power converter and mounting structure of semiconductor device 有权
公开(公告)号：US20090251858A1
公开(公告)日：2009-10-08
申请号：US12457245
申请日：2009-06-04
申请人： Daisuke Harada , Hiroshi Ishiyama
发明人： Daisuke Harada , Hiroshi Ishiyama
IPC分类号： H05K7/20 , H05K7/00
CPC分类号： H02M7/003 , H01L23/4012 , H01L23/473 , H01L25/072 , H01L25/16 , H01L25/18 , H01L2224/32245 , H01L2224/33181 , H01L2924/13055 , H01L2924/00
摘要： An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wiring section connected to a main electrode terminal of the semiconductor module. The main circuit section is interposed between the control circuit substrate section and the power wiring section.

3. 发明授权

US07508668B2 Electric power converter and mounting structure of semiconductor device 有权
标题翻译：电力转换器和半导体器件的安装结构
公开(公告)号：US07508668B2
公开(公告)日：2009-03-24
申请号：US10554998
申请日：2004-08-20
申请人： Daisuke Harada , Hiroshi Ishiyama
发明人： Daisuke Harada , Hiroshi Ishiyama
IPC分类号： H05K7/20
CPC分类号： H02M7/003 , H01L23/4012 , H01L23/473 , H01L25/072 , H01L25/16 , H01L25/18 , H01L2224/32245 , H01L2224/33181 , H01L2924/13055 , H01L2924/00
摘要： An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wiring section connected to a main electrode terminal of the semiconductor module. The main circuit section is interposed between the control circuit substrate section and the power wiring section.
摘要翻译：电力转换器具有包括半导体模块和冷却装置的主电路部分; 电连接到所述半导体模块的信号端子并具有控制电路的控制电路基板部分; 以及与半导体模块的主电极端子连接的电力配线部。主电路部分设置在控制电路基板部分和电力布线部分之间。

4. 发明申请

US20090251859A1 Electronic power converter and mounting structure of semiconductor device 有权
标题翻译：电子功率转换器和半导体器件的安装结构
公开(公告)号：US20090251859A1
公开(公告)日：2009-10-08
申请号：US12457246
申请日：2009-06-04
申请人： Daisuke Harada , Hiroshi Ishiyama
发明人： Daisuke Harada , Hiroshi Ishiyama
IPC分类号： H05K7/20
CPC分类号： H02M7/003 , H01L23/4012 , H01L23/473 , H01L25/072 , H01L25/16 , H01L25/18 , H01L2224/32245 , H01L2224/33181 , H01L2924/13055 , H01L2924/00
摘要： An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wiring section connected to a main electrode terminal of the semiconductor module. The main circuit section is interposed between the control circuit substrate section and the power wiring section.
摘要翻译：电力转换器具有包括半导体模块和冷却装置的主电路部分; 电连接到所述半导体模块的信号端子并具有控制电路的控制电路基板部分; 以及与半导体模块的主电极端子连接的电力配线部。主电路部分设置在控制电路基板部分和电力布线部分之间。

5. 发明申请

US20080164607A1 Electric power converter and mounting structure of semiconductor device 有权
标题翻译：电力转换器和半导体器件的安装结构
公开(公告)号：US20080164607A1
公开(公告)日：2008-07-10
申请号：US12073871
申请日：2008-03-11
申请人： Daisuke Harada , Hiroshi Ishiyama
发明人： Daisuke Harada , Hiroshi Ishiyama
IPC分类号： H01L23/48
CPC分类号： H02M7/003 , H01L23/4012 , H01L23/473 , H01L25/072 , H01L25/16 , H01L25/18 , H01L2224/32245 , H01L2224/33181 , H01L2924/13055 , H01L2924/00
摘要： An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wiring section connected to a main electrode terminal of the semiconductor module. The main circuit section is interposed between the control circuit substrate section and the power wiring section.
摘要翻译：电力转换器具有包括半导体模块和冷却装置的主电路部分; 电连接到所述半导体模块的信号端子并具有控制电路的控制电路基板部分; 以及与半导体模块的主电极端子连接的电力配线部。主电路部分设置在控制电路基板部分和电力布线部分之间。

6. 发明申请

US20060284308A1 Power converter and semiconductor device mounting structure 有权
标题翻译：功率转换器和半导体器件安装结构
公开(公告)号：US20060284308A1
公开(公告)日：2006-12-21
申请号：US10554998
申请日：2004-08-20
申请人： Daisuke Harada , Hiroshi Ishiyama
发明人： Daisuke Harada , Hiroshi Ishiyama
IPC分类号： H01L23/06
CPC分类号： H02M7/003 , H01L23/4012 , H01L23/473 , H01L25/072 , H01L25/16 , H01L25/18 , H01L2224/32245 , H01L2224/33181 , H01L2924/13055 , H01L2924/00
摘要： An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wiring section connected to a main electrode terminal of the semiconductor module. The main circuit section is interposed between the control circuit substrate section and the power wiring section.
摘要翻译：电力转换器具有包括半导体模块和冷却装置的主电路部分; 电连接到所述半导体模块的信号端子并具有控制电路的控制电路基板部分; 以及与半导体模块的主电极端子连接的电力配线部。主电路部分设置在控制电路基板部分和电力布线部分之间。

7. 发明申请

US20100046112A1 STORAGE DEVICE, STORAGE-DEVICE CONTROLLING METHOD, AND CONTROL CIRCUIT FOR STORAGE DEVICE 审中-公开
标题翻译：存储设备，存储设备控制方法和存储设备的控制电路
公开(公告)号：US20100046112A1
公开(公告)日：2010-02-25
申请号：US12483005
申请日：2009-06-11
申请人： Hiroshi Ishiyama
发明人： Hiroshi Ishiyama
IPC分类号： G11B33/14
CPC分类号： G11B25/043 , G11B5/5565 , G11B19/046
摘要： A storage device includes: a head that reads and writes data stored in a storage medium; an arm that holds the head; a voice coil motor formed of a coil and a magnet, the voice coil motor that lets a current flow through the coil to move the arm; a disk enclosure that accommodates the storage medium, the head, the arm, and the voice coil motor; a temperature sensor that detects a temperature in the disk enclosure; and a controller that determines an amount of current flowing through the coil for moving the head to a target position on the storage medium and estimates a temperature of the coil from the amount of current flowing through the coil, the temperature in the disk enclosure detected by the temperature sensor, and a predetermined value.
摘要翻译：存储装置包括：读取和写入存储在存储介质中的数据的头; 拿着头的手臂由线圈和磁体构成的音圈电动机，所述音圈电动机使电流流过线圈以移动臂; 容纳存储介质，磁头，臂和音圈电机的磁盘盒; 温度传感器，其检测盘盒中的温度; 以及控制器，其确定流过线圈的电流量，用于将磁头移动到存储介质上的目标位置，并根据流过线圈的电流量来估计线圈的温度，磁盘外壳中的温度由温度传感器和预定值。

8. 发明授权

US07400472B2 Head suspension assembly having flexible printed wiring board with alignment void arrangement 失效
标题翻译：头部悬挂组件，具有带对准空隙布置的柔性印刷线路板
公开(公告)号：US07400472B2
公开(公告)日：2008-07-15
申请号：US11504489
申请日：2006-08-15
申请人： Yukihiro Komura , Mitsuhiro Izumi , Hiroshi Ishiyama
发明人： Yukihiro Komura , Mitsuhiro Izumi , Hiroshi Ishiyama
IPC分类号： G11B5/48
CPC分类号： G11B5/486 , G11B5/4846 , H05K3/363 , H05K2201/058 , H05K2201/09145 , H05K2203/167
摘要： A guide pin is set in common in first and second voids defined in the peripheries of first and second flexible printed wiring boards. The second void has the shape identical to the shape of the first void. When the guide pin rotates around a rotation axis so as to bring the guide pin in contact with the peripheries of the first and second flexible printed wiring boards inside the first and second voids, the first and second flexible printed wiring boards can be arranged. This leads to arrangement of the first and second flexible printed wiring boards at a time in a facilitated manner.
摘要翻译：在第一和第二柔性印刷线路板的周边限定的第一和第二空隙中，引导销共同设置。第二空隙具有与第一空隙的形状相同的形状。当引导销围绕旋转轴线旋转以使引导销与第一和第二柔性印刷线路板的周边接触在第一和第二空隙内部时，可布置第一和第二柔性印刷线路板。这导致了以便利的方式一次布置第一和第二柔性印刷线路板。

9. 发明授权

US07015578B2 Semiconductor unit with cooling system 有权
标题翻译：具有冷却系统的半导体单元
公开(公告)号：US07015578B2
公开(公告)日：2006-03-21
申请号：US10853247
申请日：2004-05-26
申请人： Shigenobu Nakamura , Hiroshi Ishiyama , Yasuyuki Sakai
发明人： Shigenobu Nakamura , Hiroshi Ishiyama , Yasuyuki Sakai
IPC分类号： H01L23/34
CPC分类号： H01L25/112 , H01L23/4334 , H01L23/473 , H01L24/40 , H01L24/48 , H01L24/73 , H01L2224/05599 , H01L2224/40137 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/73221 , H01L2224/83801 , H01L2224/84801 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01059 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/37099
摘要： A semiconductor unit has semiconductor modules and cooling members. The semiconductor module includes power devices with a flat shape, the first electrode bonded to the first device surface, the second electrode bonded to the second device surface, the first terminals connecting to a device control circuit, the second terminals connecting to a device driving circuit, and mold resin unifying the devices, the first electrode, the second electrode, the first terminals, and the second terminals in a unit. The mold resin is so formed that the first electrode face and second electrode face are exposed. The cooling members sandwich the semiconductor modules through insulating members. The semiconductor unit has the first electrode face of the first electrode coplanar with the first resin face of the mold resin, and/or the second electrode face of the second electrode coplanar with the second resin face of the mold resin.
摘要翻译：半导体单元具有半导体模块和冷却构件。半导体模块包括具有平坦形状的功率器件，第一电极接合到第一器件表面，第二电极接合到第二器件表面，第一端子连接到器件控制电路，第二端子连接到器件驱动电路和模制树脂以单元统一装置，第一电极，第二电极，第一端子和第二端子。模制树脂被形成为使第一电极面和第二电极面露出。冷却构件通过绝缘构件夹持半导体模块。半导体单元具有与模具树脂的第一树脂面共面的第一电极的第一电极面和/或第二电极的第二电极面与模制树脂的第二树脂面共面。

10. 发明授权

US07724523B2 Electric power converter and mounting structure of semiconductor device 有权
公开(公告)号：US07724523B2
公开(公告)日：2010-05-25
申请号：US12073871
申请日：2008-03-11
申请人： Hiroshi Ishiyama
发明人： Hiroshi Ishiyama
IPC分类号： H05K7/20 , H01L23/06
CPC分类号： H02M7/003 , H01L23/4012 , H01L23/473 , H01L25/072 , H01L25/16 , H01L25/18 , H01L2224/32245 , H01L2224/33181 , H01L2924/13055 , H01L2924/00
摘要： An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wiring section connected to a main electrode terminal of the semiconductor module. The main circuit section is interposed between the control circuit substrate section and the power wiring section.

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