专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20100289141A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20100289141A1
公开(公告)日：2010-11-18
申请号：US12776070
申请日：2010-05-07
申请人： Hiromasa Takeda , Satoshi Isa , Mitsuaki Katagiri , Dai Sasaki
发明人： Hiromasa Takeda , Satoshi Isa , Mitsuaki Katagiri , Dai Sasaki
IPC分类号： H01L23/498
CPC分类号： H01L24/85 , H01L23/13 , H01L23/49838 , H01L23/50 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/05554 , H01L2224/2919 , H01L2224/32225 , H01L2224/48091 , H01L2224/4824 , H01L2224/49173 , H01L2224/73215 , H01L2224/85 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01033 , H01L2924/014 , H01L2924/15311 , H01L2924/181 , H01L2924/3011 , H01L2924/00012 , H01L2224/49171 , H01L2224/45099 , H01L2924/00 , H01L2224/05599
摘要： Provided is a semiconductor device with a semiconductor chip mounted on a small-sized package substrate that has a large number of external connection terminals. The package substrate includes a slot, the external connection terminals, and bonding fingers. The bonding fingers are connected to the external connection terminals. The bonding fingers constitute a bonding finger arrangement in a central section and end sections of a bonding finger area along each longer side of the slot. The bonding finger arrangement includes a first bonding finger array, which is located at a close distance from the each longer side of the slot, and a second bonding finger array, which is located at a distance farther than the distance of the first bonding finger array from the each longer side of the slot. The central section of the bonding finger area includes at least the second bonding finger array, and the end sections of the bonding finger area includes the first bonding finger array.
摘要翻译：提供一种具有安装在具有大量外部连接端子的小尺寸封装基板上的半导体芯片的半导体器件。封装基板包括槽，外部连接端子和接合指。接合指状物连接到外部连接端子。接合手指构成沿着槽的每个较长侧的中心部分和接合手指区域的端部部分的接合手指装置。接合手指装置包括位于距离槽的每个较长侧较近的距离处的第一粘结手指阵列和位于比第一粘结手指阵列的距离更远的距离处的第二粘结手指阵列从插槽的每个更长的一边。接合手指区域的中心部分至少包括第二结合手指阵列，并且键合区域的端部部分包括第一粘结手指阵列。

2. 发明授权

US07566874B2 Infrared sensor and its manufacturing method 有权
标题翻译：红外传感器及其制造方法
公开(公告)号：US07566874B2
公开(公告)日：2009-07-28
申请号：US11937261
申请日：2007-11-08
申请人： Koji Hayashi , Dai Sasaki
发明人： Koji Hayashi , Dai Sasaki
IPC分类号： G01J5/00
CPC分类号： G01J5/04 , G01J1/02 , G01J1/0271 , G01J5/02 , G01J5/0285 , G01J5/045 , G01J5/046 , G01J5/08 , G01J5/0862 , G01J5/0875 , G01J2001/0276 , H01L31/0203 , H01L2224/48091 , H01L2924/00014
摘要： An infrared sensor has a groove formed at a peripheral portion of an optical filter in a region opposed to a circumferential region of an opening of a package so as to be continuously located in the peripheral portion of the optical filter. The optical filter has a resistance of about 1 MΩ/cm or less. The package is mainly composed of a metal material. A conductive adhesive is used as an adhesive for joining the optical filter to the package. In a case where the optical filter has a filter body and a thin film made of an insulating material and provided on a surface of the filter body, the groove is formed to have a depth extending from the surface provided with the thin film made of the insulating material to the filter body.
摘要翻译：红外线传感器具有形成在与滤光器的开口的周向区域相对的区域中的滤光器的周边部分处的凹槽，以便连续地位于滤光器的周边部分。滤光器的电阻约为1MΩ/ cm以下。包装主要由金属材料组成。使用导电粘合剂作为用于将滤光器连接到包装的粘合剂。在滤光器具有过滤器本体和由绝缘材料制成并设置在过滤体的表面上的薄膜的情况下，凹槽形成为具有从设置有薄膜的薄膜的表面延伸的深度绝缘材料到过滤体。

3. 发明申请

US20070002597A1 AC adapter 失效
标题翻译： AC适配器
公开(公告)号：US20070002597A1
公开(公告)日：2007-01-04
申请号：US11408523
申请日：2006-04-21
申请人： Terutomo Kajiwara , Dai Sasaki , Shuji Wakafuji
发明人： Terutomo Kajiwara , Dai Sasaki , Shuji Wakafuji
IPC分类号： H02M7/62
CPC分类号： H05K9/0045 , H05K5/0252 , H05K7/20418 , H05K9/0058
摘要： An AC adapter includes: a synthetic resin case; a switching regulator circuit assembly having an AC input terminal and a DC output terminal, the switching regulator circuit assembly being housed in the synthetic resin case; a synthetic resin name plate; and a metallic sheet for heat radiation separate from the resin name plate. The metallic sheet is attached to a surface of the case except for a portion for the AC input terminal.
摘要翻译： AC适配器包括：合成树脂外壳; 具有AC输入端子和DC输出端子的开关调节器电路组件，所述开关调节器电路组件容纳在所述合成树脂壳体中; 合成树脂名牌; 和用于散热的金属片与树脂铭牌分开。除了用于AC输入端子的部分之外，金属片附接到壳体的表面。

4. 发明授权

US06816975B1 Status display for temperature regulation of processing unit using LEDs of different color 有权
标题翻译：使用不同颜色的LED的处理单元的温度调节状态显示
公开(公告)号：US06816975B1
公开(公告)日：2004-11-09
申请号：US09656652
申请日：2000-09-07
申请人： Dai Sasaki , Toru Akazawa
发明人： Dai Sasaki , Toru Akazawa
IPC分类号： G06F126
CPC分类号： G06F1/184 , G06F1/181 , G06F1/188 , G06F1/20 , G06F1/206 , G06F1/26
摘要： An electronic device has a temperature sensor that detects temperature of a CPU, an image processing unit, and a microprocessor unit that controls the supply of electric power from a power source unit to the CPU and the image processing unit according to the temperature detected by the temperature sensor. If the temperature of the CPU and/or the image processing unit is detected by the temperature sensor to be near the temperature that causes malfunction or damage to them, the supply of electric power to the CPU and the image processing unit is automatically stopped by the microprocessor unit. It is possible to prevent malfunction and damage of the CPU and the image processing unit and to easily prevent the occurrence of runaway programs, etc.
摘要翻译：电子设备具有温度传感器，其检测CPU，图像处理单元和微处理器单元的温度，所述温度传感器根据由所述电源单元检测到的温度来控制从电源单元向CPU和图像处理单元供电的微处理器单元温度感应器。如果CPU和/或图像处理单元的温度被温度传感器检测到接近导致其故障或损坏的温度，则CPU和图像处理单元的电力供应被自动停止微处理器单元。可以防止CPU和图像处理单元的故障和损坏，并且容易地防止发生失控程序等。

5. 发明授权

US08467194B2 AC adapter 有权
标题翻译： AC适配器
公开(公告)号：US08467194B2
公开(公告)日：2013-06-18
申请号：US13027634
申请日：2011-02-15
申请人： Dai Sasaki , Taisuke Koga
发明人： Dai Sasaki , Taisuke Koga
IPC分类号： H05K1/11 , H05K1/14
CPC分类号： H01R12/52 , H01R12/724
摘要： An AC adapter including an electronic device, a first circuit board on which the electronic device is mounted, a second circuit board separated from the first circuit board, a connector mounted on the second circuit board and electrically connected to the second circuit board, first and second metal wirings that electrically connect the first and the second circuit boards, and an insulation case installing the first circuit board, the electronic device, the second circuit board, and the connector therein and including a projecting part interposed between the first and second metal wirings.
摘要翻译：一种AC适配器，包括电子设备，安装有电子设备的第一电路板，与第一电路板分离的第二电路板，安装在第二电路板上并电连接到第二电路板的连接器，第一和电连接第一和第二电路板的第二金属布线，以及将第一电路板，电子设备，第二电路板和连接器安装在其中的绝缘壳体，包括插入在第一和第二金属布线之间的突出部分。

6. 发明授权

US08237251B2 Semiconductor device including semiconductor chips with different thickness 有权
标题翻译：包括具有不同厚度的半导体芯片的半导体器件
公开(公告)号：US08237251B2
公开(公告)日：2012-08-07
申请号：US12357895
申请日：2009-01-22
申请人： Mitsuaki Katagiri , Hisashi Tanie , Jun Kayamori , Dai Sasaki , Hiroshi Moriya
发明人： Mitsuaki Katagiri , Hisashi Tanie , Jun Kayamori , Dai Sasaki , Hiroshi Moriya
IPC分类号： H01L23/02 , H01L23/485 , H01L25/10
CPC分类号： H01L25/105 , H01L23/3128 , H01L24/29 , H01L24/32 , H01L24/50 , H01L24/86 , H01L25/0657 , H01L2224/29101 , H01L2224/29191 , H01L2225/0652 , H01L2225/06555 , H01L2225/06579 , H01L2225/1023 , H01L2225/1058 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/15311 , H01L2924/15331 , H01L2924/30105 , H01L2924/3511 , H01L2924/00
摘要： In a stacked-type semiconductor device, a first semiconductor device and at least one second semiconductor device are stacked. The first semiconductor device includes a wiring board and a first semiconductor chip mounted on the wiring board. The second semiconductor device includes a wiring board and a second semiconductor chip mounted on the wiring board. The thickness of the second semiconductor chip of each second semiconductor device is thicker than the thickness of the first semiconductor chip.
摘要翻译：在层叠型半导体器件中，堆叠第一半导体器件和至少一个第二半导体器件。第一半导体器件包括布线板和安装在布线板上的第一半导体芯片。第二半导体器件包括布线板和安装在布线板上的第二半导体芯片。每个第二半导体器件的第二半导体芯片的厚度比第一半导体芯片的厚度厚。

7. 发明授权

US08063476B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US08063476B2
公开(公告)日：2011-11-22
申请号：US12327649
申请日：2008-12-03
申请人： Kazutaka Koshiishi , Mitsuaki Katagiri , Satoshi Isa , Dai Sasaki
发明人： Kazutaka Koshiishi , Mitsuaki Katagiri , Satoshi Isa , Dai Sasaki
IPC分类号： H01L23/02
CPC分类号： H01L23/3135 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/03 , H01L2224/06135 , H01L2224/06136 , H01L2224/32145 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48011 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/484 , H01L2224/48599 , H01L2224/48699 , H01L2224/49 , H01L2224/73215 , H01L2224/73265 , H01L2225/06562 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/00012 , H01L2224/32225 , H01L2224/85399 , H01L2224/05599
摘要： A semiconductor device includes a substrate having bumps on the backside thereof, a first semiconductor chip mounted on the surface of the substrate, a second semiconductor chip mounted on the first semiconductor chip above the surface of the substrate, a first bonding wire having a length L1 for connecting the first semiconductor chip to the substrate, a second bonding wire having a length L2 (where L2>L1) for connecting the second semiconductor chip to the substrate, a first resin seal having a dielectric constant ∈1 for sealing the first bonding wire, and a second resin seal having a dielectric constant ∈2 (where ∈2
摘要翻译：半导体器件包括其背面具有凸块的衬底，安装在衬底表面上的第一半导体芯片，安装在衬底表面上的第一半导体芯片上的第二半导体芯片，具有长度L1 用于将第一半导体芯片连接到基板的第二接合线，具有用于将第二半导体芯片连接到基板的长度L2（其中L2> L1）的第二接合线，具有介电常数ε1的第一树脂密封件，用于密封第一接合线以及用于密封第二接合线的介电常数ε2（其中∈2<∈1）的第二树脂密封。长度L1和L2之间的关系以及介电常数∈1和∈2由∈1=∈2（L2 / L1）2的方程定义。

8. 发明授权

US07949872B2 Battery and authentication requesting device 有权
标题翻译：电池和认证请求设备
公开(公告)号：US07949872B2
公开(公告)日：2011-05-24
申请号：US12570833
申请日：2009-09-30
申请人： Dai Sasaki , Shiho Moriai
发明人： Dai Sasaki , Shiho Moriai
IPC分类号： H04L9/00
CPC分类号： H04L9/3273 , H02J7/0011
摘要： An authentication requesting device which includes a battery connecting section to be connected to a battery and a receiving section to be supplied with power from an external power source when connected to the external power source, and executes an authentication process for authenticating a battery connected to the battery connecting section, where the authentication requesting device is arranged to change the authentication process depending on whether or not the receiving section is being supplied with power from the external power source.
摘要翻译：一种认证请求装置，其包括要连接到电池的电池连接部分和连接到外部电源时从外部电源供电的接收部分，并且执行用于认证连接到外部电源的电池的认证处理电池连接部，其中认证请求装置被布置为根据接收部分是否从外部电源提供电力来改变认证处理。

9. 发明申请

US20060119316A1 Battery pack, charging control method, and application device 有权
公开(公告)号：US20060119316A1
公开(公告)日：2006-06-08
申请号：US11291133
申请日：2005-11-30
申请人： Taichi Sasaki , Masahiko Hayakawa , Dai Sasaki
发明人： Taichi Sasaki , Masahiko Hayakawa , Dai Sasaki
IPC分类号： H02J7/00
CPC分类号： H02J7/0004 , H01M10/425 , H01M10/44 , H02J7/0029 , H02J2007/0098
摘要： A battery pack having a secondary battery and a circuit that controls charging and discharging of the secondary battery is provided. The battery pack has a computer that communicates with another computer disposed in a charging device, authenticate the charging device, and calculates remaining capacity information of the secondary battery. When the computer has not successfully authenticated the charging device and has detected that the secondary battery has been charged in a predetermined manner, the computer forcibly sets the remaining capacity information to “no remaining capacity”.

10. 发明授权

US06587337B2 Control method of cooling fan, and information processing device 有权
公开(公告)号：US06587337B2
公开(公告)日：2003-07-01
申请号：US10002960
申请日：2001-10-25
申请人： Dai Sasaki
发明人： Dai Sasaki
IPC分类号： H05K500
CPC分类号： G06F1/206 , G06F1/20
摘要： A voltage supplied to a cooling fan 305 is adjusted in accordance with a temperature measured near a central processing unit 401. At this time, different tables of temperatures and supplied voltages are referred to depending upon whether or not an external memory device is mounted, whereby suitable control of the cooling fan 305 is performed in accordance with an attaching-detaching state of the external memory device in an information processing device that permits internal mounting of the external memory device.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式